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1. 发明专利

JP2004041149A Automatic watering apparatus 审中-公开
公开(公告)号：JP2004041149A
公开(公告)日：2004-02-12
申请号：JP2002232107
申请日：2002-07-08
申请人： Masahiro Koizumi , Koizumi Midori , 小泉みどり , 小泉雅弘
发明人： KOIZUMI MUTSUKI , KOIZUMI MEIKA , KOIZUMI MASAHIRO
IPC分类号： A01G27/00 , A01G27/04
摘要： PROBLEM TO BE SOLVED: To provide an automatic watering apparatus for plants in which operation is started by rise of air temperature and watering to a plant is carried out in a necessary and sufficient water amount. SOLUTION: This automatic watering apparatus is constituted of a trap device 1 and a water storage container 2. Water stored in the water storage container 2 is supplied to the trap device 1 and operation of the trap device 1 is started by rise of the air temperature and the prescribed water amount is discharged to carry out watering to the plant. COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2005295975A Terminal tackle for sweetfish angling by decoy in which yarn under nose ring is cut 审中-公开
标题翻译：用于通过纱线在绳索下切割的切割头的切割头
公开(公告)号：JP2005295975A
公开(公告)日：2005-10-27
申请号：JP2004141701
申请日：2004-04-08
申请人： Masahiro Koizumi , 正弘小泉
发明人： KOIZUMI MASAHIRO
IPC分类号： A01K91/06
摘要： PROBLEM TO BE SOLVED: To provide a terminal tackle for angling by decoy enabling recovery of decoy sweetfish.
SOLUTION: In a terminal tackle set for angling by decoy and a terminal tackle around a nose ring which is a component for the set, a yarn above the nose ring including the nose ring is strengthened and a yarn ranging from a part under the nose ring to a reverse needle is weakened, and further, in all components, the yarn ranging from the part under the nose ring to the reverse needle is made weakest.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过诱饵提供钓鱼终端钓具，以恢复诱饵鲶鱼。解决方案：在通过诱饵设置的终端滑车组件和作为该组件的组件的鼻环周围的端子滑车上，包括鼻环的鼻环上方的纱线被加强，并且纱线从下方的部分反向针的鼻环被削弱，而且在所有部件中，从鼻环部分到反针部分的纱线最弱。版权所有（C）2006，JPO＆NCIPI

3. 发明授权

US08183607B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US08183607B2
公开(公告)日：2012-05-22
申请号：US13189883
申请日：2011-07-25
申请人： Ryoichi Kajiwara , Masahiro Koizumi , Toshiaki Morita , Kazuya Takahashi , Munehisa Kishimoto , Shigeru Ishii , Toshinori Hirashima , Yasushi Takahashi , Toshiyuki Hata , Hiroshi Sato , Keiichi Ookawa
发明人： Ryoichi Kajiwara , Masahiro Koizumi , Toshiaki Morita , Kazuya Takahashi , Munehisa Kishimoto , Shigeru Ishii , Toshinori Hirashima , Yasushi Takahashi , Toshiyuki Hata , Hiroshi Sato , Keiichi Ookawa
IPC分类号： H01L29/94 , H01L21/00 , H01R9/00
CPC分类号： H01L23/49555 , H01L21/4814 , H01L21/56 , H01L21/561 , H01L21/565 , H01L23/28 , H01L23/3107 , H01L23/495 , H01L23/4952 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L23/49582 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/81 , H01L24/83 , H01L24/84 , H01L24/97 , H01L29/7833 , H01L2224/0401 , H01L2224/04026 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/16245 , H01L2224/29011 , H01L2224/29015 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/37011 , H01L2224/40095 , H01L2224/40225 , H01L2224/45124 , H01L2224/45139 , H01L2224/73253 , H01L2224/75251 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2224/83101 , H01L2224/83138 , H01L2224/83191 , H01L2224/83825 , H01L2224/8385 , H01L2224/83851 , H01L2224/84801 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/18301 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H05K3/3426 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/01049 , H01L2924/01083 , H01L2224/29139 , H01L2924/3512 , H01L2224/48 , H01L2924/00012
摘要： A semiconductor device features a semiconductor chip including a MOSFET, a first electrode of the MOSFET disposed on an obverse surface of the chip, a second, control electrode of the MOSFET disposed on the obverse surface, a third electrode of the MOSFET disposed on a second, opposing surface of the chip, first, second, and third conductive members, each having top surface and opposing bottom surface, the first, second, and third conductive members connecting with the first, second, and third electrodes electrically, respectively, a sealing body having top and bottom surfaces and sealing parts of the first, second, and third conductive members, the first conductive member having first, second, and third contiguous portions, the first portion is positioned over the first electrode, the second is positioned between the first and second portions and the third portion is positioned under the obverse surface of the chip.
摘要翻译：半导体器件具有包括MOSFET的半导体芯片，设置在芯片的正面上的MOSFET的第一电极，设置在正面的MOSFET的第二控制电极，设置在第二个MOSFET上的MOSFET的第三电极分别具有顶表面和相对的底表面的芯片，第一，第二和第三导电构件的相对表面，第一，第二和第三导电构件分别与第一，第二和第三电极电连接，密封本体具有第一，第二和第三导电构件的顶表面和底表面和密封部分，第一导电构件具有第一，第二和第三邻接部分，第一部分位于第一电极上方，第二部分位于第第一和第二部分，并且第三部分位于芯片的正面下方。

