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1. 发明授权

US06800533B1 Integrated vertical spiral inductor on semiconductor material 有权
标题翻译：半导体材料上集成垂直螺旋电感
公开(公告)号：US06800533B1
公开(公告)日：2004-10-05
申请号：US09519427
申请日：2000-03-06
申请人： Kiat Seng Yeo , Hai Peng Tan , Jian Guo Ma , Manh Anh Do , Kok Wai Johnny Chew
发明人： Kiat Seng Yeo , Hai Peng Tan , Jian Guo Ma , Manh Anh Do , Kok Wai Johnny Chew
IPC分类号： H01L2120
CPC分类号： H01L23/645 , H01F17/0013 , H01F41/041 , H01L23/5227 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A new structure is provided for the creation of an inductor on the surface of a silicon semiconductor substrate. The inductor is of spiral design and perpendicular to the plane of the underlying substrate. Conductor line width can be selected as narrow or wide, ferromagnetic material can be used to fill the spaces between the conductors of the spiral inductor. The spiral inductor of the invention can further by used in series or in series with conventional horizontal inductors.
摘要翻译：提供了一种新的结构，用于在硅半导体衬底的表面上产生电感器。电感器具有螺旋设计并且垂直于下面的衬底的平面。导体线宽可以选择为窄或宽，铁磁材料可用于填充螺旋电感器导体之间的空间。本发明的螺旋电感器还可以与传统的水平电感器串联或串联使用。

2. 发明授权

US06803848B2 Integrated helix coil inductor on silicon 有权
标题翻译：在硅上集成螺旋线圈电感
公开(公告)号：US06803848B2
公开(公告)日：2004-10-12
申请号：US10271006
申请日：2002-10-15
申请人： Kiat Seng Yeo , Hai Peng Tan , Jian Guo Ma , Manh Anh Do , Kok Wai Johnny Chew
发明人： Kiat Seng Yeo , Hai Peng Tan , Jian Guo Ma , Manh Anh Do , Kok Wai Johnny Chew
IPC分类号： H01F500
CPC分类号： H01L28/10 , H01L27/08
摘要： A new structure and method is provided for the creation of an inductor on the surface of a silicon semiconductor substrate. The inductor is of a helix coil design having upper level and lower level conductors further having an axis whereby the axis of the helix coil of the inductor is parallel to the plane of the underlying substrate. Under the first embodiment of the invention, the height of the helix coil that is created on the surface of a silicon substrate is uniform. Under the second embodiment of the invention the height of the helix coil of the inductor of the invention is uniform while a ferromagnetic core is inserted between the upper and the lower level conductors of the helix coil. Under the third embodiment of the invention, the height of the helix coil that is created on the surface of a silicon substrate is non-uniform. Under the fourth embodiment of the invention the height of the helix coil of the inductor of the invention is non-uniform while a ferromagnetic core is inserted between the upper and the lower level conductors of the helix coil.
摘要翻译：提供了一种新的结构和方法，用于在硅半导体衬底的表面上形成电感器。电感器具有螺旋线圈设计，其具有上层和下层导体，其还具有轴线，由此电感器的螺旋线圈的轴线平行于下层衬底的平面。在本发明的第一实施例中，在硅衬底的表面上产生的螺旋线圈的高度是均匀的。在本发明的第二实施例中，本发明的电感器的螺旋线圈的高度是均匀的，而铁磁芯插入在螺旋线圈的上层和下层导体之间。在本发明的第三实施例中，在硅衬底的表面上产生的螺旋线圈的高度是不均匀的。在本发明的第四实施例中，本发明的电感器的螺旋线圈的高度是不均匀的，而铁磁芯被插入螺旋线圈的上层和下层导体之间。

