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    • 3. 发明授权
    • Segmented scan chains with dynamic reconfigurations
    • 具有动态重新配置的分段扫描链
    • US07139950B2
    • 2006-11-21
    • US10707957
    • 2004-01-28
    • Leendert M. HuismanLeah M. P. Pastel
    • Leendert M. HuismanLeah M. P. Pastel
    • G01R31/28G06F17/50
    • G01R31/318536
    • A method is disclosed of diagnosing defects in scan chains by statically and dynamically segmenting and reconfiguring the scan chains. A plurality of serially extending scan chains are partitioned into a plurality of serially arranged equal length segments such that each serially extending scan chain comprises a plurality of serially extending segments. A plurality of multiplexors are positioned between the plurality of segments of each scan chain, and are controlled and utilized to connect each segment of the scan chain to the next serial segment in the same scan chain, or to connect each segment of the scan chain to the next serial segment in a lateral adjacent scan chain. Scan in data patterns are introduced into the plurality of serially extending scan chains. Particular defective segments of the plurality of serially extending scan chains are identified by controlling the multiplexors to connect and shift the data pattern out of each segment of a scan chain serially to the next serial segment in the same scan chain, or to connect and shift the data pattern out of each segment of the scan chain to the next serial segment in an adjacent lateral scan chain, with a sequence of serial shifts and serial-lateral shifts being selected to identify particular defective segments of the plurality of serially extending scan chains.
    • 公开了通过静态和动态地分割和重新配置扫描链来诊断扫描链中的缺陷的方法。 多个串联延伸的扫描链被分割成多个串联布置的等长段,使得每个连续延伸的扫描链包括多个串联延伸段。 多个多路复用器位于每个扫描链的多个段之间,并且被控制并用于将扫描链的每个段连接到相同扫描链中的下一个串行段,或将扫描链的每个段连接到 横向相邻扫描链中的下一个串行段。 扫描数据模式被引入到多个连续延伸的扫描链中。 通过控制多路复用器将扫描链的每个段中的数据模式串联连接并移动到同一扫描链中的下一个串行段来识别多个串行延伸扫描链中的特定缺陷段,或者将数据模式连接和移位 扫描链的每个段中的数据模式到相邻横向扫描链中的下一个串行段,其中选择串行移位和串行 - 横向移位序列以识别多个连续延伸扫描链中的特定缺陷段。
    • 6. 发明授权
    • Sensor differentiated fault isolation
    • 传感器差分故障隔离
    • US07202689B2
    • 2007-04-10
    • US10907787
    • 2005-04-15
    • Kevin L. CondonTheodore M. LevinLeah M. P. PastelDavid P. Vallett
    • Kevin L. CondonTheodore M. LevinLeah M. P. PastelDavid P. Vallett
    • G01R31/02
    • G01R31/311G01R31/302G01R31/31728G01R31/3187
    • Disclosed is an apparatus and method for diagnostically testing circuitry within a device. The apparatus and method incorporate the use of energy (e.g., light, heat, magnetic, electric, etc.) applied directly to any location on the device that can affect the electrical activity within the circuitry being tested in order to produce an indicator of a response. A local sensor (e.g., photonic, magnetic, etc.) is positioned at another location on the device where the sensor can detect the indicator of the response within the circuitry. A correlator is configured with response location correlation software and/or circuit tracing software so that when the indicator is detected, the correlator can determine the exact location of a response causing a device failure and/or trace the connectivity of the circuitry, based upon the location of the energy source and the location of the sensor.