5. 发明申请

US20070023486A1 Apparatus and a method of soldering a part to a board 有权
标题翻译：将部件焊接到电路板的装置和方法
公开(公告)号：US20070023486A1
公开(公告)日：2007-02-01
申请号：US11486084
申请日：2006-07-14
申请人： Masanari Matsuura , Masahiro Koizumi , Masaya Tsuruta , Tomoyuki Kubota , Yoshiyuki Nakamura
发明人： Masanari Matsuura , Masahiro Koizumi , Masaya Tsuruta , Tomoyuki Kubota , Yoshiyuki Nakamura
IPC分类号： B23K31/02
CPC分类号： B23K1/002 , B23K2101/42 , H01L2224/81222 , H01L2924/01019 , H01L2924/01068 , H05K3/3494 , H05K2203/101
摘要： The present invention provides technology that uniformly heats and melts a plurality of solder material arranged in a plurality of locations on a board, and uniformly solders a plurality of parts to the board that are arranged in a plurality of locations on the board. A soldering apparatus includes an induction coil having a length in the longitudinal direction that is longer than the length of the board. An inner space having a size sufficient to arrange the board therein is maintained inside the induction coil. The board supporting the parts and the solder material will be positioned in the approximate center of the inner space of the induction coil. An alternating current will flow through the induction coil in this state. An alternating magnetic field will be generated in the inner space of the induction coil. Magnetic fluxes will substantially uniformly pass through the inner space of the induction coil along the longitudinal direction of the induction coil. In this way, the plurality of solder material arranged on a plurality of locations on the board may be uniformly heated and melted. The plurality of parts arranged on a plurality of locations on the board may be uniformly soldered to the board because the plurality of solder material may be uniformly heated and melted due to magnetic fluxes that uniformly passing through the board.
摘要翻译：本发明提供了均匀地加热和熔化布置在板上的多个位置的多个焊料的技术，并且将多个部件均匀地焊接到布置在板上的多个位置中的板。一种焊接装置，其特征在于，具有长度方向的长度大于所述基板的长度的感应线圈。在感应线圈内保持具有足以将板布置在其中的尺寸的内部空间。支撑部件和焊料的板将位于感应线圈的内部空间的大致中心。在这种状态下，交流电将流过感应线圈。在感应线圈的内部空间中将产生交变磁场。磁通量将基本均匀地沿着感应线圈的纵向方向通过感应线圈的内部空间。以这种方式，布置在板上的多个位置上的多个焊料材料可以被均匀地加热和熔化。由于多个焊料材料由于均匀地通过板的磁通而被均匀地加热和熔化，所以布置在板上的多个位置上的多个部件可以均匀地焊接到板上。

