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    • 6. 发明授权
    • Methods of operating a nanoprober to electrically probe a device structure of an integrated circuit
    • 操作纳米光栅以电探测集成电路的器件结构的方法
    • US08536526B2
    • 2013-09-17
    • US12344651
    • 2008-12-29
    • Paul D. BellMark E. MastersDavid S. Patrick
    • Paul D. BellMark E. MastersDavid S. Patrick
    • G01N23/00
    • H01J37/268G01R31/307H01J37/265H01J2237/043H01J2237/24564H01J2237/24592
    • Methods for nanoprobing a device structure of an integrated circuit. The method may include scanning a primary charged particle beam across a first region of the device structure with at least one probe proximate to the first region and a second region of the device structure is masked from the primary charged particle beam. The method may further include collecting secondary electrons emitted from the first region of the device structure and the at least one probe to form a secondary electron image. The secondary electron image includes the first region and the at least one probe as imaged portions and the second region as a non-imaged portion. Alternatively, the second region may be scanned by the charged particle beam at a faster scan rate than the first region so that the second region is also an imaged portion of the secondary electron image.
    • 用于纳米结构的集成电路的器件结构的方法。 该方法可以包括利用靠近第一区域的至少一个探针扫描穿过器件结构的第一区域的初级带电粒子束,并且器件结构的第二区域被从初级带电粒子束掩蔽。 该方法还可以包括收集从器件结构的第一区域发射的二次电子和至少一个探针以形成二次电子图像。 二次电子图像包括作为成像部分的第一区域和至少一个探针,以及作为非成像部分的第二区域。 或者,第二区域可以以比第一区域更快的扫描速率被带电粒子束扫描,使得第二区域也是二次电子图像的成像部分。
    • 10. 发明授权
    • Canary device for failure analysis
    • 金丝雀装置进行故障分析
    • US07089138B1
    • 2006-08-08
    • US10906590
    • 2005-02-25
    • Pierre J. BouchardMark C. HakeyMark E. MastersLeah M. P. PastelJames A. SlinkmanDavid P. Vallett
    • Pierre J. BouchardMark C. HakeyMark E. MastersLeah M. P. PastelJames A. SlinkmanDavid P. Vallett
    • G06F11/00
    • G01R31/2856G01R31/2831G01R31/318511G01R31/3187
    • A diagnostic system and method for testing an integrated circuit during fabrication thereof. The diagnostic system has at least one integrated circuit chip that has an electrical signature associated with it; a sacrificial circuit that is adjacent to the integrated circuit chip and has a known electrical signature associated with it and intentionally mis-designed circuitry; and a comparator adapted to compare the electrical signature of the integrated circuit chip with the known electrical signature of the sacrificial circuit, wherein a match in the electrical signature of the integrated circuit chip with the known electrical signature of the sacrificial circuit indicates that the integrated circuit chip is mis-designed. The diagnostic system further includes a semiconductor wafer that has a plurality of integrated circuit chips and a kerf area separating one integrated circuit chip from another integrated circuit chip. A mis-designed integrated circuit chip has abnormally functioning circuitry.
    • 一种在其制造期间测试集成电路的诊断系统和方法。 诊断系统具有至少一个具有与其相关联的电特征的集成电路芯片; 牺牲电路,其与集成电路芯片相邻并且具有与其相关联的已知电气签名和故意错误设计的电路; 以及比较器,用于将集成电路芯片的电特征与牺牲电路的已知电特征进行比较,其中集成电路芯片的电特征中与牺牲电路的已知电气签名的匹配指示集成电路 芯片设计错误。 诊断系统还包括具有多个集成电路芯片的半导体晶片和将一个集成电路芯片与另一个集成电路芯片分离的切口区域。 错误设计的集成电路芯片具有异常功能的电路。