会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • PULSED PLASMA CHAMBER IN DUAL CHAMBER CONFIGURATION
    • 双室配置中的脉冲等离子体室
    • WO2013036371A2
    • 2013-03-14
    • PCT/US2012051460
    • 2012-08-17
    • LAM RES CORPMARAKHTANOV ALEXEIDHINDSA RAJINDERHUDSON ERICBAILEY III ANDREW D
    • MARAKHTANOV ALEXEIDHINDSA RAJINDERHUDSON ERICBAILEY III ANDREW D
    • H01L21/3065C23F1/08H01L21/306
    • H01J37/32146H01J37/32091H01J37/32825H01J2237/3341H01L21/31116H01L21/67069
    • Systems, methods, and computer programs for processing a semiconductor substrate in a pulsed plasma chamber in a dual chamber configuration are provided. A wafer processing apparatus with a top chamber and a bottom chamber separated by a plate that fluidly connects the top chamber to the bottom chamber includes a continuous wave (CW) controller, a pulse controller, and a system controller. The CW controller is operable to set the voltage and the frequency for a first radio frequency (RF) power source coupled to a top electrode in the top chamber. The pulse controller is operable to set voltage, frequency, ON-period duration, and OFF-period duration for a pulsed RF signal generated by a second RF power source coupled to the bottom electrode in the bottom chamber. Further, the system controller is operable to set parameters for the CW controller and the pulse controller to regulate the flow of species from the top chamber to the bottom chamber through the plate during operation of the chamber. The flow of species assists in the negative-ion etching and in neutralizing excessive positive charge on the wafer surface during afterglow in the OFF period, and assists in the re- striking of the plasma in the bottom chamber during the ON period.
    • 提供了用于在双室配置中处理脉冲等离子体室中的半导体衬底的系统,方法和计算机程序。 具有通过将顶部腔室与底部腔室流体连接的板分隔开的顶部腔室和底部腔室的晶片处理装置包括连续波(CW)控制器,脉冲控制器和系统控制器。 CW控制器可操作地设置耦合到顶部室中顶部电极的第一射频(RF)电源的电压和频率。 脉冲控制器可操作地为耦合到底部室中的底部电极的第二RF电源产生的脉冲RF信号设置电压,频率,接通周期持续时间和关闭周期持续时间。 此外,系统控制器可操作以设置CW控制器和脉冲控制器的参数,以调节在室的操作期间物种从顶室到底室通过板的流动。 物质的流动有助于负离子蚀刻,并且在关闭期间在余辉期间中和晶片表面上的过量正电荷,并且有助于在接通期间等离子体在底室中的重新打开。
    • 3. 发明申请
    • MODULATED MULTI-FREQUENCY PROCESSING METHOD
    • 调制多频处理方法
    • WO2010117969A3
    • 2011-01-13
    • PCT/US2010030019
    • 2010-04-06
    • LAM RES CORPMARAKHTANOV ALEXEIHUDSON ERICDHINDSA RAJINDERBAILEY ANDREW
    • MARAKHTANOV ALEXEIHUDSON ERICDHINDSA RAJINDERBAILEY ANDREW
    • H01L21/3065H05H1/24H05H1/36
    • H01L21/3065H01J37/32009H01J37/32137H01J37/32146H01J2237/334H01J2237/3348
    • A method is provided for operating a processing system having a space therein arranged to receive a gas and an electromagnetic field generating portion operable to generate an electromagnetic field within the space. The method includes providing a gas into the space, and operating the electromagnetic field generating portion with a driving potential to generate an electromagnetic field within the space to transform at least a portion of the gas into plasma. The driving potential as a function of time is based on a first potential function portion and a second potential function portion. The first potential function portion comprises a first continuous periodic portion having a first amplitude and a first frequency. The second potential function portion comprises a second periodic portion having an maximum amplitude portion, and minimum amplitude portion and a duty cycle. The maximum amplitude portion is a higher amplitude than the minimum amplitude portion. The duty cycle is the ratio of a duration of the maximum amplitude portion to the sum of the duration of the maximum amplitude portion and the duration of the minimum amplitude portion. The second periodic portion additionally has a second frequency during the maximum amplitude portion. An amplitude modulation of the second periodic portion is phase locked to the first continuous periodic portion.
