专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06507527B1 Memory line discharge before sensing 有权
标题翻译：感应前存储线放电
公开(公告)号：US06507527B1
公开(公告)日：2003-01-14
申请号：US09698614
申请日：2000-10-27
申请人： Lee Cleveland , Jin-Lien Lin , Takao Akaogi , Ali Al-Shamma , Boon Tang Teh , Kendra Nguyen , Yong Kim
发明人： Lee Cleveland , Jin-Lien Lin , Takao Akaogi , Ali Al-Shamma , Boon Tang Teh , Kendra Nguyen , Yong Kim
IPC分类号： G11C700
CPC分类号： G11C7/06 , G11C7/12
摘要： A method of charging a data line to a desired voltage level prior to the data line being sensed in a low power memory device by discharging the data line from a voltage level above the desired voltage level to approximately the desired voltage level. By using N-type transistors to discharge the data line to the desired voltage level, the voltage level can be reached faster with cheaper components.
摘要翻译：一种通过将数据线从高于期望电压电平的电压电平放电到大约期望的电压电平，在数据线在低功率存储器件中被感测之前将数据线充电到期望的电压电平的方法。通过使用N型晶体管将数据线放电至期望的电压电平，可以用更便宜的组件更快地达到电压电平。

2. 发明授权

US06347052B1 Word line decoding architecture in a flash memory 有权
标题翻译：字线解码架构在闪存中
公开(公告)号：US06347052B1
公开(公告)日：2002-02-12
申请号：US09690554
申请日：2000-10-17
申请人： Takao Akaogi , Ali K. Al-Shamma , Lee Cleveland , Yong Kim , Jin-Lien Lin , Kendra Nguyen , Boon Tang Teh
发明人： Takao Akaogi , Ali K. Al-Shamma , Lee Cleveland , Yong Kim , Jin-Lien Lin , Kendra Nguyen , Boon Tang Teh
IPC分类号： G11C1606
CPC分类号： G11C16/08 , G11C8/10
摘要： A flash memory having word line decoding and selection architecture is described. The flash memory include first and second sectors of memory cells, first and second local driver circuits, first, second and third decoding circuits, and a driving circuit. The first sectors of first memory cells include a first plurality of word lines coupled to the first memory cells, each being capable of being a first selected word line. The second sectors of second memory cells include a similar Local driver circuits are independently coupled to each word line of the first and second pluralities of word lines of the first sectors. Each decoding circuits comprise a first and a second side of decoding circuitry. The first side of decoding circuitry activates a first selected plurality of local driver circuits and the second side of decoding circuitry activates a second selected plurality of local driver circuits. The second decoding circuits are coupled to the first local driver circuits and supply a first boosted voltage to the first selected word line coupled to a first local driver circuit. The third decoding circuits are coupled to the second local driver circuits and supply a second boosted voltage to the second selected word line. The driving circuit supplies a series of boosted voltages to the first decoding circuits, the second decoding circuits, the third decoding circuits, the first local driver circuits, and the second local driver circuits.
摘要翻译：描述了具有字线解码和选择架构的闪速存储器。闪速存储器包括存储单元的第一和第二扇区，第一和第二本地驱动电路，第一，第二和第三解码电路以及驱动电路。第一存储器单元的第一扇区包括耦合到第一存储器单元的第一多个字线，每个字线能够是第一选定的字线。第二存储器单元的第二扇区包括类似的局部驱动器电路独立地耦合到第一扇区的第一和第二多个字线的每个字线。每个解码电路包括解码电路的第一和第二侧。解码电路的第一侧激活第一选定的多个本地驱动器电路，并且解码电路的第二侧激活第二选定的多个局部驱动器电路。第二解码电路耦合到第一本地驱动电路，并将第一升压电压提供给耦合到第一本地驱动电路的第一选定字线。第三解码电路耦合到第二本地驱动电路，并将第二升压电压提供给第二选定字线。驱动电路向第一解码电路，第二解码电路，第三解码电路，第一本地驱动电路和第二本地驱动电路提供一系列升压电压。

