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1. 发明授权

US06303727B1 Linear triene compound and copolymer 失效
标题翻译：线性三烯化合物和共聚物
公开(公告)号：US06303727B1
公开(公告)日：2001-10-16
申请号：US09320838
申请日：1999-05-26
申请人： Ken Maeda , Masaaki Yasuda , Terunori Fujita , Keiji Okada , Makoto Kamimura , Kazuyuki Takimoto , Hidetatsu Murakami , Masaaki Kawasaki , Keiji Watanabe
发明人： Ken Maeda , Masaaki Yasuda , Terunori Fujita , Keiji Okada , Makoto Kamimura , Kazuyuki Takimoto , Hidetatsu Murakami , Masaaki Kawasaki , Keiji Watanabe
IPC分类号： C08F13600
CPC分类号： C08F236/22 , C07C2/04 , C07C11/21 , C07C2527/24 , C07C2531/14
摘要： A novel and useful linear triene compound represented by the following formula (1) is co-polymerized with an &agr;-olefin to obtain an ethylenically unsaturated copolymer which is superior in weather-ability, heat resitance and fastness to ozone, together with superior scorch stability and vulcanizability at high velocity in which R1, R2, R3, R4, R5 and R6 stand each, independently of each other, for hydrogen atom or an alkyl having 1-3 carbon atoms, R7 represents an alkyl having 1-3 carbon atoms and n is an integer of 0-5, with the proviso that each of R4s or of R5s may be identical with or different from each other, respectively, when n is 2 or greater.
摘要翻译：由下式（1）表示的新型有用的线性三烯化合物与α-烯烃共聚，得到耐候性，耐热性和耐臭氧性优异的烯属不饱和共聚物，以及优异的焦烧稳定性和R 1，R 2，R 3，R 4，R 5和R 6各自独立地表示氢原子或具有1-3个碳原子的烷基的高速度下的硫化性，R7表示具有1-3个碳原子的烷基，n表示是0-5的整数，条件是当n为2或更大时，R 4或R 5中的每一个可以分别彼此相同或不同。

2. 发明授权

US6040407A Chain polyene group-containing norbornene compound and unsaturated ethylene copolymer using the same 失效
标题翻译：含链多烯基的降冰片烯化合物和使用其的不饱和乙烯共聚物
公开(公告)号：US6040407A
公开(公告)日：2000-03-21
申请号：US860442
申请日：1997-06-26
申请人： Tatsuyoshi Ishida , Masaaki Yasuda , Hitoshi Onishi , Noriaki Kihara , Toshiyuki Tsutsui , Toshihiro Sagane , Masaaki Kawasaki , Hidenari Nakahama
发明人： Tatsuyoshi Ishida , Masaaki Yasuda , Hitoshi Onishi , Noriaki Kihara , Toshiyuki Tsutsui , Toshihiro Sagane , Masaaki Kawasaki , Hidenari Nakahama
IPC分类号： C07C2/50 , C07C13/43 , C08F210/18 , C08F10/02
CPC分类号： C08F210/18 , C07C13/43 , C07C2/50 , C07C2102/42
摘要： The chain polyene-group containing norbornene compound of the invention is represented by the formula [I]: ##STR1## wherein n is an integer of 1 to 5, R.sup.1 is an alkyl group of 1 to 5 carbon atoms, and R.sup.2 and R.sup.3 are each independently a hydrogen atom or an alkyl group of 1 to 5 carbon atoms.The unsaturated ethylene copolymer of the invention is a random copolymer of 30 to 92% by mol of (i) ethylene units, 6 to 70% by mol of (ii) specific .alpha.-olefin units and 0.1 to 30% by mol of (iii) units derived from the norbornene compound [I], where the molar ratio of (i)/(ii) is in the range of 40/60 to 92/8 and the unit (iii) is represented by the specific formula, and has an intrinsic viscosity [.eta.] of 0.05 to 10 dl/g.The novel unsaturated ethylene copolymer is excellent in weathering resistance, heat resistance and ozone resistance and has a high vulcanizing rate.
摘要翻译： PCT No.PCT / JP95 / 02655第 371日期：1997年6月26日 102（e）日期1997年6月26日PCT 1995年12月25日PCT PCT。 WO96 / 20150 PCT出版物日本1996年7月4日本发明的含链多烯基的降冰片烯化合物由式[I]表示：其中n为1〜5的整数，R1为碳原子数1〜5的烷基，R2和 R 3各自独立地为氢原子或1〜5个碳原子的烷基。本发明的不饱和乙烯共聚物为（i）乙烯单元为30〜92摩尔％，（ii）特定α-烯烃单元为6〜70摩尔％，（iii）为0.1〜30摩尔％）衍生自降冰片烯化合物[I]的单元，其中（i）/（ii）的摩尔比在40/60至92/8的范围内，单元（iii）由具体式表示，并且具有特性粘度η为0.05-10dl / g。新型不饱和乙烯共聚物耐候性，耐热性和耐臭氧性优异，硫化速度高。

