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1. 发明授权

US07327004B2 Sensor device 有权
标题翻译：传感器装置
公开(公告)号：US07327004B2
公开(公告)日：2008-02-05
申请号：US11294580
申请日：2005-12-06
申请人： Koji Hattori , Takao Yoneyama , Ryuichiro Abe , Minekazu Sakai , Shigenori Yamauchi
发明人： Koji Hattori , Takao Yoneyama , Ryuichiro Abe , Minekazu Sakai , Shigenori Yamauchi
IPC分类号： H01L29/84
CPC分类号： G01C19/5719 , B81C1/0023 , B81C1/00238 , G01P1/023 , G01P15/125 , H01L2224/48091 , H01L2224/73265 , H01L2924/1305 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： A sensor device includes a sensor chip having a movable portion on one surface, a circuit chip laminated with the sensor chip to be opposite to the movable portion of the sensor chip, and a bump located between the sensor chip and the circuit chip. In the sensor device, the sensor chip and the circuit chip are electrically connected through the bump, and the movable portion of the sensor chip is separated from the circuit chip by a space using the bump. Accordingly, it can effectively restrict parasitic capacity of an electric connecting portion between both the chips from being changed by an impact. For example, the sensor device can be used as an angular velocity sensor device having a vibrator as the movable portion.
摘要翻译：传感器装置包括在一个表面上具有可移动部分的传感器芯片，与传感器芯片层叠以与传感器芯片的可移动部分相对的电路芯片，以及位于传感器芯片和电路芯片之间的凸块。在传感器装置中，传感器芯片和电路芯片通过凸块电连接，并且传感器芯片的可移动部分使用凸块与电路芯片分离。因此，能够有效地抑制两个芯片之间的电连接部的寄生容量受到冲击而变化。例如，传感器装置可以用作具有振动器作为可动部分的角速度传感器装置。

2. 发明申请

US20060097331A1 Sensor device 有权
标题翻译：传感器装置
公开(公告)号：US20060097331A1
公开(公告)日：2006-05-11
申请号：US11294580
申请日：2005-12-06
申请人： Koji Hattori , Takao Yoneyama , Ryuichiro Abe , Minekazu Sakai , Shigenori Yamauchi
发明人： Koji Hattori , Takao Yoneyama , Ryuichiro Abe , Minekazu Sakai , Shigenori Yamauchi
IPC分类号： H01L29/82
CPC分类号： G01C19/5719 , B81C1/0023 , B81C1/00238 , G01P1/023 , G01P15/125 , H01L2224/48091 , H01L2224/73265 , H01L2924/1305 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： A sensor device includes a sensor chip having a movable portion on one surface, a circuit chip laminated with the sensor chip to be opposite to the movable portion of the sensor chip, and a bump located between the sensor chip and the circuit chip. In the sensor device, the sensor chip and the circuit chip are electrically connected through the bump, and the movable portion of the sensor chip is separated from the circuit chip by a space using the bump. Accordingly, it can effectively restrict parasitic capacity of an electric connecting portion between both the chips from being changed by an impact. For example, the sensor device can be used as an angular velocity sensor device having a vibrator as the movable portion.
摘要翻译：传感器装置包括在一个表面上具有可移动部分的传感器芯片，与传感器芯片层叠以与传感器芯片的可移动部分相对的电路芯片，以及位于传感器芯片和电路芯片之间的凸块。在传感器装置中，传感器芯片和电路芯片通过凸块电连接，并且传感器芯片的可移动部分使用凸块与电路芯片分离。因此，能够有效地抑制两个芯片之间的电连接部的寄生容量受到冲击而变化。例如，传感器装置可以用作具有振动器作为可动部分的角速度传感器装置。