3. 发明授权

US06229735B1 Burst read mode word line boosting 有权
标题翻译：突发读取模式字线提升
公开(公告)号：US06229735B1
公开(公告)日：2001-05-08
申请号：US09638055
申请日：2000-08-11
申请人： Takao Akaogi , Kendra Nguyen , Yong Kim , Lee Cleveland
发明人： Takao Akaogi , Kendra Nguyen , Yong Kim , Lee Cleveland
IPC分类号： G11C1606
CPC分类号： G11C8/18 , G11C8/08
摘要： A burst read mode operation is provided that boosts the voltage of a word line while the bit lines of the row are selected for reading. When the column group address bits read the last column group of cells in the row, a pulse signal is generated which temporarily reduces the boosted voltage to allow the X-decoder to select the next word line. An alternative delay element is also provided which generates an ATD pulse with a longer duration when the column group address bits are at the end of a row and a shorter duration pulse at other times.
摘要翻译：提供突发读取模式操作，其提高字线的电压，同时选择行的位线用于读取。当列组地址位读取行中的最后一列单元格时，产生脉冲信号，临时降低升压电压，以允许X解码器选择下一个字线。还提供了另一种延迟元件，当列组地址位在行的末尾，而在其他时间具有较短的持续时间脉冲时，其产生具有较长持续时间的ATD脉冲。

4. 发明授权

US06567289B1 Physical memory layout with various sized memory sectors 有权
标题翻译：物理内存布局与各种大小的内存扇区
公开(公告)号：US06567289B1
公开(公告)日：2003-05-20
申请号：US09644359
申请日：2000-08-23
申请人： Lee Cleveland , Yong Kim
发明人： Lee Cleveland , Yong Kim
IPC分类号： G11C506
CPC分类号： G11C5/025
摘要： The physical layout of a semiconductor memory device having memory sectors of varying sizes can be arranged such that the larger and smaller memory sectors are addressed by x-decoders and y-decoders via word lines and bit lines, respectively. The smaller memory sectors are laid out such that some of the small memory sectors are connected with a y-decoder or multiple y-decoders via different bit-lines. The smaller memory sectors are interspersed with the large memory sectors and an area near a corner of the memory device that can be used for other components such as peripheral devices. Optional physical to logical mapping of address allow the smaller memory sectors to be addressed in the first or the last memory addresses.
摘要翻译：可以布置具有不同大小的存储器扇区的半导体存储器件的物理布局，使得较大和较小的存储器扇区分别经由字线和位线被x解码器和y解码器寻址。布置较小的存储器扇区，使得一些小存储器扇区通过不同的位线与y解码器或多个y解码器连接。更小的存储器扇区散布有大的存储器扇区和靠近存储器件的角落的区域，其可以用于诸如外围设备的其他组件。地址的可选物理到逻辑映射允许在第一个或最后一个存储器地址中寻址更小的存储器扇区。

5. 发明申请

US20070155033A1 Method of manufacturing light emitting diode package 审中-公开
标题翻译：制造发光二极管封装的方法
公开(公告)号：US20070155033A1
公开(公告)日：2007-07-05
申请号：US11649914
申请日：2007-01-05
申请人： Yong Kim , Seog Choi , Yong Kim , Sang Shin
发明人： Yong Kim , Seog Choi , Yong Kim , Sang Shin
IPC分类号： H01L21/00
CPC分类号： B29C41/12 , B29C41/20 , B29C41/36 , B29C41/50 , B29L2011/00 , H01L33/52 , H01L2224/48091 , H01L2924/00014
摘要： A method of manufacturing an LED package. The method includes dispensing a transparent resilient resin on an LED package body and overturning an entire structure to form an LED lens integrally provided to the LED package body. This prevents extra processes and costs incurring from forming intermediate layers and obviates degradation in reliability and light extraction efficiency due to additional interfaces.
摘要翻译：一种制造LED封装的方法。该方法包括将透明弹性树脂分配在LED封装主体上并翻转整个结构以形成一体地提供到LED封装体的LED透镜。这防止了由于附加界面而形成中间层而导致额外的工艺和成本，并且消除了可靠性和光提取效率的降低。

