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1. 发明授权

US4331286A Method for pressure bonding metal members by utilizing eutectic reaction 失效
标题翻译：通过利用共晶反应来压合金属部件的方法
公开(公告)号：US4331286A
公开(公告)日：1982-05-25
申请号：US27837
申请日：1979-04-06
申请人： Kunio Miyazaki , Takeo Tamamura , Tomio Iizuka , Hitoshi Suzuki , Izumi Ochiai
发明人： Kunio Miyazaki , Takeo Tamamura , Tomio Iizuka , Hitoshi Suzuki , Izumi Ochiai
IPC分类号： B23K20/00 , B23K13/02 , B23K20/22 , B23K20/233
CPC分类号： B23K13/02 , B23K20/233
摘要： A method for pressure bonding metal members by utilizing eutectic reaction comprising the steps of bringing two metal members of dissimilar metals to be bonded into contact with each other under a predetermined contacting pressure P.sub.1 lower than the plastic deformation pressures of the metals of the two members and heating the contacting surfaces of the two members to a temperature lower than melting point temperatures of the metals and not lower than the eutectic temperature thereof to produce a liquid of eutectic composition by eutectic reaction between the surfaces of the two members to be bonded, applying an upset pressure P.sub.2 higher than the contacting pressure P.sub.1 to the surfaces to be bonded to squeeze out the liquid from the contacting surfaces of the two members to outside, and cooling the bonded surfaces of the two members. When the members to be joined by pressure bonding are of the same metal, an insert comprising an element undergoing eutectic reaction with the metal of the two members is interposed between the surfaces of the two members to be bonded.
摘要翻译：一种通过利用共晶反应来压接金属构件的方法，包括以下步骤：在比两个构件的金属的塑性变形压力低的预定接触压力P1下将要接合的异种金属的两个金属构件相互接触，将两个构件的接触表面加热到低于金属的熔点温度的温度并且不低于其共晶温度，以通过待结合的两个构件的表面之间的共晶反应产生共晶组成的液体，镦锻压力P2比要接合的表面高出接触压力P1，以将液体从两个构件的接触表面挤出到外部，并冷却两个构件的接合表面。当通过压力接合连接的构件是相同的金属时，包括与两个构件的金属进行共晶反应的元件的插入件插入在待接合的两个构件的表面之间。

2. 发明授权

US5153704A Semiconductor device using annealed bonding wire 失效
标题翻译：半导体器件采用退火焊丝
公开(公告)号：US5153704A
公开(公告)日：1992-10-06
申请号：US818457
申请日：1992-01-03
申请人： Jin Onuki , Masateru Suwa , Masahiro Koizumi , Tomio Iizuka , Takeo Tamamura
发明人： Jin Onuki , Masateru Suwa , Masahiro Koizumi , Tomio Iizuka , Takeo Tamamura
IPC分类号： B23K20/00 , H01L21/48 , H01L21/60 , H01L21/607 , H01L23/31 , H01L23/49 , H01L23/495
CPC分类号： H01L24/85 , B23K20/007 , H01L23/3107 , H01L23/3135 , H01L23/4952 , H01L23/49582 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/05624 , H01L2224/32225 , H01L2224/32245 , H01L2224/43 , H01L2224/43848 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/4517 , H01L2224/4518 , H01L2224/48091 , H01L2224/48247 , H01L2224/4845 , H01L2224/48465 , H01L2224/48472 , H01L2224/4851 , H01L2224/48624 , H01L2224/48639 , H01L2224/48655 , H01L2224/48724 , H01L2224/48739 , H01L2224/48755 , H01L2224/48799 , H01L2224/48839 , H01L2224/48855 , H01L2224/73265 , H01L2224/78301 , H01L2224/85043 , H01L2224/85045 , H01L2224/85075 , H01L2224/85181 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85424 , H01L2224/85439 , H01L2224/85455 , H01L2224/85948 , H01L2224/92247 , H01L24/73 , H01L24/78 , H01L2924/00011 , H01L2924/01005 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/15747 , H01L2924/16152 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , Y10T428/12431
摘要： A resin encapsulated semiconductor device comprises a semiconductor element, a conductive base, a wire of aluminum connecting the element and the base, and a thermosetting resin encapsulating hermetically the component to protect the device from a mechanical stress and ambient atmosphere.
摘要翻译：树脂封装的半导体器件包括半导体元件，导电基底，连接元件和基底的铝线，以及密封该元件的热固性树脂，以保护器件免受机械应力和环境气氛的影响。

