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1. 发明申请

US20060005767A1 Chamber component having knurled surface 审中-公开
标题翻译：腔体部件具有滚花表面
公开(公告)号：US20060005767A1
公开(公告)日：2006-01-12
申请号：US10880235
申请日：2004-06-28
申请人： Kenneth Tsai , Abhijit Desai
发明人： Kenneth Tsai , Abhijit Desai
IPC分类号： C23C16/00
CPC分类号： C23C16/4404 , H01L21/68735 , H01L21/6875
摘要： A substrate retaining clamp for a substrate processing chamber has a ring having an annular portion that surrounds a substrate in the chamber. The ring also has an overhang ledge to cover a periphery of the substrate. The retaining clamp has a knurled exposed surface of the overhang ledge that has spaced apart knurled ridges and furrows. In one version, the knurled ridges and furrows are concentric and radially spaced apart. The knurled exposed surface having the knurled ridges and furrows provides improved performance in the processing of substrates, and especially in high temperature processes.
摘要翻译：用于衬底处理室的衬底保持夹具具有环，该环具有围绕腔室中的衬底的环形部分。该环还具有覆盖基板周边的悬垂凸缘。保持夹具具有凸出的凸出部的滚花暴露表面，其具有间隔开的滚花脊和沟。在一个版本中，滚花的脊和沟是同心的并且径向间隔开。具有滚花脊和沟的滚花暴露表面在基底的加工中特别是在高温工艺中提供了改进的性能。

2. 发明申请

US20060081459A1 In-situ monitoring of target erosion 审中-公开
标题翻译：目标侵蚀现场监测
公开(公告)号：US20060081459A1
公开(公告)日：2006-04-20
申请号：US10968367
申请日：2004-10-18
申请人： Kenneth Tsai , Kenny Ngan
发明人： Kenneth Tsai , Kenny Ngan
IPC分类号： C23C14/00
CPC分类号： H01J37/3408 , C23C14/35 , H01J37/32935
摘要： A target sputtering apparatus capable of monitoring target erosion has a sputtering chamber having a sputtering target with a sputtering surface. The apparatus can have a wireless receiver to receive a wireless signal and a controller to control the receiver and components of the sputtering chamber to sputter-deposit material on a substrate, and monitor erosion of the sputtering surface of the sputtering target. The controller also has a target erosion monitoring code that includes detection wafer transport program code to transport a detection wafer onto the support in the chamber, wherein the detection wafer generates a wireless signal in relation to an extent of erosion of the sputtered surface, and erosion determination code to analyze the wireless signal received by the wireless receiver and originating from the detection wafer to determine an extent of erosion of the sputtering surface of the sputtering target.
摘要翻译：能够监测目标侵蚀的靶溅射装置具有溅射室，该溅射室具有溅射表面的溅射靶。该装置可以具有接收无线信号的无线接收器和用于控制溅射室的接收器和部件的溅射沉积材料在基板上的控制器，并监测溅射靶的溅射表面的侵蚀。控制器还具有目标侵蚀监测代码，其包括检测晶片传送程序代码以将检测晶片传送到腔室中的支撑件上，其中检测晶片相对于溅射表面的侵蚀程度产生无线信号，并且侵蚀用于分析由无线接收器接收并源自检测晶片的无线信号以确定溅射靶的溅射表面的侵蚀程度的确定代码。