3. 发明申请

US20070090536A1 Sensor having semiconductor chip and circuit chip 审中-公开
标题翻译：传感器具有半导体芯片和电路芯片
公开(公告)号：US20070090536A1
公开(公告)日：2007-04-26
申请号：US11522916
申请日：2006-09-19
申请人： Minekazu Sakai , Ryuichiro Abe , Yasunori Ninomiya
发明人： Minekazu Sakai , Ryuichiro Abe , Yasunori Ninomiya
IPC分类号： H01L23/48
CPC分类号： G01C19/5719 , B81C1/0023 , G01P1/023 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/16 , H01L2924/01068 , H01L2924/01079 , H01L2924/1305 , H01L2924/13091 , H01L2924/00 , H01L2924/00014
摘要： A sensor includes: a semiconductor chip having a sensing portion; a circuit chip; and first and second films. The sensing portion is disposed on a first side of the semiconductor chip. The first side of the semiconductor chip is electrically connected to the circuit chip through a bump. The first side of the semiconductor chip faces the circuit chip. The first film is disposed on the first side of the semiconductor chip. The first film covers the sensing portion, and is made of resin, and the second film is made of resin, and disposed on a second side of the semiconductor chip.
摘要翻译：传感器包括：具有感测部分的半导体芯片; 电路芯片; 第一和第二部电影。感测部分设置在半导体芯片的第一侧上。半导体芯片的第一侧通过凸块与电路芯片电连接。半导体芯片的第一面面向电路芯片。第一膜设置在半导体芯片的第一侧上。第一膜覆盖感测部分，并且由树脂制成，第二膜由树脂制成，并且设置在半导体芯片的第二侧上。

4. 发明申请

US20070007607A1 Semiconductor sensor and manufacturing mehtod therefor 失效
标题翻译：半导体传感器及其制造方法
公开(公告)号：US20070007607A1
公开(公告)日：2007-01-11
申请号：US11455919
申请日：2006-06-20
申请人： Minekazu Sakai , Ryuichiro Abe , Akitoshi Yamanaka
发明人： Minekazu Sakai , Ryuichiro Abe , Akitoshi Yamanaka
IPC分类号： H01L29/41 , H01L21/56 , G01D5/12 , G01P15/125
CPC分类号： G01P15/0802 , B81B7/007 , G01P15/125 , G01P2015/0814 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/0566 , H01L2224/45124 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/85201 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/181 , H01L2924/30105 , H01L2924/3025 , Y10T29/49002 , H01L2924/00 , H01L2224/4876 , H01L2224/4866
摘要： A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.
摘要翻译：公开了一种半导体传感器，其包括半导体衬底，设置在半导体衬底上的感测部分，以及与感测部分电连接并设置在半导体衬底上的焊盘。半导体传感器还包括与焊盘电连通的接合线。此外，半导体传感器包括覆盖部件，覆盖部分设置在半导体衬底上，用于覆盖感测部分，使得覆盖部分与感测部分隔开一段距离。盖构件还包括在包括衬垫的区域处设置在半导体衬底上的耦合部分，并且用于使焊盘与通过其的接合线电连接。

5. 发明授权

US07770452B2 Semiconductor sensor and manufacturing method therefor 有权
标题翻译：半导体传感器及其制造方法
公开(公告)号：US07770452B2
公开(公告)日：2010-08-10
申请号：US12081512
申请日：2008-04-17
申请人： Minekazu Sakai , Ryuichiro Abe , Akitoshi Yamanaka
发明人： Minekazu Sakai , Ryuichiro Abe , Akitoshi Yamanaka
IPC分类号： G01P15/00
CPC分类号： G01P15/0802 , B81B7/007 , G01P15/125 , G01P2015/0814 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/0566 , H01L2224/45124 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/85201 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/181 , H01L2924/30105 , H01L2924/3025 , Y10T29/49002 , H01L2924/00 , H01L2224/4876 , H01L2224/4866
摘要： A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.
摘要翻译：公开了一种半导体传感器，其包括半导体衬底，设置在半导体衬底上的感测部分，以及与感测部分电连接并设置在半导体衬底上的焊盘。半导体传感器还包括与焊盘电连通的接合线。此外，半导体传感器包括覆盖部件，覆盖部分设置在半导体衬底上，用于覆盖感测部分，使得覆盖部分与感测部分隔开一段距离。所述盖构件还包括在包括所述焊盘的区域处设置在所述半导体衬底上的耦合部分，并且用于使所述焊盘与所述接合线电连接。

