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    • 4. 发明授权
    • OFDM receiver and OFDM signal receiving method
    • OFDM接收机和OFDM信号接收方法
    • US07929628B2
    • 2011-04-19
    • US11900636
    • 2007-09-11
    • Hidetoshi KawauchiMasayuki Hattori
    • Hidetoshi KawauchiMasayuki Hattori
    • H04L27/28
    • H04L25/0234H04L25/0216H04L25/022H04L25/0222H04L25/025H04L25/03159H04L27/2647H04L2025/03414
    • An OFDM receiver may include OFDM-signal receiving means for receiving an orthogonal frequency division multiplexing (OFDM) signal; channel-characteristic estimating means for estimating a channel characteristic using pilot signals in the OFDM signal received by the OFDM-signal receiving means; and transmission-distortion compensating means for applying, on the basis of the channel characteristic estimated by the channel-characteristic estimating means, processing for compensating for transmission distortion to the OFDM signal received by the OFDM-signal receiving means. The channel-characteristic estimating means may include plural kinds of time-direction-channel estimating means used for the estimation of a channel characteristic, and switching control means for switching these estimating means according to a state of a channel.
    • OFDM接收机可以包括用于接收正交频分复用(OFDM)信号的OFDM信号接收装置; 信道特性估计装置,用于使用由OFDM信号接收装置接收的OFDM信号中的导频信号来估计信道特性; 以及发送失真补偿装置,用于根据由信道特性估计装置估计的信道特性,应用用于补偿由OFDM信号接收装置接收的OFDM信号的发送失真的处理。 信道特性估计装置可以包括用于估计信道特性的多种时间 - 方向信道估计装置,以及根据信道状态切换这些估计装置的切换控制装置。
    • 7. 发明授权
    • Aqueous dispersion for chemical mechanical polishing
    • 化学机械抛光用水分散体
    • US07087530B2
    • 2006-08-08
    • US10689680
    • 2003-10-22
    • Masayuki MotonariMasayuki HattoriNobuo Kawahashi
    • Masayuki MotonariMasayuki HattoriNobuo Kawahashi
    • H01L21/302
    • C09G1/02C09K3/1463H01L21/31053
    • The invention provides an aqueous dispersion for chemical mechanical polishing that can limit scratches of a specific size to a specific number, even with interlayer insulating films with small elastic moduli (silsesquioxane, fluorine-containing SiO2, polyimide-based resins, and the like.). When using the aqueous dispersion for chemical mechanical polishing of an interlayer insulating film with an elastic modulus of no greater than 20 GPa as measured by the nanoindentation method, the number of scratches with a maximum length of 1 μm or greater is an average of no more than 5 per unit area of 0.01 mm2 of the polishing surface. An aqueous dispersion for CMP or an aqueous dispersion for interlayer insulating film CMP according to another aspect of the invention contains a scratch inhibitor agent and an abrasive. The scratch inhibitor may be biphenol, bipyridyl, 2-vinylpyridine, salicylaldoxime, o-phenylenediamine, catechol, 7-hydroxy-5-methyl-1,3,4-triazaindolizine, and the like. The abrasive may consist of inorganic particles, organic particles or organic/inorganic composite particles. The organic/inorganic composite particles may be formed by polycondensation of an alkoxysilane, aluminum alkoxide, titanium alkoxide, and the like in the presence of polymer particles of polystyrene or the like, and bonding of polysiloxane, and the like, on at least the surface of the polymer particles.
    • 本发明提供了一种用于化学机械抛光的水分散体,即使使用具有小弹性模量的层间绝缘膜(倍半硅氧烷,含氟SiO 2,聚酰亚胺 - 基树脂等)。 当通过纳米压痕法测量的弹性模量不大于20GPa的层间绝缘膜的化学机械抛光使用水性分散体时,最大长度为1μm或更大的划痕数是不超过平均值 比抛光表面的0.01mm 2单位面积的5个。 根据本发明另一方面,用于CMP的水分散体或用于层间绝缘膜CMP的水性分散体含有防刮剂和研磨剂。 刮擦抑制剂可以是联苯酚,联吡啶基,2-乙烯基吡啶,水杨醛肟,邻苯二胺,邻苯二酚,7-羟基-5-甲基-1,3,4-三氮杂多卡因等。 研磨剂可以由无机颗粒,有机颗粒或有机/无机复合颗粒组成。 有机/无机复合颗粒可以通过在聚苯乙烯等的聚合物颗粒的存在下的烷氧基硅烷,烷氧基铝,烷氧基钛等的缩聚以及聚硅氧烷等的至少表面 的聚合物颗粒。
    • 8. 发明授权
    • Aqueous dispersion for chemical mechanical polishing
    • 化学机械抛光用水分散体
    • US06786944B2
    • 2004-09-07
    • US10412385
    • 2003-04-14
    • Masayuki HattoriMichiaki AndoKazuo NishimotoNobuo Kawahashi
    • Masayuki HattoriMichiaki AndoKazuo NishimotoNobuo Kawahashi
    • C09G102
    • C09G1/02C09K3/1409C09K3/1463H01L21/31053
    • An aqueous dispersion for chemical mechanical polishing that is hard to putrefy, scarcely causes scratches, causes only small dishing and is suitable for used in a micro isolating step or a planarizing step of an inter layer dielectric in production of semiconductor devices, which dispersion comprises ceria particles, a preservative composed of a compound having a heterocyclic structure containing a nitrogen atom and a sulfur atom in the ring, such as an isothiazolone compound, and an organic component such as organic abrasive grains composed of resin particles, a dispersing agent composed of a water-soluble polymer having a specific molecular weight or the like, a surfactant and/or an organic acid or a salt thereof contained in an aqueous medium, wherein the ceria particles, preservative and organic component are contained in proportions of 0.1 to 20% by mass, 0.001 to 0.2% by mass and 0.1 to 30% by mass, respectively, when the total proportion of the aqueous medium, ceria particles, preservative and organic component is 100% by mass, and wherein the pH of this aqueous dispersion can be kept in a neutral range.
