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    • 9. 发明授权
    • Manufacturing method for semiconductor device
    • 半导体器件的制造方法
    • US06245603B1
    • 2001-06-12
    • US09498069
    • 2000-02-04
    • Hirofumi Shinohara
    • Hirofumi Shinohara
    • H01L21336
    • H01L21/76897H01L29/1083H01L29/6659
    • A manufacturing method for a semiconductor device permits a MOSFET with a pocket layer to be securely formed even when microminiaturization makes it difficult to implant impurity ions at an angle with respect to a silicon substrate in manufacturing a semiconductor, a MOSFET having a pocket layer in particular. A gate electrode composed of a gate oxide film, a poly-silicon, and a tungsten silicide, and a nitride film pattern are selectively formed on a p-type silicon substrate, then p-type impurity ions are implanted perpendicularly to the p-type silicon substrate. A p-type ion implantation region formed by implanting the p-type impurity ions is diffused for activation to thereby form a pocket layer before another ion implantation region is formed.
    • 半导体器件的制造方法允许具有袋层的MOSFET即使在制造半导体时微小化使得难以相对于硅衬底以一定角度注入杂质离子,特别是具有袋层的MOSFET也可以牢固地形成 。 在p型硅衬底上选择性地形成由栅极氧化膜,多晶硅和硅化钨构成的栅电极和氮化物膜图案,然后将p型杂质离子垂直于p型 硅衬底。 通过注入p型杂质离子形成的p型离子注入区域被扩散用于激活,从而在形成另一个离子注入区域之前形成袋层。