3. 发明授权

US5837791A Unsaturated copolymer of ethylene and process for preparing the same 失效
标题翻译：乙烯的不饱和共聚物及其制备方法
公开(公告)号：US5837791A
公开(公告)日：1998-11-17
申请号：US915914
申请日：1997-08-21
申请人： Toshihiro Sagane , Masaaki Kawasaki , Hidenari Nakahama , Tatsuyoshi Ishida , Katsuya Takahashi , Toshiyuki Tsutsui , Hitoshi Onishi , Masaaki Yasuda , Noriaki Kihara
发明人： Toshihiro Sagane , Masaaki Kawasaki , Hidenari Nakahama , Tatsuyoshi Ishida , Katsuya Takahashi , Toshiyuki Tsutsui , Hitoshi Onishi , Masaaki Yasuda , Noriaki Kihara
IPC分类号： C07C2/04 , C07C11/21 , C08F4/659 , C08F4/6592 , C08F210/18 , C08F236/20 , C08F255/02
CPC分类号： C08F255/02 , C07C11/21 , C07C2/04 , C08F210/18 , C07C2531/14 , C07C2531/24 , C08F4/65908 , C08F4/6592 , C08F4/65922
摘要： A novel unsaturated copolymer of ethylene comprises a random copolymer of (i) ethylene, (ii) an .alpha.-olefin of 3 to 20 carbon atoms and (iii) at least one straight chain or branched chain nonconjugated triene or tetraene having one vinyl group in the molecule, which contains 30-92% by mol of ethylene units (i), 6-70% by mol of .alpha.-olefin units (ii) and 0.1-30% by mol of triene or tetraene units (iii), and which has a molar ratio of ethylene units (i) to .alpha.-olefin units (ii) of 40/60 to 92/8 (ethylene units (i)/.alpha.-olefin units (ii)) and an intrinsic viscosity (.eta.), measured in Decalin at 135.degree. C., of 0.05 to 10 dl/g. This novel unsaturated copolymer of ethylene is excellent in weathering resistance, heat resistance and ozone resistance and has a high vulcanizing rate.
摘要翻译：一种新型的乙烯不饱和共聚物包括（i）乙烯，（ii）3-20个碳原子的α-烯烃和（iii）至少一个具有一个乙烯基的直链或支链非共轭三烯或四烯的无规共聚物该分子含有30-92摩尔％的乙烯单元（i），6-70摩尔％的α-烯烃单元（ii）和0.1-30摩尔％的三烯或四烯单元（iii），其中具有40/60至92/8（乙烯单元（i）/α-烯烃单元（ii））的乙烯单元（i）与α-烯烃单元（ii）的摩尔比和特性粘度（η），测量在135℃的十氢化萘中为0.05〜10dl / g。该新颖的乙烯不饱和共聚物耐候性，耐热性和耐臭氧性优异，硫化速度高。

4. 发明申请

US20110065260A1 PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART 有权
公开(公告)号：US20110065260A1
公开(公告)日：2011-03-17
申请号：US12950398
申请日：2010-11-19
申请人： Takashi KAWAMORI , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
发明人： Takashi KAWAMORI , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
IPC分类号： H01L21/78 , B29C65/52
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