3. 发明授权

US06271148B1 Method for improved remote microwave plasma source for use with substrate processing system 失效
标题翻译：用于改善用于衬底处理系统的远程微波等离子体源的方法
公开(公告)号：US06271148B1
公开(公告)日：2001-08-07
申请号：US09416861
申请日：1999-10-13
申请人： Chien-Teh Kao , Kenneth Tsai , Quyen Pham , Ronald L. Rose , Calvin R. Augason , Joseph Yudovsky
发明人： Chien-Teh Kao , Kenneth Tsai , Quyen Pham , Ronald L. Rose , Calvin R. Augason , Joseph Yudovsky
IPC分类号： H01L21302
CPC分类号： C23C16/52 , C23C16/4405 , C23C16/452 , H01J37/32192 , H01J37/32357 , H01J37/32862 , H01L21/67028
摘要： An apparatus and methods for an upgraded CVD system providing a remote plasma for efficiently cleaning a chamber, according to a specific embodiment. Etching or depositing a layer onto a substrate also may be achieved using the upgraded CVD system of the present invention. In a specific embodiment, the present invention provides apparatus for an easily removable, conveniently handled, and relatively inexpensive, robust microwave plasma source as a retrofit for or a removable addition to existing CVD apparatus. The present invention provides an improved CVD apparatus or retrofit of existing CVD apparatus capable of producing a remote plasma for efficiently cleaning the chamber.
摘要翻译：根据具体实施例的用于提供用于有效清洁腔室的远程等离子体的升级CVD系统的装置和方法。使用本发明的升级的CVD系统也可以实现在基板上的蚀刻或沉积层。在具体实施例中，本发明提供了一种用于易于移除，方便处理且相对便宜的鲁棒微波等离子体源的装置，作为对现有CVD设备的改进或可移除的添加。本发明提供了一种改进的CVD装置或改进现有CVD装置，其能够产生用于有效清洁腔室的远程等离子体。

4. 发明授权

US06186092B1 Apparatus and method for aligning and controlling edge deposition on a substrate 失效
公开(公告)号：US06186092B1
公开(公告)日：2001-02-13
申请号：US08914522
申请日：1997-08-19
申请人： Kenneth Tsai , Joseph Yudovsky , Steve Ghanayem , Ken K. Lai , Patricia Liu , Toshiyuki Nakagawa , Maitreyee Mahajani
发明人： Kenneth Tsai , Joseph Yudovsky , Steve Ghanayem , Ken K. Lai , Patricia Liu , Toshiyuki Nakagawa , Maitreyee Mahajani
IPC分类号： C23C1600
CPC分类号： C23C16/45521 , C23C16/4585
摘要： An alignment mechanism for aligning a substrate on a support member in a process chamber includes a set of guide pins extending from the upper surface of the support member equally spaced about the periphery thereof and spaced to receive a substrate therebetween and align a shadow ring thereover. The inner surfaces of the guide pins are slanted outwardly to form an inverted funnel for receiving and aligning the substrate on the support member. An annular gas groove in the upper surface of the support member provides communication for a supply of purge gas and directs the gas about the peripheral edge of the substrate. The guide pins which extend partially over the gas groove include slots therein that provide fluid communication through the guide pins from the gas groove to the peripheral edge of the substrate. The guide pins also mate with alignment bores formed in the shadow ring so that, as the support member moves into the processing position, the inner surfaces of the guide pins abut abutment surfaces in the alignment bores and align the shadow ring on the support member and over the substrate. A hanger member supports and aligns the shadow ring between processing of each substrate.

5. 发明授权

US07926978B2 Light set with surface mounted light emitting components 有权
标题翻译：灯具采用表面安装的发光元件
公开(公告)号：US07926978B2
公开(公告)日：2011-04-19
申请号：US12314862
申请日：2008-12-18
申请人： Kenneth Tsai
发明人： Kenneth Tsai
IPC分类号： F21S4/00 , F21V21/00
CPC分类号： F21V19/0015 , F21S4/10 , F21V21/002 , F21W2121/04 , F21Y2115/10 , Y10S362/80
摘要： A light set with surface mounted light emitting components includes a first conducting wire and a second conducting wire disposed adjacent to the first conducting wire. The first and second conducting wires are correspondingly formed at a predetermined interval with a plurality of first and second contact-pad areas, respectively, at where a first and a second conductor of the first and the second conducting wire, respectively, are exposed. At least one surface mounted light emitting component is straddled on and between the corresponding first and the second contact-pad areas with two leads of the light emitting component electrically connected to the first and the second conductor via a conductive material, so that the surface mounted light emitting component and the first and second conducting wires are in an electrical contact state.
摘要翻译：具有表面安装的发光部件的光组件包括第一导线和邻近第一导线设置的第二导线。第一和第二导线分别相应地形成有多个第一和第二接触焊盘区域，其中第一和第二导线的第一和第二导体分别暴露在预定的间隔。至少一个表面安装的发光部件跨接在对应的第一和第二接触焊盘区域之间并且在相应的第一和第二接触焊盘区域之间，其中发光部件的两个引线经由导电材料电连接到第一和第二导体，使得表面安装发光元件和第一和第二导线处于电接触状态。