6. 发明申请

US20080196501A1 Semiconductor sensor and manufacturing method therefor 有权
标题翻译：半导体传感器及其制造方法
公开(公告)号：US20080196501A1
公开(公告)日：2008-08-21
申请号：US12081512
申请日：2008-04-17
申请人： Minekazu Sakai , Ryuichiro Abe , Akitoshi Yamanaka
发明人： Minekazu Sakai , Ryuichiro Abe , Akitoshi Yamanaka
IPC分类号： G01P15/125
CPC分类号： G01P15/0802 , B81B7/007 , G01P15/125 , G01P2015/0814 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/0566 , H01L2224/45124 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/85201 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/181 , H01L2924/30105 , H01L2924/3025 , Y10T29/49002 , H01L2924/00 , H01L2224/4876 , H01L2224/4866
摘要： A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.
摘要翻译：公开了一种半导体传感器，其包括半导体衬底，设置在半导体衬底上的感测部分，以及与感测部分电连接并设置在半导体衬底上的焊盘。半导体传感器还包括与焊盘电连通的接合线。此外，半导体传感器包括覆盖部件，覆盖部分设置在半导体衬底上，用于覆盖感测部分，使得覆盖部分与感测部分隔开一段距离。盖构件还包括在包括衬垫的区域处设置在半导体衬底上的耦合部分，并且用于使焊盘与通过其的接合线电连接。

7. 发明授权

US07373821B2 Semiconductor sensor and manufacturing method therefor 失效
公开(公告)号：US07373821B2
公开(公告)日：2008-05-20
申请号：US11455919
申请日：2006-06-20
申请人： Minekazu Sakai , Ryuichiro Abe , Akitoshi Yamanaka
发明人： Minekazu Sakai , Ryuichiro Abe , Akitoshi Yamanaka
IPC分类号： G01P15/00
CPC分类号： G01P15/0802 , B81B7/007 , G01P15/125 , G01P2015/0814 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/0566 , H01L2224/45124 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/85201 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/181 , H01L2924/30105 , H01L2924/3025 , Y10T29/49002 , H01L2924/00 , H01L2224/4876 , H01L2224/4866
摘要： A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.

8. 发明授权

US06199430B1 Acceleration sensor with ring-shaped movable electrode 有权
标题翻译：带环形可动电极的加速度传感器
公开(公告)号：US06199430B1
公开(公告)日：2001-03-13
申请号：US09241137
申请日：1999-02-02
申请人： Kazuhiko Kano , Koji Hattori , Yoshinori Ohtsuka , Makiko Sugiura , Minekazu Sakai , Inao Toyoda , Yasutoshi Suzuki , Seiichiro Ishio , Minoru Murata
发明人： Kazuhiko Kano , Koji Hattori , Yoshinori Ohtsuka , Makiko Sugiura , Minekazu Sakai , Inao Toyoda , Yasutoshi Suzuki , Seiichiro Ishio , Minoru Murata
IPC分类号： G01P15125
CPC分类号： B81B7/0006 , B81B2201/0235 , G01P15/0802 , G01P15/125 , G01P15/135 , G01P15/18 , G01P2015/0817 , G01P2015/0828 , G01V1/181 , H01H1/0036
摘要： An acceleration sensor has a ring-shaped movable electrode connected to an anchor part via beams and a fixed electrode facing the ring-shaped movable electrode defining a specific interval, which are disposed on a substrate. The movable electrode is displaced by acceleration approximately in parallel to the substrate and contacts the fixed electrode, so that the acceleration is detected. The fixed electrode is divided into a detecting fixed electrode for contacting the movable electrode and a sensitivity controlling fixed electrode insulated from the detecting fixed electrode. Accordingly, potential differences between the movable electrode and the detecting fixed electrode and between the movable electrode and the sensitivity controlling fixed electrode are independently controlled to control sensitivity of acceleration.
摘要翻译：加速度传感器具有环形可动电极，其经由梁和固定电极连接到锚定部分，固定电极面向限定特定间隔的环形可动电极，该固定电极设置在基板上。可移动电极通过与基板大致平行的加速移位，并与固定电极接触，从而检测加速度。固定电极被分成用于接触可动电极的检测固定电极和与检测固定电极绝缘的灵敏度控制固定电极。因此，独立地控制可动电极和检测用固定电极之间以及可动电极与灵敏度控制固定电极之间的电位差，以控制加速度的灵敏度。