    • 公开了一种用于诊断测试设备内的电路的装置和方法。 该装置和方法包括直接应用于设备上可能影响被测电路内的电活动的任何位置的能量(例如光,热,磁,电等)的使用,以便产生一个 响应。 本地传感器(例如,光子,磁性等)位于设备上的另一位置处,其中传感器可以检测电路内的响应的指示符。 相关器配置有响应位置相关软件和/或电路跟踪软件,使得当检测到指示符时,相关器可基于导致设备故障的确定位置和/或跟踪电路的连通性来确定电路的连接性 能源的位置和传感器的位置。
    • 7. 发明授权
    • Random personalization of chips during fabrication
    • 制造期间芯片的随机个性化
    • US08015514B2
    • 2011-09-06
    • US12344725
    • 2008-12-29
    • Mark D. JaffeStephen A. MongeonLeah M. P. PastelJed H. Rankin
    • Mark D. JaffeStephen A. MongeonLeah M. P. PastelJed H. Rankin
    • G06F17/50
    • G06F17/5068G06F2217/66H01L22/20H01L2924/0002H01L2924/00
    • Disclosed are embodiments of a method for randomly personalizing chips during fabrication, a personalized chip structure and a design structure for such a personalized chip structure. The embodiments use electronic device design and manufacturing processes to randomly or pseudo-randomly create a specific variation in one or more instances of a particular electronic device formed on each chip. The device design and manufacturing processes are tuned so that the specific variation occurs with some predetermined probability, resulting in a desired hardware distribution and personalizing each chip. The resulting personalized chips can be used for modal distribution of chips. For example, chips can be personalized to allow sorting when a single chip design can be used to support multiple applications. The resulting personalized chips can also be used for random number generation for creating unique on-chip identifiers, private keys, etc.
    • 公开了用于在制造期间随机个性化芯片的方法的实施例,个性化芯片结构和用于这种个性化芯片结构的设计结构。 实施例使用电子设备设计和制造过程来随机地或伪随机地在每个芯片上形成的特定电子设备的一个或多个实例中创建特定变化。 调整设备设计和制造过程,使得特定变化以某种预定概率发生,从而产生期望的硬件分布和个性化每个芯片。 所得到的个性化芯片可用于芯片的模态分配。 例如,当单芯片设计可用于支持多种应用时,芯片可以被个性化以允许排序。 所产生的个性化芯片也可以用于随机数生成,用于创建唯一的片上标识符,私钥等。
    • 9. 发明授权
    • Bit failure signature identification
    • 位故障签名识别
    • US08451018B2
    • 2013-05-28
    • US12706228
    • 2010-02-16
    • Thomas D. FurlandRobert J. Milne, Jr.Leah M. P. PastelKevin W. StanleyRobert C. Virun
    • Thomas D. FurlandRobert J. Milne, Jr.Leah M. P. PastelKevin W. StanleyRobert C. Virun
    • G01R31/26
    • G01R31/31703G01R31/31935
    • A method, system, and program product for identifying at least one bit failure among a plurality of semiconductor chips are provided. A first aspect of the invention provides a method of identifying at least one bit failure signature among a plurality of semiconductor chips, the method comprising: counting failures of each failing bit among the plurality of semiconductor chips; determining a most commonly failing bit (MCFB) among the failing bits; establishing a bit failure signature including the MCFB; counting failures of each failing bit on semiconductor chips on which the MCFB fails; determining a next most commonly failing bit (NMCFB) among the failing bits on semiconductor chips on which the MCFB fails; determining whether the NMCFB tends to fail when the MCFB fails; and in response to a determination that the NMCFB tends to fail when the MCFB fails, adding the NMCFB to the bit failure signature.
    • 提供了用于识别多个半导体芯片中的至少一个位故障的方法,系统和程序产品。 本发明的第一方面提供了一种识别多个半导体芯片中的至少一个位故障签名的方法,所述方法包括:对所述多个半导体芯片中的每个故障位进行计数故障; 确定故障位中最常见的故障位(MCFB); 建立包括MCFB在内的位故障签名; 在MCFB故障的半导体芯片上的每个故障位的计数失败; 确定在MCFB故障的半导体芯片上的故障位中的下一个最常故障位(NMCFB); 确定当MCFB发生故障时,NMCFB是否会失败; 并且响应于当MCFB失败时NMCFB趋向于失败的确定,将NMCFB添加到位故障签名。