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    • 3. 发明授权
    • Nonvolatile memory process
    • 非易失性存储过程
    • US5474947A
    • 1995-12-12
    • US172984
    • 1993-12-27
    • Ko-Min ChangBruce L. MortonHenry Y. ChoeClinton C. K. Kuo
    • Ko-Min ChangBruce L. MortonHenry Y. ChoeClinton C. K. Kuo
    • H01L21/8247
    • H01L27/11517
    • A process for fabricating an improved nonvolatile memory device includes the formation of a control gate electrode (70) which overlies a floating gate electrode (42) and is separated therefrom by an inter-level-dielectric layer (62). The control gate electrode (70) and the underlying floating gate electrode (42) form a stacked gate structure (72) located in the active region (44) of a semiconductor substrate (40). An electrically insulating sidewall spacer (54) is formed at the edges of the floating gate electrode (42) and electrically isolates the control gate (70) from the semiconductor substrate (40). During the fabrication process, implanted memory regions (56, 58) are formed in the active region (44) prior to the formation of control gate electrode (70). A word-line (68) and the control gate (70) are formed by anisotropic etching of a semiconductor layer (66), which is deposited to overlie inter-level-dielectric layer (62). During the etching process, inter-level-dielectric layer (62) prevents the removal of surface portions of semiconductor substrate (40).
    • 一种用于制造改进的非易失性存储器件的方法包括形成覆盖在浮栅电极(42)上的控制栅电极(70),并通过层间电介质层(62)与其分开。 控制栅电极(70)和底层浮栅电极(42)形成位于半导体衬底(40)的有源区(44)中的层叠栅结构(72)。 在浮栅电极(42)的边缘处形成电绝缘的侧壁间隔物(54),并将控制栅极(70)与半导体衬底(40)电隔离。 在制造过程中,在形成控制栅电极(70)之前,在有源区(44)中形成植入的存储区(56,58)。 通过各向异性蚀刻形成字线(68)和控制栅极(70),半导体层(66)沉积到层间电介质层(62)上。 在蚀刻过程中,层间电介质层(62)防止去除半导体衬底(40)的表面部分。
    • 4. 发明授权
    • Apparatus and method for erasing a flash EEPROM
    • 擦除闪存EEPROM的装置和方法
    • US5357476A
    • 1994-10-18
    • US69327
    • 1993-06-01
    • Clinton C. K. KuoKo-Min ChangHenry Y. Choe
    • Clinton C. K. KuoKo-Min ChangHenry Y. Choe
    • G11C16/16G11C16/34G11C11/34
    • G11C16/3409G11C16/16G11C16/3404
    • A flash EEPROM array (22) is erased and a threshold voltage distribution of the erased flash EEPROM cells (36, 39-46) is converged to within a predetermined voltage range by using a two-step erasing procedure. In the first step, flash EEPROM array (22) is electrically bulk erased using a conventional bulk erase procedure. Electrons are tunneled from the floating gate (38) to the source, causing cells (36, 39-46) to have a relatively low threshold voltage. In the second step, the threshold voltage distribution of the array (22) is converged to within the predetermined voltage range by grounding the source and drain of each cell (36, 39-46), while concurrently applying a high positive voltage to the control gate (27) of each cell (36, 39-46). Some electrons are tunneled back to the floating gate (38), thus converging the threshold voltage distribution to within a predetermined range.
    • 闪存EEPROM阵列(22)被擦除,并且擦除的快闪EEPROM单元(36,39-46)的阈值电压分布通过使用两步擦除过程而被收敛到预定电压范围内。 在第一步中,使用传统的大容量擦除程序,电子体积擦除快闪EEPROM阵列(22)。 电子从浮动栅极(38)隧穿到源极,导致电池(36,39-46)具有相对低的阈值电压。 在第二步骤中,通过使每个单元(36,39-46)的源极和漏极接地而将阵列(22)的阈值电压分布收敛到预定电压范围内,同时向控制器施加高正电压 (36,39-46)的门(27)。 一些电子被隧穿回到浮动栅极(38),从而将阈值电压分布会聚到预定范围内。
    • 7. 发明授权
    • Static RAM with test features
    • 具有测试功能的静态RAM
    • US5428574A
    • 1995-06-27
    • US701536
    • 1991-03-28
    • Clinton C. K. KuoErnest A. Carter
    • Clinton C. K. KuoErnest A. Carter
    • G11C29/02G11C29/50G11C7/06
    • G11C29/025G11C29/02G11C29/50G11C29/50016G11C11/41G11C2029/5006
    • A static RAM includes test features which provide for the detection of soft defects which may cause a defective SRAM cell to behave as a functional DRAM cell. Provision is made for writing either a high or a low logic state to each bit line of the SRAM while not writing any value to its complementary bit line and for sensing the state of each bit line independently of the state of its complementary bit line. In addition, a current test is provided which detects soft defects by means of the increased inverter leakage current caused thereby. It is possible, by properly combining these tests, to reliably detect all soft defects, thereby assuring the data retention capability of the SRAM. This technique avoids the long hold time and/or high temperature test techniques used in the prior art.
    • 静态RAM包括提供检测软缺陷的测试特征,这可能导致有缺陷的SRAM单元表现为功能性DRAM单元。 提供写入高或低逻辑状态到SRAM的每个位线,而不向其互补位线写入任何值,并且用于独立于其互补位线的状态来感测每个位线的状态。 此外,提供了通过由此引起的增加的逆变器漏电流来检测软缺陷的电流测试。 通过适当组合这些测试,可以可靠地检测所有的软缺陷,从而保证SRAM的数据保留能力。 该技术避免了现有技术中使用的长的保持时间和/或高温测试技术。
    • 9. 发明授权
    • Sense amplifier using different threshold MOS devices
    • 感应放大器使用不同的阈值MOS器件
    • US4459497A
    • 1984-07-10
    • US342040
    • 1982-01-25
    • Clinton C. K. KuoHorst Leuschner
    • Clinton C. K. KuoHorst Leuschner
    • G11C11/419H03K5/02H03K5/24G11C7/06
    • H03K5/023
    • A sense amplifier quickly charges a column line to a first predetermined voltage level with first, second and third transistors and then charges the column to a second predetermined voltage by using only the second and third transistors. The second and third transistors continue charging to the second predetermined voltage by virtue of having a lower threshold voltage than the first transistor. If a selected memory cell in the column is in a conducting state, the column charges to only the first predetermined voltage for detection as a logic "0". If the selected memory cell in the column is in a non-conducting state, the column continues charging to the second predetermined voltage for detection as a logic "1".
    • 读出放大器利用第一,第二和第三晶体管将列线快速充电到第一预定电压电平,然后仅使用第二和第三晶体管将该列充电至第二预定电压。 由于具有比第一晶体管低的阈值电压,第二和第三晶体管继续充电到第二预定电压。 如果列中选定的存储单元处于导通状态,则该列仅将第一预定电压充电至逻辑“0”。 如果列中所选择的存储单元处于非导通状态,则列继续充电到第二预定电压以作为逻辑“1”。