3. 发明授权

US4478363A Method of production of composite billet for fuel cladding tube 失效
标题翻译：燃料包层管复合材料生产方法
公开(公告)号：US4478363A
公开(公告)日：1984-10-23
申请号：US254297
申请日：1981-04-15
申请人： Hiromichi Imahashi , Shigeo Turuoka , Keiichi Kuniya , Tomio Iizuka , Akira Kawahara
发明人： Hiromichi Imahashi , Shigeo Turuoka , Keiichi Kuniya , Tomio Iizuka , Akira Kawahara
IPC分类号： B23K20/02 , B21D39/04
CPC分类号： B23K20/02
摘要： A method of production of a composite billet for a nuclear fuel cladding tube wherein a hollow inner billet of zirconium is inserted in a hollow outer billet of a nuclear fuel cladding material. Following insertion of a resilient member in the hollow inner billet, pressure is applied to the resilient member axially of the billets to force the inner billet against the outer billet, to produce a pressure bonding between an inner surface of the outer billet and an outer surface of the inner billet.
摘要翻译：一种生产用于核燃料包层管的复合坯料的方法，其中锆的中空内部坯料插入核燃料包层材料的中空外部坯料中。在将弹性构件插入中空的内部坯料中之后，将压力作用在坯料轴向的弹性构件上以迫使内部坯料抵抗外部坯料，从而在外部坯料的内表面和外部表面之间产生压力结合的内部钢坯。

4. 发明授权

US4114243A Process for producing cathode for cathode ray tube of directly heating type 失效
标题翻译：直接加热式阴极射线管阴极生产工艺
公开(公告)号：US4114243A
公开(公告)日：1978-09-19
申请号：US775618
申请日：1977-03-08
申请人： Ko Soeno , Toshio Doi , Tomio Iizuka , Hiroshi Sakamoto , Hisashi Ando , Tetsuo Oyama , Akira Misumi
发明人： Ko Soeno , Toshio Doi , Tomio Iizuka , Hiroshi Sakamoto , Hisashi Ando , Tetsuo Oyama , Akira Misumi
IPC分类号： H01J1/14 , H01J9/04
CPC分类号： H01J9/04
摘要： In a process for producing a cathode for a cathode ray tube of directly heating type, which comprises shaping a heat-resistant and electro-conductive, flat metal plate, into a cathode substrate body having two leg pieces extended in the same direction and a flat part connected to one end of each leg piece, forming a heat-diffusible metal powder layer having a good affinity to said flat metal plate and on an outer surface of said flat part, heating the powder layer, thereby diffusion bonding the powder layer to the flat part and forming a bonding layer having an uneven surface, to which a thermionic emission layer is to be bonded, and forming the thermionic emission layer on the surface of the bonding layer, the process is characterized by forming on said flat metal plate a metal layer having a good affinity to the flat metal plate, by diffusion bonding, thereby forming a compound plate, and shaping the resulting compound plate into the shape of said cathode substrate body. A cathode having less thermal deformation and a longer life can be produced thereby.Furthermore, the process is characterized by applying a plastic working to the compound plate to a desired thickness and shaping the resulting compound plate into the shape of the cathode substrate body, and a cathode having much less thermal deformation and much longer life can be produced thereby.
摘要翻译：在直接加热型阴极射线管用阴极的制造方法中，包括将耐热导电平板状金属板成形为具有沿相同方向延伸的两个支腿的阴极基板主体，形成与所述平板状金属板和所述平坦部的外表面具有良好亲和性的热扩散性金属粉末层，加热所述粉末层，从而将所述粉末层扩散到并且形成具有不平坦表面的接合层，热电子发射层将被结合到其上，并且在接合层的表面上形成热离子发射层，其特征在于在所述平坦金属板上形成金属通过扩散接合对平板状金属板具有良好的亲和性，从而形成复合板，并将得到的化合物板成形为所述阴极基体的形状。因此可以产生具有较少热变形和较长寿命的阴极。