    • 用于化学机械抛光的水性分散体难以腐蚀,几乎不引起划痕,仅导致小的凹陷,并且适合用于半导体器件生产中的微层间电介质的微隔离步骤或平面化步骤,该分散体包括二氧化铈 颗粒,由具有在环中含有氮原子和硫原子的杂环结构的化合物组成的防腐剂,例如异噻唑酮化合物,以及有机成分,例如由树脂颗粒组成的分散剂,由 包含在水性介质中的具有特定分子量的水溶性聚合物,表面活性剂和/或有机酸或其盐,其中二氧化铈颗粒,防腐剂和有机组分的含量为0.1〜20% 质量,0.001〜0.2质量%和0.1〜30质量%,当水性介质,二氧化铈颗粒, 防腐剂和有机成分为100质量%,并且其中该水分散体的pH可以保持在中性范围。
    • 10. 发明授权
    • AQUEOUS DISPERSION, AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING USED FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, AND METHOD FOR FORMATION OF EMBEDDED WRITING
    • 用于制造半导体器件的化学机械抛光的水性分散体,用于制造半导体器件的方法和用于形成嵌入式布线的方法
    • US06740590B1
    • 2004-05-25
    • US09531163
    • 2000-03-17
    • Hiroyuki YanoGaku MinamihabaYukiteru MatsuiKatsuya OkumuraAkira IioMasayuki Hattori
    • Hiroyuki YanoGaku MinamihabaYukiteru MatsuiKatsuya OkumuraAkira IioMasayuki Hattori
    • H01L21302
    • C09K3/1463C09G1/02C09K3/1436H01L21/02074H01L21/3212H01L21/7684
    • The object of the present invention is to provide an aqueous dispersion that can give the required properties for a wide range of uses including electronic materials, magnetic materials, optical materials and polishing materials, and to provide an aqueous dispersion for chemical mechanical polishing (CMP slurry) that gives an adequate polishing rate without creating scratches in polishing surfaces. Another object of the present invention is, to provide a method for manufacture of semiconductor devices using a CMP slurry that can control progressive erosion due to scratches and the like during polishing and that can achieve efficient flattening of working films, and to provide a method for formation of embedded wiring. The aqueous dispersion or CMP slurry of the present invention contains polymer particles made of thermoplastic resins or the like, and inorganic particles made of alumina, silica or the like, wherein the zeta potentials of the polymer particles and inorganic particles are of opposite signs, and they are bonded by electrostatic force to form aggregates as composite particles. The aggregates are subjected to ultrasonic wave irradiation or shear stress with a homogenizer to give more uniformly dispersed composite particles.
    • 本发明的目的是提供一种水性分散体,其可以为包括电子材料,磁性材料,光学材料和抛光材料在内的广泛用途提供所需的性能,并提供用于化学机械抛光的水性分散体(CMP浆料 ),其提供足够的抛光速率,而不会在抛光表面中产生划痕。 本发明的另一个目的是提供一种使用CMP浆料制造半导体器件的方法,所述CMP浆料可以在抛光期间控制由划痕等引起的逐渐侵蚀,并且可以实现工作膜的有效平坦化,并提供一种方法 形成嵌入式布线。 本发明的水性分散体或CMP浆料含有由热塑性树脂等构成的聚合物颗粒和由氧化铝,二氧化硅等制成的无机颗粒,其中聚合物颗粒和无机颗粒的ζ电位具有相反的标志, 它们通过静电力结合以形成作为复合颗粒的聚集体。 聚集体用均化器进行超声波照射或剪切应力,得到更均匀分散的复合颗粒。