6. 发明授权

US07901263B2 Manufacturing method for an LED light string and a jig for making the LED light string 有权
标题翻译： LED灯串的制造方法和用于制造LED灯串的夹具
公开(公告)号：US07901263B2
公开(公告)日：2011-03-08
申请号：US12007574
申请日：2008-01-11
申请人： Kenneth Tsai
发明人： Kenneth Tsai
IPC分类号： H01J9/24 , H01J9/46 , H05B33/10
CPC分类号： F21S4/10 , F21Y2115/10 , H01L33/62 , H01L2224/48091 , H01L2924/00014
摘要： A method of manufacturing an LED light string using a jig having a main body and a plurality of spiral grooves formed thereon adjacent to each other is provided. The method includes winding an electrical wire in each of the grooves, removing portions of the electrical wires to provide a plurality of spaced exposed segments at successive locations on each of the electrical wires, placing LED chips on at least some of the plurality of exposed segments formed in one of the electrical wires, connecting each LED chip to a corresponding exposed segment on a different electrical wire by a connector, and sealing each LED chip and connector. A jig for attaching one or more LED chips to a plurality of electrical wires is also provided.
摘要翻译：提供一种使用具有主体的夹具制造LED灯串的方法和在其上彼此相邻形成的多个螺旋槽。该方法包括将电线缠绕在每个凹槽中，去除电线的部分以在每条电线上的连续位置处提供多个间隔开的暴露部分，将LED芯片放置在多个暴露部分中的至少一些形成在电线之一中，通过连接器将每个LED芯片连接到不同电线上的对应的暴露部分，并密封每个LED芯片和连接器。还提供了用于将一个或多个LED芯片附接到多个电线的夹具。

7. 发明申请

US20080200089A1 Manufacturing method for an LED light string and a jig for making the LED light string 有权
标题翻译： LED灯串的制造方法和用于制造LED灯串的夹具
公开(公告)号：US20080200089A1
公开(公告)日：2008-08-21
申请号：US12007574
申请日：2008-01-11
申请人： Kenneth Tsai
发明人： Kenneth Tsai
IPC分类号： H01J9/02 , H01J9/46
CPC分类号： F21S4/10 , F21Y2115/10 , H01L33/62 , H01L2224/48091 , H01L2924/00014
摘要： A method of manufacturing an LED light string using a jig having a main body and a plurality of spiral grooves formed thereon adjacent to each other is provided. The method includes winding an electrical wire in each of the grooves, removing portions of the electrical wires to provide a plurality of spaced exposed segments at successive locations on each of the electrical wires, placing LED chips on at least some of the plurality of exposed segments formed in one of the electrical wires, connecting each LED chip to a corresponding exposed segment on a different electrical wire by a connector, and sealing each LED chip and connector. A jig for attaching one or more LED chips to a plurality of electrical wires is also provided.
摘要翻译：提供一种使用具有主体的夹具制造LED灯串的方法和在其上彼此相邻形成的多个螺旋槽。该方法包括将电线缠绕在每个凹槽中，去除电线的部分以在每条电线上的连续位置处提供多个间隔开的暴露部分，将LED芯片放置在多个暴露部分中的至少一些形成在电线之一中，通过连接器将每个LED芯片连接到不同电线上的对应的暴露部分，并密封每个LED芯片和连接器。还提供了用于将一个或多个LED芯片附接到多个电线的夹具。