5. 发明授权

US5910591A Method of preparation of 4-hydroxy-1,2,2,6,6-pentamethylpiperidine 失效
标题翻译： 4-羟基-1,2,2,6,6-五甲基哌啶的制备方法
公开(公告)号：US5910591A
公开(公告)日：1999-06-08
申请号：US953517
申请日：1997-10-17
申请人： Masaaki Yasuda
发明人： Masaaki Yasuda
IPC分类号： C07D211/46 , C07D211/44
CPC分类号： C07D211/46
摘要： The present invention relates to a method for preparing 4-hydroxy-1,2,2,6,6-pentamethylpiperidine comprising the following steps:(i) reacting 4-hydroxy-2,2,6,6-tetramethylpiperidine with at least one compound selected from the group consisting of formaldehyde, paraformaldehyde and trioxane, optionally in the presence of formic acid;(ii) neutralizing the reaction product of step (i) by adding a base thereto; and(iii) after the neutralization, separating the crude product from the aqueous layer and crystallizing and filtering the crude product to thereby obtain crystals of 4-hydroxy-1,2,2,6,6-pentamethylpiperidine with a water content of 3% by weight or less. The present invention also relates to a method for preparing 4-hydroxy-1,2,2,6,6-pentamethylpiperidine, comprising reacting 4-hydroxy-2,2,6,6-tetramethylpiperidine with at least one compound selected from the group consisting of formaldehyde, paraformaldehyde and trioxane, optionally in the presence of formic acid added in an amount smaller than that of 4-hydroxy-2,2,6,6-tetramethylpiperidine in terms of mole.
摘要翻译：本发明涉及一种制备4-羟基-1,2,2,6,6-五甲基哌啶的方法，包括以下步骤：（i）使4-羟基-2,2,6,6-四甲基哌啶与至少一种选自甲醛，多聚甲醛和三恶烷的化合物，任选在甲酸存在下; （ii）通过向其中加入碱来中和步骤（i）的反应产物; 和（iii）中和后，将粗产物与水层分离并使粗产物结晶并过滤，从而得到水含量为3％的4-羟基-1,2,2,6,6-五甲基哌啶晶体，以下。本发明还涉及一种制备4-羟基-1,2,2,6,6-五甲基哌啶的方法，包括使4-羟基-2,2,6,6-四甲基哌啶与至少一种选自下组的化合物由甲醛，多聚甲醛和三恶烷组成，任选在甲酸的存在下加入的量小于4-羟基-2,2,6,6-四甲基哌啶的摩尔量。

6. 发明授权

US07692296B2 Semiconductor device and multilayer substrate therefor 失效
标题翻译：半导体装置及其多层基板
公开(公告)号：US07692296B2
公开(公告)日：2010-04-06
申请号：US11085520
申请日：2005-03-22
申请人： Naotaka Tanaka , Kenya Kawano , Akira Nagai , Koji Tasaki , Masaaki Yasuda
发明人： Naotaka Tanaka , Kenya Kawano , Akira Nagai , Koji Tasaki , Masaaki Yasuda
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/83 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/90 , H01L25/0657 , H01L25/50 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/274 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/83191 , H01L2224/83192 , H01L2224/838 , H01L2224/85203 , H01L2224/85205 , H01L2225/06513 , H01L2225/06517 , H01L2225/06558 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/45099
摘要： A semiconductor device is provided with connection reliability between a bump electrode and a substrate electrode. An elastic modulus of an adhesive material used to electrically connect a metal bump and an interconnect pattern, and sealing the circuit surface of an LSI chip, after thermosetting is Ea; an elastic modulus of an insulating material of a packaging substrate surface layer after thermosetting is Eb; an elastic modulus of a core material, if used, is Ec, and the following rational expression is satisfied at normal temperature or a thermal contact bonding temperature of the adhesive material: at least Ea
摘要翻译：半导体器件在凸起电极和衬底电极之间具有连接可靠性。用于电连接金属凸块和互连图案的粘合材料的弹性模量，并且在热固化之后密封LSI芯片的电路表面是Ea; 热固化后的封装基材表面层的绝缘材料的弹性模量为Eb; 如果使用的话，芯材的弹性模量为Ec，在粘接材料的常温或热接触粘合温度下满足以下有理表达式：至少Ea

7. 发明授权

US07061081B2 Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof 失效
公开(公告)号：US07061081B2
公开(公告)日：2006-06-13
申请号：US10220846
申请日：2001-03-06
申请人： Yasuhiro Yano , Hidekazu Matsuura , Yoshihiro Nomura , Yoshii Morishita , Touichi Sakata , Hiroshi Nishizawa , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
发明人： Yasuhiro Yano , Hidekazu Matsuura , Yoshihiro Nomura , Yoshii Morishita , Touichi Sakata , Hiroshi Nishizawa , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
IPC分类号： C08L79/08 , H01L23/48
CPC分类号： H01L21/02118 , G03F7/0387 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/312 , H01L21/3122 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.