9. 发明申请

US20110248363A1 PHYSICAL QUANTITY DETECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：物理量检测装置及其制造方法
公开(公告)号：US20110248363A1
公开(公告)日：2011-10-13
申请号：US13083732
申请日：2011-04-11
申请人： Tetsuo FUJII , Minekazu Sakai , Takumi Shibata
发明人： Tetsuo FUJII , Minekazu Sakai , Takumi Shibata
IPC分类号： H01L29/84 , H01L21/20
CPC分类号： G01L9/0005
摘要： A physical quantity detection device includes: an insulating layer; a semiconductor layer on the insulating layer; and first and second electrodes in the semiconductor layer. Each electrode has a wall part, one of which includes two diaphragms and a cover part. The diaphragms facing each other provide a hollow cylinder having an opening covered by the cover part. One diaphragm faces the other wall part or one diaphragm in the other wall part. A distance between the one diaphragm and the other wall part or the one diaphragm in the other wall part is changed with pressure difference between reference pressure in the hollow cylinder and pressure of an outside when a physical quantity is applied to the diaphragms. The physical quantity is detected by a capacitance between the first and second electrodes.
摘要翻译：物理量检测装置包括：绝缘层; 绝缘层上的半导体层; 以及半导体层中的第一和第二电极。每个电极具有壁部分，其中一个包括两个隔膜和盖部分。彼此相对的隔膜提供具有由盖部分覆盖的开口的中空圆柱体。一个隔膜面对另一个壁部分或另一个壁部分的一个隔膜。当物理量施加到隔膜时，一个隔膜和另一个壁部分中的另一个壁部分或一个隔膜之间的距离随空心圆柱体中的参考压力和外部压力之间的压力差而改变。物理量由第一和第二电极之间的电容检测。

10. 发明授权

US07678589B2 Semiconductor device for providing capacitive semiconductor sensor and method for manufacturing capacitive semiconductor sensor 有权
标题翻译：用于提供电容半导体传感器的半导体器件和用于制造电容半导体传感器的方法
公开(公告)号：US07678589B2
公开(公告)日：2010-03-16
申请号：US11723428
申请日：2007-03-20
申请人： Minekazu Sakai , Tameharu Oota
发明人： Minekazu Sakai , Tameharu Oota
IPC分类号： H01L21/66
CPC分类号： G01P15/125 , B81C1/00238 , B81C99/004 , G01P15/0802 , H01L2224/94
摘要： A method for manufacturing a capacitive semiconductor sensor includes: forming a plurality of circuit chips in a wafer, wherein each circuit chip includes a pad for testing a sensor chip; bonding the sensor chip on each circuit chip with a bump so that the sensor chip is electrically coupled with the circuit chip, wherein each sensor chip is made of semiconductor and has a capacitance changing portion, which is disposed on one side of the sensor chip and has a variable capacitance, wherein the circuit chip detects a capacitance change of the sensor chip, and wherein the one side of the sensor chip faces the circuit chip; testing each sensor chip through the pad; and cutting the wafer into individual circuit chips so that the circuit chip and the sensor chip provide the capacitive semiconductor sensor.
摘要翻译：制造电容式半导体传感器的方法包括：在晶片中形成多个电路芯片，其中每个电路芯片包括用于测试传感器芯片的焊盘; 将每个电路芯片上的传感器芯片与凸块接合，使得传感器芯片与电路芯片电耦合，其中每个传感器芯片由半导体制成，并具有电容改变部分，其设置在传感器芯片的一侧，具有可变电容，其中电路芯片检测传感器芯片的电容变化，并且其中传感器芯片的一侧面向电路芯片; 通过垫片测试每个传感器芯片; 并将晶片切割成单独的电路芯片，使得电路芯片和传感器芯片提供电容半导体传感器。

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