8. 发明授权

US09068273B2 Electrochemical removal of tantalum-containing materials 有权
标题翻译：电化学去除含钽材料
公开(公告)号：US09068273B2
公开(公告)日：2015-06-30
申请号：US13157867
申请日：2011-06-10
申请人： Hong Wang , Kenneth Tsai
发明人： Hong Wang , Kenneth Tsai
IPC分类号： C25F3/00 , C25F3/02 , C25F1/00 , C25F1/02 , C25F5/00 , C23C14/34 , C23F1/36 , C22B7/00
CPC分类号： C25F5/00 , C22B7/007 , C23C14/3414 , C23F1/36 , Y02P10/234
摘要： A method of cleaning metal-containing deposits from a metal surface of a process chamber component includes immersing the metal surface in an electrochemical cleaning bath solution. A negative electrical bias is applied to the metal surface to electrochemically clean the metal-containing deposits from the metal surface. The cleaning method is capable of removing metal-containing deposits such as tantalum-containing deposits from the metal surface substantially without eroding the surface, and may be especially advantageous in the cleaning of components having textured surfaces.
摘要翻译：从处理室部件的金属表面清洗含金属沉积物的方法包括将金属表面浸入电化学清洗浴溶液中。对金属表面施加负电偏压以电化学地从金属表面清洁含金属沉积物。清洁方法能够从金属表面去除含金属沉积物如含钽沉积物，而不会侵蚀表面，并且在清洁具有纹理表面的部件方面特别有利。

9. 发明授权

US07833060B2 LED bulb assembly 有权
标题翻译： LED灯泡组装
公开(公告)号：US07833060B2
公开(公告)日：2010-11-16
申请号：US12007575
申请日：2008-01-11
申请人： Kenneth Tsai
发明人： Kenneth Tsai
IPC分类号： H01R33/09
CPC分类号： F21V19/0005 , F21W2121/00 , F21Y2115/10
摘要： The LED bulb assembly includes a connector, an LED including two conductive wires, and means for attaching the LED to the connector and preventing the two conductive wires from contacting each other. The means for attaching the LED to the connector and preventing the two conductive wires from contacting each other may include a plate in the connector, and each of the two conductive wires extends along different sides of the plate. Alternatively, the means for attaching the LED to the connector and preventing the two conductive wires from contacting each other may include each of the conductive wires having a thickness such that the two conductive wires supports the LED while maintaining a gap between the two conductive wires.
摘要翻译： LED灯泡组件包括连接器，包括两根导线的LED，以及用于将LED连接到连接器并防止两根导线相互接触的装置。用于将LED连接到连接器并防止两个导线彼此接触的装置可以包括连接器中的板，并且两个导线中的每一个沿板的不同侧延伸。或者，用于将LED连接到连接器并防止两个导线彼此接触的装置可以包括每个导线具有使得两个导线在保持两个导线之间的间隙的同时支撑LED的厚度。

10. 发明申请

US20060024440A1 Reduced oxygen arc spray 审中-公开
标题翻译：减少氧气喷雾
公开(公告)号：US20060024440A1
公开(公告)日：2006-02-02
申请号：US10901319
申请日：2004-07-27
申请人： Kenneth Tsai , Kenny Ngan
发明人： Kenneth Tsai , Kenny Ngan
IPC分类号： C23C16/00 , B05D1/32
CPC分类号： C23C16/4404 , C23C4/131
摘要： A method of forming a coating on a component surface comprises placing a shield about the component surface to define a process zone, controlling the level of oxygen present in the process zone, generating an electric arc in the process zone to form a liquefied material from an electrode, and injecting a carrier gas into the process zone to direct the liquefied material toward the component surface. The level of oxygen present in the process zone is controlled by (i) filling the process zone with a non-oxidizing gas and maintaining a pressure p1 in the process zone higher than a pressure p2 of an ambient environment external to the process zone, and (ii) lining the process zone with an oxygen-absorbing material. Additionally, an arc spray apparatus comprises the shield comprising the oxygen-absorbing material and a consumable electrode extending into the process zone.
摘要翻译：在部件表面上形成涂层的方法包括在组件表面周围放置屏蔽件以限定工艺区域，控制处理区域中存在的氧气水平，在工艺区域中产生电弧，以形成液化材料电极，并且将载气注入到处理区域中以将液化材料引向组件表面。存在于处理区中的氧的水平通过以下步骤来控制：（i）用非氧化性气体填充处理区，并且在高于压力p 1的过程区中保持压力p <1> 2）处理区外部的环境环境，和（ii）用氧吸收材料衬里处理区。另外，电弧喷涂装置包括包含氧吸收材料的屏蔽件和延伸到工艺区域中的可消耗电极。

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