6. 发明申请

US20060121815A1 Method of manufacturing barrier ribs for pdp by capillary molding of paste and paste compositions therefor 失效
标题翻译：通过毛细管成型用于制造pdp隔壁的糊剂和糊剂组合物的方法
公开(公告)号：US20060121815A1
公开(公告)日：2006-06-08
申请号：US10521196
申请日：2003-07-15
申请人： Yong Kim , Yong Kim , Sung Cho
发明人： Yong Kim , Yong Kim , Sung Cho
IPC分类号： H01J9/24
CPC分类号： H01J9/242 , H01J11/12 , H01J11/36
摘要： Disclosed is a method of manufacturing rear plate barrier ribs for Plasma Display Panel (PDP), which includes the steps of: forming barrier ribs by infiltrating the barrier rib forming paste into grooves of a mold by using the capillary phenomenon, and then sintering the paste. This method causes rare environmental pollution, enables to make barrier ribs having fine and complex shapes and reduces material costs required for the barrier rib. Thus, the method may improve quality of PDP and reduce manufacture costs of the rear plate.
摘要翻译：公开了一种制造等离子体显示面板（PDP）的后板阻挡肋的方法，其包括以下步骤：通过使用毛细管现象将隔壁形成膏渗透到模具的凹槽中，然后烧结浆料。这种方法造成罕见的环境污染，能够形成具有精细和复杂形状的隔肋，并且减少隔壁所需的材料成本。因此，该方法可以提高PDP的质量并降低后板的制造成本。

7. 发明申请

US20070063214A1 Light emitting diode package and method for manufacturing the same 审中-公开
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20070063214A1
公开(公告)日：2007-03-22
申请号：US11524278
申请日：2006-09-21
申请人： Yong Kim , Seog Choi , Chang Lim , Yong Kim
发明人： Yong Kim , Seog Choi , Chang Lim , Yong Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L33/58
摘要： The invention relates to a light emitting diode package that can prevent deterioration of phosphor and a method of manufacturing the same. The light emitting diode package includes a package body having a recessed part, a light emitting diode chip mounted on a floor surface of the recessed part and a lens structure disposed on an upper surface of the package body, apart from the light emitting diode chip. Phosphor is dispersed in at least a part of the lens structure.
摘要翻译：本发明涉及能够防止荧光体劣化的发光二极管封装及其制造方法。发光二极管封装包括具有凹部的封装主体，安装在凹部的地板表面上的发光二极管芯片和设置在封装体的上表面上的透镜结构，与发光二极管芯片分开。荧光体分散在透镜结构的至少一部分中。

8. 发明申请

US20050156522A1 Method of manufacturing barrier ribs for pdp by etching of thick film using water-based solution and compositions therefor 审中-公开
标题翻译：通过使用水溶液蚀刻厚膜及其组合物来制造pdp隔壁的方法
公开(公告)号：US20050156522A1
公开(公告)日：2005-07-21
申请号：US10510036
申请日：2002-04-08
申请人： Yong Kim , Jin Hwang , Yong Kim
发明人： Yong Kim , Jin Hwang , Yong Kim
IPC分类号： H01J9/24 , H01J11/12 , H01J11/36 , H01J17/49
CPC分类号： H01J9/242 , H01J11/12 , H01J11/36 , H01J2211/366
摘要： Disclosed is a method of manufacturing barrier ribs for a Plasma Display Panel (PDP), which includes the steps of forming a thick film (or, “green tape”) for barrier ribs on a glass or metal substrate by using composition for forming the barrier ribs, which contains water soluble components and solvent soluble components together a binder; forming a protective pattern film partially soluble or insoluble to the water based solution on the thick film; etching the thick film into a barrier rib shape by using solution or mixed solution containing ceramic powder as an etching accelerator, and sintering the etched thick film. This method causes rare environmental pollution, enables to make barrier ribs having fine and complex shapes and reduces material costs required for the barrier rib. Thus, the method may improve quality of DPD and reduce manufacture costs of the rear plate.
摘要翻译：公开了一种制造用于等离子体显示面板（PDP）的隔壁的方法，其包括以下步骤：通过使用用于形成屏障的组合物在玻璃或金属基板上形成用于隔壁的厚膜（或“生胶条”）肋骨，其含有水溶性成分和溶剂可溶性成分在一起的粘合剂; 在厚膜上形成部分溶解或不溶于水基溶液的保护性图案膜; 通过使用含有陶瓷粉末作为蚀刻加速剂的溶液或混合溶液将厚膜蚀刻成隔壁形状，并烧结蚀刻的厚膜。这种方法造成罕见的环境污染，能够形成具有精细和复杂形状的隔肋，并且减少隔壁所需的材料成本。因此，该方法可以提高DPD的质量并降低后板的制造成本。