8. 发明授权

US06404068B1 Paste composition, and protective film and semiconductor device both obtained with the same 失效
标题翻译：糊剂组合物，以及保护膜和半导体器件均获得相同
公开(公告)号：US06404068B1
公开(公告)日：2002-06-11
申请号：US09763192
申请日：2001-02-20
申请人： Toshiaki Tanaka , Takafumi Dohdoh , Tsutomu Kitakatsu , Aizou Kaneda , Masaaki Yasuda , Takashi Kousaka , Akira Kageyama
发明人： Toshiaki Tanaka , Takafumi Dohdoh , Tsutomu Kitakatsu , Aizou Kaneda , Masaaki Yasuda , Takashi Kousaka , Akira Kageyama
IPC分类号： H01L2348
CPC分类号： H01L23/3128 , C08L63/00 , C08L71/00 , C08L71/126 , C08L77/00 , C08L77/06 , C08L83/10 , C09D177/00 , C09D177/06 , C09D179/08 , H01L23/24 , H01L23/293 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01039 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , C08L2666/02 , C08L2666/08 , C08L2666/04 , C08L2666/14 , C08L2666/28 , H01L2924/00012 , H01L2924/00 , H01L2924/20753
摘要： A paste composition which comprises as essential ingredients (A) a thermoplastic resin, (B) an epoxy resin, (C) a coupling agent, (D) a powdery inorganic filler, (E) a powder having rubber elasticity and (F) an organic solvent and which, when applied and dried, gives a coating film having a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90 %RH of 500 g/m2·24 h or less; a protective film which is formed by applying the paste composition to a surface of a semiconductor part and drying it and has a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90%RH of 500 g/m2·24 h or less; and a semiconductor device having the protective film.
摘要翻译：作为必要成分（A）热塑性树脂，（B）环氧树脂，（C）偶联剂，（D）粉末状无机填料，（E）具有橡胶弹性的粉末和（F）有机溶剂，当涂布并干燥时，得到空隙率为3体积％以上的涂膜，在40℃，90％RH下测定的水蒸气透过率为500g / m 2·24h，减; 通过将糊剂组合物涂布在半导体部件的表面并干燥而形成的保护膜，其空隙率为3体积％以上，水分透过率为40℃，90％RH 500 g / m2.24 h以下; 以及具有保护膜的半导体器件。

9. 发明授权

US5408013A Unsaturated polyester resin composition and sheet-form molding material using the same 失效
公开(公告)号：US5408013A
公开(公告)日：1995-04-18
申请号：US159959
申请日：1993-12-01
申请人： Hiroyuki Kawakami , Masaaki Yasuda , Shoichi Sasaki
发明人： Hiroyuki Kawakami , Masaaki Yasuda , Shoichi Sasaki
IPC分类号： C08F283/01 , C08F283/02 , C08L67/06 , C08F20/00
CPC分类号： C08F283/02 , C08F283/01 , C08L67/06 , Y10T428/249921 , Y10T428/249924 , Y10T428/31786 , Y10T428/31794
摘要： An unsaturated polyester resin composition capable of affording a molded product having a small cured volume shrinkage, a superior dimensional stability, a surface quality and a high hardness, a sheet-form molding material using the composition and a process for producing a fiber-reinforced plastic molded product are provided, which composition comprises a saturated polyester obtained by reacting a saturated dibasic acid component containing 20% by mol or more of adipic acid with a saturated glycol component and having a number average molecular weight of 4,000 or higher and an acid value of 2 to 8 KOH mg/g, an unsaturated polyester and an ethylenic unsaturated monomer; which sheet-form molding material has the unsaturated resin composition together with a fiber reinforcing material placed between two films.

10. 发明授权

US4962241A Process for producing dihydroxynaphthalenes 失效
标题翻译：制备二羟基萘的方法
公开(公告)号：US4962241A
公开(公告)日：1990-10-09
申请号：US309671
申请日：1989-02-03
申请人： Masaaki Yasuda , Hisaya Miki
发明人： Masaaki Yasuda , Hisaya Miki
IPC分类号： B01J27/02 , B01J27/06 , B01J27/138 , B01J31/04 , C07B61/00 , C07C27/00 , C07C37/055 , C07C39/14 , C07C67/00 , C07C67/055 , C07C409/08
CPC分类号： C07C409/08 , C07C37/0555 , C07C407/00 , C07C2102/02
摘要： The process of the present invention for producing dihydroxynaphthalenes comprises hydrolyzing a diacyloxynaphthalene in a water-containing solvent in the presence of an acid catalyst. The use of an acid as a hydrolyzing catalyst enables dihydroxynaphthalenes to be obtained with high purity and in high yield.

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