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    • 3. 发明授权
    • Method of forming a metal silicide film
    • 形成金属硅化物膜的方法
    • US5047111A
    • 1991-09-10
    • US110580
    • 1987-10-16
    • Akitoshi IshizakaYasuhiro ShirakiTakashi Ohshima
    • Akitoshi IshizakaYasuhiro ShirakiTakashi Ohshima
    • C30B1/02H01L21/285
    • H01L21/28518C30B1/023C30B29/10
    • Films of desired metal, e.g., Ni or Co, and of Si are laminated alternatelyn a single crystal silicon substrate to form a multi-layered structure, and thereafter the substrate is heated to grow an epitaxial NiSi.sub.2 or CoSi.sub.2 film in solid phase with less diffusion of Ni or Co atoms into the silicon substrate. Each layer in the multi-layered structure has a thickness selected in the range of 30-300 A with the overall composition ratio Si/Ni (or Si/Co) in the range of 1.8-2.0. The lamination process is done at a substrate temperature which does not cause the laminated films to react with the substrate and does not cause the multi-layered structure to become polycrystalline, e.g. below 350.degree. C. for the formation of an NiSi.sub.2 film or below 450.degree. C. for the formation of a CoSi.sub.2 film. The solid phase epitaxy is achieved at a substrate heating temperature in a range of 350.degree.-750.degree. C. for the formation of an epitaxial NiSi.sub.2 film or 450.degree.-1000.degree. C. for the formation of a CoSi.sub.2 film.
    • 将期望的金属(例如Ni或Co)和Si的膜交替层叠在单晶硅衬底上以形成多层结构,然后将衬底加热以生长外延NiSi 2或CoSi 2膜,固相少 Ni或Co原子扩散到硅衬底中。 多层结构中的每个层具有在30-300A范围内选择的厚度,Si / Ni(或Si / Co)的总组成比在1.8-2.0的范围内。 层压方法是在不使层压膜与基板反应而不会使多层结构变得多晶的基板温度下进行的。 低于350℃以形成NiSi2膜或低于450℃以形成CoSi 2膜。 在350〜-750℃的衬底加热温度下实现固相外延,用于形成外延NiSi2膜或450-1000℃以形成CoSi 2膜。