5. 发明授权

US4367017A Laser beam reflection system 失效
标题翻译：激光束反射系统
公开(公告)号：US4367017A
公开(公告)日：1983-01-04
申请号：US190202
申请日：1980-09-24
申请人： Ryutarou Jimbou , Tomio Umino , Tomohiko Shida , Tomio Iizuka , Shoji Isobe
发明人： Ryutarou Jimbou , Tomio Umino , Tomohiko Shida , Tomio Iizuka , Shoji Isobe
IPC分类号： B23K26/00 , B23K26/02 , B23K26/08 , B23K26/14 , B23K26/20 , B23K26/28 , G02B17/06 , G02B27/14 , G02B27/64 , G02B5/10
CPC分类号： B23K26/147 , B23K26/02 , B23K26/035 , B23K26/0643 , B23K26/08 , B23K26/082 , B23K26/28 , G02B19/0019 , G02B19/0047 , G02B27/642
摘要： A laser beam reflection system for applying a laser beam to an area to be treated. The laser beam reflection system has a hollow head housing, first reflecting mirror means disposed in the rotary head housing and adapted to deflect the laser beam introduced into the rotary head housing away from the axis, second reflecting mirror means disposed in the rotary head housing and adapted to reflect the laser beam coming from the first reflecting mirror means to such a direction as to traverse the axis, and third reflecting mirror means disposed in the head housing movably in the direction traversing the axis and adapted to reflect and focus onto the area the laser beam coming from the second reflecting mirror means. The laser beam reflection system of the invention can be used for welding, surface treatment, heat treatment, cutting of various materials, and a light source of laser communication systems.
摘要翻译：一种用于将激光束施加到待处理区域的激光束反射系统。激光束反射系统具有中空头壳体，第一反射镜装置设置在旋转磁头外壳中，并适于将引入旋转磁头外壳的激光束偏离轴线，第二反射镜装置设置在旋转磁头外壳中，适于将来自第一反射镜装置的激光束反射到穿过轴线的方向，以及第三反射镜装置，其沿着穿过轴线的方向可移动地设置在头部外壳中，并且适于反射和聚焦到该区域上来自第二反射镜装置的激光束。本发明的激光束反射系统可用于焊接，表面处理，热处理，各种材料的切割以及激光通信系统的光源。

6. 发明授权

US3969754A Semiconductor device having supporting electrode composite structure of metal containing fibers 失效
标题翻译：具有含金属纤维的辅助电极复合结构的半导体装置
公开(公告)号：US3969754A
公开(公告)日：1976-07-13
申请号：US516509
申请日：1974-10-21
申请人： Keiichi Kuniya , Tomio Iizuka , Masateru Suwa , Tomio Yasuda , Takeshi Sasaki , Sakae Kikuchi , Hideo Suzuki
发明人： Keiichi Kuniya , Tomio Iizuka , Masateru Suwa , Tomio Yasuda , Takeshi Sasaki , Sakae Kikuchi , Hideo Suzuki
IPC分类号： H01L21/52 , H01L23/492 , H01L23/48 , H01L29/40 , H01L29/46 , H01L29/62
CPC分类号： H01L23/4922 , H01L2924/0002
摘要： A semiconductor device comprising a semiconductor substrate and a supporting electrode disposed at least on one surface of the semiconductor substrate, in which the supporting electrode has such a composite structure that fibers having a coefficient of thermal expansion substantially equal to or lower than that of the semiconductor substrate are embedded in a matrix of a metal having electric and heat conductivities higher than those of the fibers. This supporting electrode has a satisfactorily high heat conductivity and the coefficient of thermal expansion thereof is freely adjustable.
摘要翻译：一种半导体器件，包括半导体衬底和设置在所述半导体衬底的至少一个表面上的支撑电极，其中所述支撑电极具有这样的复合结构，即所述热膨胀系数基本上等于或低于所述半导体基板被嵌入具有高于纤维的导电性和导热性的金属的基体中。该支撑电极具有令人满意的高导热性，其热膨胀系数可自由调节。

7. 发明授权

US4144992A Method for controlling an automatic pipe welder 失效
标题翻译：自动焊机控制方法
公开(公告)号：US4144992A
公开(公告)日：1979-03-20
申请号：US829891
申请日：1977-09-01
申请人： Tsutomu Omae , Takanori Shibata , Keiziro Sakai , Tomio Iizuka , Takaichi Koyama
发明人： Tsutomu Omae , Takanori Shibata , Keiziro Sakai , Tomio Iizuka , Takaichi Koyama
IPC分类号： B23K9/10 , B23K9/028
CPC分类号： B23K9/0286
摘要： Method for controlling an automatic pipe welder is disclosed. In the automatic welder which requires remote control, welding conditions for butt welding pipes are stored and an actual joint geometry or groove shape is sensed. From signals relating to the stored welding conditions and the sensed groove shape, a control command signal in actual welding is produced to effect welding under an optimum condition. On the other hand, an arc condition at an actual welding point and a melting condition of a metal are monitored and displayed to modify the welding conditions in accordance with the monitored condition to control the automatic pipe welder.
摘要翻译：公开了一种用于控制自动管焊机的方法。在需要远程控制的自动焊机中，存储对接焊管的焊接条件，并且感测到实际的接头几何形状或槽形状。从存储的焊接条件和感测到的槽形状的信号中，产生实际焊接中的控制指令信号，以在最佳条件下进行焊接。另一方面，对实际焊接点处的电弧状态和金属的熔化条件进行监视和显示，以根据监视条件修改焊接条件以控制自动焊接机。