    • 提供了一种操作处理系统的方法,该处理系统具有布置成接收气体的空间和可操作以在该空间内产生电磁场的电磁场产生部分。 所述方法包括向所述空间提供气体,以及利用驱动电位操作所述电磁场产生部分,以在所述空间内产生电磁场,以将所述气体的至少一部分转化为等离子体。 作为时间的函数的驱动电位基于第一潜在功能部分和第二电位功能部分。 第一潜在功能部分包括具有第一幅度和第一频率的第一连续周期部分。 第二电位功能部分包括具有最大振幅部分和最小振幅部分和占空比的第二周期部分。 最大幅度部分比最小振幅部分的幅度更大。 占空比是最大幅度部分的持续时间与最大振幅部分的持续时间和最小振幅部分的持续时间之和的比率。 第二周期部分在最大振幅部分期间另外具有第二频率。 第二周期部分的幅度调制被锁相到第一连续周期部分。
    • 8. 发明申请
    • GROUNDED CONFINEMENT RING HAVING LARGE SURFACE AREA
    • 具有大面积区域的接地约束环
    • WO2010117971A2
    • 2010-10-14
    • PCT/US2010030021
    • 2010-04-06
    • LAM RES CORPMARAKHTANOV ALEXEIDHINDSA RAJINDER
    • MARAKHTANOV ALEXEIDHINDSA RAJINDER
    • H01L21/3065H05H1/24
    • H01J37/32642H01J37/32422H01J37/32495H01J37/32623
    • A wafer processing system is provided for use with a driver and a material supply source. The driver is operable to generate a driving signal. The material supply source is operable to provide a material. The wafer processing system includes an upper confinement chamber portion, a lower confinement chamber portion, a confinement ring, and an electro-static chuck. The upper confinement chamber portion has an upper confinement chamber portion inner surface. The lower confinement chamber portion is detachably disposed in contact with the upper confinement chamber portion. The lower confinement chamber portion has a lower confinement chamber portion inner surface. The confinement ring is removably disposed in contact with the upper confinement chamber portion inner surface and the lower confinement chamber portion inner surface. The confinement ring has a confinement ring inner surface. The electro-static chuck has an electro-static chuck upper surface and is arranged to receive the driving signal. The upper confinement chamber portion, the lower confinement chamber portion, the confinement ring and the electro-static chuck are arranged such that the upper confinement chamber portion inner surface, the lower confinement chamber portion inner surface, the confinement ring inner surface and the electro-static chuck upper surface surround a plasma-forming space that is capable of receiving the material. The upper confinement chamber portion, the lower confinement chamber portion, the confinement ring and the electro-static chuck are operable to transform the material into a plasma when the electro-static chuck receives the driving signal. The confinement ring has a non-rectangular cross section.
    • 提供了与驱动器和材料供应源一起使用的晶片处理系统。 驱动器可操作以产生驱动信号。 材料供应源可操作以提供材料。 晶片处理系统包括上限制室部分,下限制室部分,限制环和静电卡盘。 上约束室部分具有上约束室部分内表面。 下部限制室部分可拆卸地设置成与上部限制室部分接触。 下部限制室部分具有下部限制室部分内表面。 限制环可拆卸地设置成与上部限制室部分内表面和下部限制室部分内表面接触。 限制环具有限制环内表面。 静电卡盘具有静电卡盘上表面,并被布置成接收驱动信号。 上部限制室部分,下部限制室部分,限制环和静电卡盘被布置成使得上部限制室部分内表面,下部限制室部分内表面,限制环内表面和电 - 静态卡盘上表面包围能够接收材料的等离子体形成空间。 当静电卡盘接收到驱动信号时,上部限制室部分,下部限制室部分,限制环和静电卡盘可操作以将材料转换成等离子体。 限制环具有非矩形截面。