9. 发明申请

US20060270078A1 Method of fabricating light emitting diode package 有权
标题翻译：制造发光二极管封装的方法
公开(公告)号：US20060270078A1
公开(公告)日：2006-11-30
申请号：US11439189
申请日：2006-05-24
申请人： Yong Kim , Seog Choi , Hyoung Kim , Yong Kim
发明人： Yong Kim , Seog Choi , Hyoung Kim , Yong Kim
IPC分类号： H01L21/00
CPC分类号： H01L33/52 , H01L2224/48091 , H01L2224/48227 , Y10S438/974 , H01L2924/00014
摘要： The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.
摘要翻译：本发明涉及一种LED封装，并提出了一种制造LED封装的方法，包括以下步骤：提供具有LED的安装区域和与LED连接的金属图案的封装基板，以及等离子体处理封装基板以改造至少形成将形成树脂成型部件的封装基板的预定表面积。该方法还包括将LED安装在基板封装上的安装区域上，并将LED与金属图形电连接，并在LED的安装区域中形成树脂模制部件以密封LED封装。

10. 发明申请

US20050233763A1 Dual connection device for memory mediums and mobile communication terminals with the same 有权
标题翻译：用于存储介质的双连接设备和具有相同功能的移动通信终端
公开(公告)号：US20050233763A1
公开(公告)日：2005-10-20
申请号：US11050802
申请日：2005-02-07
申请人： Yong Kim , Yong Kim
发明人： Yong Kim , Yong Kim
IPC分类号： H04B1/38 , G06K7/00 , H04M1/00 , H04M1/02
CPC分类号： H04B1/3816 , G06K7/0021 , G06K7/0034 , H04M1/026
摘要： A dual connection device for memory mediums has a body portion electrically connected with a mobile communication terminal, a first receiving portion formed to the body portion for receiving therein a first memory medium, a second receiving portion formed to the body portion as to be arranged piled up to the first receiving portion for receiving therein a second memory medium, a first connection terminal installed in the first receiving portion so as to be electrically connected with a terminal of the first memory medium, and a second connection terminal installed in the second receiving portion so as to be electrically connected with a terminal of the second memory medium. Since a plurality of memory mediums are connected with a terminal mobile communication terminal by the connection device, it is possible to make the mobile communication terminal have a slim and compact size, accomplish a simplified assembly process, and obtain increased productivity and cost reduction due to simplification of assembly process.
摘要翻译：用于存储介质的双连接装置具有与移动通信终端电连接的主体部分，形成在主体部分上用于在其中容纳第一存储介质的第一接收部分，形成在主体部分上的第二接收部分，以布置成堆直到第一接收部分用于在其中接收第二存储介质;第一连接端子，安装在第一接收部分中以便与第一存储介质的端子电连接，第二连接端子安装在第二接收部分中以便与第二存储介质的端子电连接。由于多个存储介质通过连接装置与终端移动通信终端连接，所以可以使移动通信终端具有纤细且紧凑的尺寸，实现简化的组装过程，并且由于装配过程简化。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式