3. 发明授权

US06535098B1 Integrated helix coil inductor on silicon 有权
公开(公告)号：US06535098B1
公开(公告)日：2003-03-18
申请号：US09519866
申请日：2000-03-06
申请人： Kiat Seng Yeo , Hai Peng Tan , Jian Guo Ma , Manh Anh Do , Kok Wai Johnny Chew
发明人： Kiat Seng Yeo , Hai Peng Tan , Jian Guo Ma , Manh Anh Do , Kok Wai Johnny Chew
IPC分类号： H01F500
CPC分类号： H01L28/10 , H01L27/08
摘要： A new structure and method is provided for the creation of an inductor on the surface of a silicon semiconductor substrate. The inductor is of a helix coil design having upper level and lower level conductors further having an axis whereby the axis of the helix coil of the inductor is parallel to the plane of the underlying substrate. Under the first embodiment of the invention, the height of the helix coil that is created on the surface of a silicon substrate is uniform. Under the second embodiment of the invention the height of the helix coil of the inductor of the invention is uniform while a ferromagnetic core is inserted between the upper and the lower level conductors of the helix coil. Under the third embodiment of the invention, the height of the helix coil that is created on the surface of a silicon substrate is non-uniform. Under the fourth embodiment of the invention the height of the helix coil of the inductor of the invention is non-uniform while a ferromagnetic core is inserted between the upper and the lower level conductors of the helix coil.

4. 发明授权

US06586309B1 High performance RF inductors and transformers using bonding technique 有权
公开(公告)号：US06586309B1
公开(公告)日：2003-07-01
申请号：US09556423
申请日：2000-04-24
申请人： Kiat Seng Yeo , Hai Peng Tan , Jianguo Ma , Manh Anh Do , Kok Wai Johnny Chew
发明人： Kiat Seng Yeo , Hai Peng Tan , Jianguo Ma , Manh Anh Do , Kok Wai Johnny Chew
IPC分类号： H01L2120
CPC分类号： H01L24/48 , H01F17/0006 , H01F17/0033 , H01F41/041 , H01L23/5227 , H01L23/645 , H01L24/45 , H01L24/49 , H01L2223/6611 , H01L2224/05554 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48472 , H01L2224/48599 , H01L2224/4911 , H01L2224/49175 , H01L2224/49176 , H01L2224/49431 , H01L2224/85207 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01079 , H01L2924/10329 , H01L2924/14 , H01L2924/1423 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： A method of fabricating an inductor using bonding techniques in the manufacture of integrated circuits is described. Bonding pads are provided over a semiconductor substrate. Input/output connections are made to at least two of the bonding pads. A plurality of wire bond loops are made between each two of the bonding pads wherein the plurality of wire bond loops forms the inductor.

5. 发明授权

US07023315B2 High performance RF inductors and transformers using bonding technique 失效
公开(公告)号：US07023315B2
公开(公告)日：2006-04-04
申请号：US10448882
申请日：2003-05-29
申请人： Kiat Seng Yeo , Hai Peng Tan , Jianguo Ma , Manh Anh Do , Kok Wai Johnny Chew
发明人： Kiat Seng Yeo , Hai Peng Tan , Jianguo Ma , Manh Anh Do , Kok Wai Johnny Chew
IPC分类号： H01F5/00
CPC分类号： H01L24/48 , H01F17/0006 , H01F17/0033 , H01F41/041 , H01L23/5227 , H01L23/645 , H01L24/45 , H01L24/49 , H01L2223/6611 , H01L2224/05554 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48472 , H01L2224/48599 , H01L2224/4911 , H01L2224/49175 , H01L2224/49176 , H01L2224/49431 , H01L2224/85207 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01079 , H01L2924/10329 , H01L2924/14 , H01L2924/1423 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： A method of fabricating an inductor using bonding techniques in the manufacture of integrated circuits is described. Bonding pads are provided over a semiconductor substrate. Input/output connections are made to at least two of the bonding pads. A plurality of wire bond loops are made between each two of the bonding pads wherein the plurality of wire bond loops forms the inductor.

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