6. 发明授权

US07141741B2 Circuit board 失效
标题翻译：电路板
公开(公告)号：US07141741B2
公开(公告)日：2006-11-28
申请号：US10665523
申请日：2003-09-22
申请人： Kazuji Yamada , Akira Tanaka , Ryuichi Saito , Yasutoshi Kurihara , Tadao Kushima , Takashi Haramaki , Yoshihiko Koike , Takashi Hosokawa , Mamoru Sawahata , Masahiro Koizumi , Jin Onuki , Kazuhiro Suzuki , Isao Kobayashi , Hideo Shimizu , Yutaka Higashimura , Shigeki Sekine , Nobuya Koike , Hideya Kokubun
发明人： Kazuji Yamada , Akira Tanaka , Ryuichi Saito , Yasutoshi Kurihara , Tadao Kushima , Takashi Haramaki , Yoshihiko Koike , Takashi Hosokawa , Mamoru Sawahata , Masahiro Koizumi , Jin Onuki , Kazuhiro Suzuki , Isao Kobayashi , Hideo Shimizu , Yutaka Higashimura , Shigeki Sekine , Nobuya Koike , Hideya Kokubun
IPC分类号： H05K1/03
CPC分类号： H01L23/49562 , H01L23/049 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/072 , H01L25/18 , H01L2224/32225 , H01L2224/45015 , H01L2224/451 , H01L2224/48011 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49171 , H01L2224/49431 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/19043 , H01L2924/2076 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H02M7/003 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor device in which electrodes of a plurality of semiconductor elements are bonded onto at least one of a plurality of electrode patterns on an insulator substrate, the other surface of the insulator substrate being bonded to a heat dissipating base. The upper surface of the heat dissipating base is covered with a member for cutting off the semiconductor elements from the outer environment. Terminals electrically connect the electrodes on said insulator substrate and the electrode placed outside the cutoff member. The material of the heat dissipating base has a linear expanding coefficient larger than that of the semiconductor element and smaller than three times that of the semiconductor element, and a thermal conductivity larger than 100 W/mK. The semiconductor elements are arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.
摘要翻译：一种半导体器件，其中多个半导体元件的电极被结合到绝缘体基板上的多个电极图案中的至少一个上，绝缘体基板的另一个表面被结合到散热基底。散热基座的上表面覆盖有用于从外部环境切断半导体元件的构件。端子电连接所述绝缘体基板上的电极和放置在切断构件外部的电极。散热基体的材料的线膨胀系数大于半导体元件的线膨胀系数，小于半导体元件的三倍，热导率大于100W / mK。半导体元件布置在绝缘体基板上的至少一个电极表面和由另一个电极表面划分的至少两个区域中。

7. 发明授权

US06434008B1 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US06434008B1
公开(公告)日：2002-08-13
申请号：US09385632
申请日：1998-08-27
申请人： Kazuji Yamada , Akira Tanaka , Ryuichi Saito , Yasutoshi Kurihara , Tadao Kushima , Takashi Haramaki , Yoshihiko Koike , Takashi Hosokawa , Mamoru Sawahata , Masahiro Koizumi , Jin Onuki , Kazuhiro Suzuki , Isao Kobayashi , Hideo Shimizu , Yutaka Higashimura , Shigeki Sekine , Nobuya Koike , Hideya Kokubun
发明人： Kazuji Yamada , Akira Tanaka , Ryuichi Saito , Yasutoshi Kurihara , Tadao Kushima , Takashi Haramaki , Yoshihiko Koike , Takashi Hosokawa , Mamoru Sawahata , Masahiro Koizumi , Jin Onuki , Kazuhiro Suzuki , Isao Kobayashi , Hideo Shimizu , Yutaka Higashimura , Shigeki Sekine , Nobuya Koike , Hideya Kokubun
IPC分类号： H05K702
CPC分类号： H01L23/49562 , H01L23/049 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/072 , H01L25/18 , H01L2224/32225 , H01L2224/45015 , H01L2224/451 , H01L2224/48011 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49171 , H01L2224/49431 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/19043 , H01L2924/2076 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H02M7/003 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base, the upper surface of the heat dissipating base being covered with a member for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements being arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.
摘要翻译：一种半导体器件，其中多个半导体元件被结合到绝缘体衬底上的至少一个电极图案上，所述绝缘体衬底在主表面上形成多个电极图案，所述半导体元件的每个电极电连接到所述电极图案，绝缘体基板的另一表面被结合到散热基底上，散热基座的上表面覆盖有用于从外部环境切断半导体元件的构件，将绝缘体基板上的电极与电极电连接的端子设置在切断部件外侧，散热基体的材料的线膨胀系数大于半导体元件的线膨胀系数，小于半导体元件的线膨胀系数的3倍，导热系数大于100 W / mK，半音电感元件布置在至少一个电极表面上，并且在至少两个区域中被绝缘体基底上的另一个电极表面分隔。