8. 发明授权

US4129801A Cathode for cathode ray tube of directly heating type and process for producing the same cathode 失效
标题翻译：直接加热型阴极射线管阴极和生产同一阴极的工艺
公开(公告)号：US4129801A
公开(公告)日：1978-12-12
申请号：US813240
申请日：1977-07-06
申请人： Ko Soeno , Tomio Iizuka , Toshio Doi , Hisashi Ando , Testuo Oyama , Hiroshi Sakamoto , Akira Misumi
发明人： Ko Soeno , Tomio Iizuka , Toshio Doi , Hisashi Ando , Testuo Oyama , Hiroshi Sakamoto , Akira Misumi
IPC分类号： H01J9/04 , H01J29/04 , H01J19/06
CPC分类号： H01J29/04 , H01J9/04
摘要： The present cathode for cathode ray tube of directly heating type is characterized by comprising a cathode substrate body having two leg pieces extended in the same direction and a flat part connected to one end of each leg piece, prepared by shaping a flat metal plate of nickel- or cobalt-based alloy, a bonding layer having an uneven surface prepared by diffusion bonding by heating a powder layer comprising powders of alloy or mixture of nickel and cobalt formed on the flat part, to which a thermionic emission layer is to be bonded, and the thermionic emission layer, and has a very small deformation when used and a longer life.A cathode with much less deformation and much longer life can be obtained by using a cathode substrate body prepared from a flat metal plate provided with a thinner metal layer of at least one of nickel and cobalt on its surface than the flat metal plate by diffusion bonding.A cathode with much less deformation after the service for a long period and much longer life is obtained by using a cathode substrate body prepared from a flat metal plate provided with a metal layer of at least one of nickel and cobalt having a smaller thickness on its surface than that of the flat metal plate by diffusion bonding, and then applying a plastic working to the flat metal plate to a desired thickness.
摘要翻译：本发明的直接加热型阴极射线管阴极的特征在于，具有阴极基体，该阴极基体具有沿相同方向延伸的两个腿部件，以及连接到每个腿部件的一端的平坦部件，其通过使镍或钴基合金，具有通过扩散接合制备的具有不平坦表面的接合层，其通过加热包含在热电子发射层将被结合的平坦部分上形成的合金或镍和钴的混合物的粉末的粉末层，和热离子发射层，使用时变形非常小，寿命更长。

9. 发明授权

US4083719A Copper-carbon fiber composites and process for preparation thereof 失效
标题翻译：铜 - 碳纤维复合材料及其制备方法
公开(公告)号：US4083719A
公开(公告)日：1978-04-11
申请号：US737023
申请日：1976-10-29
申请人： Hideo Arakawa , Keiichi Kuniya , Takashi Namekawa , Tomio Iizuka
发明人： Hideo Arakawa , Keiichi Kuniya , Takashi Namekawa , Tomio Iizuka
IPC分类号： B22D19/14 , B32B15/04 , B32B15/14 , C22C9/00 , C22C47/14 , C22C49/00 , C22C49/14 , H01L21/52 , H01L23/373 , C22C1/09
CPC分类号： H01L23/373 , C22C49/14 , H01L2924/0002
摘要： Copper powder, carbon fibers arranged in random directions and a metal capable of reacting with carbon fibers are homogeneously mixed together, and the mixture is heated and molded under high pressure to form an integral composite. The so formed carbon fiber-copper matrix composite has no directional characteristic in mechanical properties, and the linear thermal expansion coefficient of the composite is low and the thermal stability of the composite is so high that when it is exposed to high temperature, no damage by thermal deformation is caused.
摘要翻译：铜粉末，随机排列的碳纤维和能够与碳纤维反应的金属均匀地混合在一起，将混合物在高压下加热成型，形成整体复合材料。这样形成的碳纤维 - 铜基复合材料在机械性能方面没有方向性，复合材料的线性热膨胀系数低，复合材料的热稳定性高，当暴露于高温时，不会受到损伤引起热变形。

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