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1. 发明授权

US07061081B2 Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof 失效
公开(公告)号：US07061081B2
公开(公告)日：2006-06-13
申请号：US10220846
申请日：2001-03-06
申请人： Yasuhiro Yano , Hidekazu Matsuura , Yoshihiro Nomura , Yoshii Morishita , Touichi Sakata , Hiroshi Nishizawa , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
发明人： Yasuhiro Yano , Hidekazu Matsuura , Yoshihiro Nomura , Yoshii Morishita , Touichi Sakata , Hiroshi Nishizawa , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
IPC分类号： C08L79/08 , H01L23/48
CPC分类号： H01L21/02118 , G03F7/0387 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/312 , H01L21/3122 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.

2. 发明授权

US07560307B2 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same 有权
标题翻译：树脂组合物，耐热树脂膏和使用这些的半导体器件及其制备方法
公开(公告)号：US07560307B2
公开(公告)日：2009-07-14
申请号：US11403810
申请日：2006-04-14
申请人： Yasuhiro Yano , Hidekazu Matsuura , Yoshihiro Nomura , Yoshii Morishita , Touichi Sakata , Hiroshi Nishizawa , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
发明人： Yasuhiro Yano , Hidekazu Matsuura , Yoshihiro Nomura , Yoshii Morishita , Touichi Sakata , Hiroshi Nishizawa , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L21/4763 , H01L21/469 , H01L21/31
CPC分类号： H01L21/02118 , G03F7/0387 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/312 , H01L21/3122 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.
摘要翻译：公开了一种树脂组合物，其包含（A）在室温下可溶于溶剂的耐热树脂，（B）耐热树脂，其在室温下不溶于溶剂但通过加热变得可溶，（C）溶剂; 进一步含有（D）表示橡胶弹性的颗粒或液态物质D的耐热树脂糊料; 以及使用该半导体器件的半导体器件及其制造方法。

3. 发明申请

US20060180908A1 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same 有权
公开(公告)号：US20060180908A1
公开(公告)日：2006-08-17
申请号：US11403810
申请日：2006-04-14
申请人： Yasuhiro Yano , Hidekazu Matsuura , Yoshihiro Nomura , Yoshii Morishita , Touichi Sakata , Hiroshi Nishizawa , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
发明人： Yasuhiro Yano , Hidekazu Matsuura , Yoshihiro Nomura , Yoshii Morishita , Touichi Sakata , Hiroshi Nishizawa , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
IPC分类号： H01L23/02
CPC分类号： H01L21/02118 , G03F7/0387 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/312 , H01L21/3122 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.

4. 发明授权

US4791157A Polyetheramide-imide polymer composition 失效
标题翻译：聚酰胺酰亚胺聚合物组合物
公开(公告)号：US4791157A
公开(公告)日：1988-12-13
申请号：US020885
申请日：1987-03-02
申请人： Hiroshi Nishizawa , Touichi Sakata , Yoshiyuki Mukoyama
发明人： Hiroshi Nishizawa , Touichi Sakata , Yoshiyuki Mukoyama
IPC分类号： C08L77/00 , C08G73/14 , C08J3/09 , C08L79/08 , C08K5/15
CPC分类号： C08J3/095 , C08G73/14 , C08J2379/08
摘要： A polyetheramide-imide polymer composition comprising an aromatic polyetheramide-imide polymer obtained by reacting trimellitic acid or a derivative thereof with a special aromatic diamine having ether linkages, and an ether compound and/or an alicyclic ketone compound as a solvent is excellent in film-forming properties at low temperatures.
摘要翻译：包含通过偏苯三酸或其衍生物与具有醚键的特殊芳族二胺反应获得的芳族聚醚酰胺 - 酰亚胺聚合物和醚化合物和/或脂环族酮化合物作为溶剂获得的聚醚酰胺 - 酰亚胺聚合物组合物具有优异的膜 - 在低温下形成性能。

5. 发明授权

US06372859B1 Thermoresistance adhesive and semiconductor device using the same 失效
标题翻译：耐热粘合剂和使用其的半导体器件
公开(公告)号：US06372859B1
公开(公告)日：2002-04-16
申请号：US09424550
申请日：1999-11-26
申请人： Touichi Sakata , Hiroshi Nishizawa , Keizo Hirai , Kenji Suzuki
发明人： Touichi Sakata , Hiroshi Nishizawa , Keizo Hirai , Kenji Suzuki
IPC分类号： C08L7700
CPC分类号： C09J9/00 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L2224/32014 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/73265 , H01L2924/01012 , H01L2924/01015 , H01L2924/01021 , H01L2924/01039 , H01L2924/01057 , H01L2924/01079 , H01L2924/10253 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A thermoresistance adhesive which does not dissolve in the sealer-composing resins at the sealer molding temperature and is capable of providing a semiconductor chip/lead frame adhesive strength under shear of 1 N/4 mm2 or greater, and including, for example, amide, imide, ester or ether linkage is suited for use in producing thermoresistance adhesive solutions and thermoresistance resin pastes, and the semiconductor chips, lead frames, films, etc., made by using such an adhesive are suited for providing low-cost semiconductor devices.
摘要翻译：一种热封粘合剂，其在密封件成型温度下不溶解在密封剂组合树脂中，并且能够在1N / 4mm 2或更大的剪切下提供半导体芯片/引线框架粘合强度，并且包括例如酰胺，酰亚胺，酯或醚键适用于生产耐热粘合剂溶液和耐热树脂浆料，并且使用这种粘合剂制成的半导体芯片，引线框架，薄膜等适于提供低成本的半导体器件。