8. 发明授权

US5892974A System for sub-data processor identifies the peripheral from supplied identification data and supplies data indicative of the kind of peripheral to main data processor 失效
标题翻译：用于子数据处理器的系统从提供的标识数据识别外围设备，并向主数据处理器提供指示外设种类的数据
公开(公告)号：US5892974A
公开(公告)日：1999-04-06
申请号：US656226
申请日：1996-09-24
申请人： Masahiro Koizumi , Naoki Niizuma , Yasuhisa Kawase , Hamjime Ikebe , Masaki Kawabori
发明人： Masahiro Koizumi , Naoki Niizuma , Yasuhisa Kawase , Hamjime Ikebe , Masaki Kawabori
IPC分类号： G06F13/14 , A63F13/06 , G06F3/033 , G06F3/038 , G06F13/40 , G06F9/445
CPC分类号： A63F13/23 , A63F13/06 , G06F13/4068 , G06F3/0383 , A63F2300/1025
摘要： A data processing apparatus achieves high-speed image control, image control responding rapidly to the content of the operation of a peripheral, avoidance of possible wrong recognition of the peripheral. A subCPU is connected through a CPU bus to a main CPU which provides image control, etc. When the main CPU delivers command data to the subCPU through a register table, the subCPU determines peripheral data collection timing and collects peripheral data from the peripheral at that timing. The main CPU receives through the register table the peripheral data collected by the subCPU. The subCPU receives the peripheral data ID-1 (identification data) twice. If both the values of those peripheral data are different, the main CPU determines that the peripheral has not been connected to the peripheral port.
摘要翻译： PCT No.PCT / JP95 / 02072 Sec。 371日期：1996年9月24日 102（e）1996年9月24日PCT PCT 1995年10月11日PCT公布。公开号WO96 / 12249 日期1996年04月25日数据处理装置实现了高速图像控制，图像控制快速响应于外围设备的操作内容，避免了外围设备可能的错误识别。子CPU通过CPU总线连接到提供图像控制等的主CPU。当主CPU通过寄存器表将命令数据传送到子CPU时，subCPU确定外设数据采集定时，并从外设收集周边数据定时。主CPU通过寄存器表接收由subCPU收集的外围数据。子CPU接收外围数据ID-1（识别数据）两次。如果这两个外设数据的值都不同，则主CPU确定外设尚未连接到外围端口。

10. 发明授权

US07985991B2 MOSFET package 有权
标题翻译： MOSFET封装
公开(公告)号：US07985991B2
公开(公告)日：2011-07-26
申请号：US12046741
申请日：2008-03-12
申请人： Ryoichi Kajiwara , Masahiro Koizumi , Toshiaki Morita , Kazuya Takahashi , Munehisa Kishimoto , Shigeru Ishii , Toshinori Hirashima , Yasushi Takahashi , Toshiyuki Hata , Hiroshi Sato , Keiichi Ookawa
发明人： Ryoichi Kajiwara , Masahiro Koizumi , Toshiaki Morita , Kazuya Takahashi , Munehisa Kishimoto , Shigeru Ishii , Toshinori Hirashima , Yasushi Takahashi , Toshiyuki Hata , Hiroshi Sato , Keiichi Ookawa
IPC分类号： H01L29/94 , H01L21/00 , H01R9/00
CPC分类号： H01L23/49555 , H01L21/4814 , H01L21/56 , H01L21/561 , H01L21/565 , H01L23/28 , H01L23/3107 , H01L23/495 , H01L23/4952 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L23/49582 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/81 , H01L24/83 , H01L24/84 , H01L24/97 , H01L29/7833 , H01L2224/0401 , H01L2224/04026 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/16245 , H01L2224/29011 , H01L2224/29015 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/37011 , H01L2224/40095 , H01L2224/40225 , H01L2224/45124 , H01L2224/45139 , H01L2224/73253 , H01L2224/75251 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2224/83101 , H01L2224/83138 , H01L2224/83191 , H01L2224/83825 , H01L2224/8385 , H01L2224/83851 , H01L2224/84801 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/18301 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H05K3/3426 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/01049 , H01L2924/01083 , H01L2224/29139 , H01L2924/3512 , H01L2224/48 , H01L2924/00012
摘要： A semiconductor device features a semiconductor substrate with a MOSFET, an electrode for main current of the MOSFET disposed on a first major surface of the substrate, an electrode for control of the MOSFET disposed on the first major surface, a rear plane electrode of the MOSFET disposed on a second, opposing surface of the substrate, and an external connection terminal electrically connected to the rear plane electrode, the external electrode contains a first part, a second part and a third part, the first part is positioned over the rear plane electrode, the third part is positioned below the second major surface and the third part is connected via the second part to the first part.
摘要翻译：半导体器件具有半导体衬底，其具有MOSFET，用于设置在衬底的第一主表面上的MOSFET的主电流的电极，用于控制设置在第一主表面上的MOSFET的电极，MOSFET的后平面电极设置在所述基板的第二相对表面上，以及电连接到所述后平面电极的外部连接端子，所述外部电极包含第一部分，第二部分和第三部分，所述第一部分位于所述后平面电极，第三部分位于第二主表面下方，第三部分经由第二部分连接到第一部分。

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