6. 发明授权

US4530975A Polyamide-imide resin composition 失效
标题翻译：聚酰胺酰亚胺树脂组合物
公开(公告)号：US4530975A
公开(公告)日：1985-07-23
申请号：US429539
申请日：1982-09-30
申请人： Yoshiyuki Mukoyama , Touichi Sakata , Yuichi Osada
发明人： Yoshiyuki Mukoyama , Touichi Sakata , Yuichi Osada
IPC分类号： C08L79/08
CPC分类号： C08L79/08 , Y10T428/2938 , Y10T428/31529 , Y10T428/31605 , Y10T428/31681
摘要： A polyamide-imide resin composition comprising (A) a polyamide-imide resin modified with a polyisocyanate containing one or more isocyanurate rings and a lactam and (B) at least one member selected from the group consisting of (i) an alkoxy modified amino resin, (ii) a polyisocyanate containing one or more isocyanurate rings, (iii) a phenol-formaldehyde resin, (iv) an epoxy resin, (v) a polyester resin having one or more hydroxyl groups obtained by using terephthalic acid and/or isophthalic acid as an acid component, and (vi) a metal salt of Sn, Mn, Co or Zn, can give fast curing properties to the resin composition without lowering heat resistance, flexibility, abrasion resistance and also giving good surface appearance to the coating.
摘要翻译： 1.一种聚酰胺酰亚胺树脂组合物，其包含（A）由含有一个或多个异氰脲酸酯环和内酰胺的多异氰酸酯改性的聚酰胺酰亚胺树脂和（B）至少一种选自（i）烷氧基改性氨基树脂，（ii）含有一个或多个异氰脲酸酯环的多异氰酸酯，（iii）酚醛树脂，（iv）环氧树脂，（v）通过使用对苯二甲酸和/或间苯二甲酸获得的具有一个或多个羟基的聚酯树脂酸作为酸成分，和（vi）Sn，Mn，Co或Zn的金属盐可以赋予树脂组合物快速固化性能，而不降低耐热性，柔韧性，耐磨性，并且还赋予涂层良好的表面外观。

7. 发明授权

US4294952A Polyamide-imide resin and its production 失效
标题翻译：聚酰胺酰亚胺树脂及其生产
公开(公告)号：US4294952A
公开(公告)日：1981-10-13
申请号：US94938
申请日：1979-11-16
申请人： Yoshiyuki Mukoyama , Touichi Sakata
发明人： Yoshiyuki Mukoyama , Touichi Sakata
IPC分类号： C08G18/28 , C08G18/34 , C08G18/79 , C08G73/14 , H01B3/30 , C08G18/73 , C08G18/74 , C08G18/75 , C08G18/76
CPC分类号： C08G73/14 , C08G18/2855 , C08G18/34 , C08G18/345 , C08G18/791 , H01B3/305 , H01B3/306 , Y10T428/31605 , Y10T428/31681 , Y10T428/31721
摘要： A polyamide-imide resin obtained by reacting in a cresol type solvent a polyisocyanate containing isocyanurate rings, an aromatic diisocyanate, a lactam and a polycarboxylic acid containing at least one acid anhydride group, said polyisocyanate being used in an amount of 1 to 30 equivalent % and said lactam in an amount of 20 to 80 equivalent % each based on the total isocyanate equivalent can give a resin composition or a varnish suitable for coating, particularly for producing insulated wire excellent in heat resistance, flexibility, resistance to Freon, wear resistance, and the like.
摘要翻译：通过在甲酚型溶剂中使含有异氰脲酸酯环，芳香族二异氰酸酯，内酰胺和含有至少一个酸酐基的多元羧酸的多异氰酸酯反应得到的聚酰胺酰亚胺树脂，所述多异氰酸酯的使用量为1〜30当量％并且所述内酰胺的量相当于全部异氰酸酯当量为20〜80当量，可以得到适合于涂料的树脂组合物或清漆，特别是用于制造耐热性，柔韧性，耐氟利昂耐磨性，耐磨性，等等。

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