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1. 发明授权

US06404068B1 Paste composition, and protective film and semiconductor device both obtained with the same 失效
标题翻译：糊剂组合物，以及保护膜和半导体器件均获得相同
公开(公告)号：US06404068B1
公开(公告)日：2002-06-11
申请号：US09763192
申请日：2001-02-20
申请人： Toshiaki Tanaka , Takafumi Dohdoh , Tsutomu Kitakatsu , Aizou Kaneda , Masaaki Yasuda , Takashi Kousaka , Akira Kageyama
发明人： Toshiaki Tanaka , Takafumi Dohdoh , Tsutomu Kitakatsu , Aizou Kaneda , Masaaki Yasuda , Takashi Kousaka , Akira Kageyama
IPC分类号： H01L2348
CPC分类号： H01L23/3128 , C08L63/00 , C08L71/00 , C08L71/126 , C08L77/00 , C08L77/06 , C08L83/10 , C09D177/00 , C09D177/06 , C09D179/08 , H01L23/24 , H01L23/293 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01039 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , C08L2666/02 , C08L2666/08 , C08L2666/04 , C08L2666/14 , C08L2666/28 , H01L2924/00012 , H01L2924/00 , H01L2924/20753
摘要： A paste composition which comprises as essential ingredients (A) a thermoplastic resin, (B) an epoxy resin, (C) a coupling agent, (D) a powdery inorganic filler, (E) a powder having rubber elasticity and (F) an organic solvent and which, when applied and dried, gives a coating film having a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90 %RH of 500 g/m2·24 h or less; a protective film which is formed by applying the paste composition to a surface of a semiconductor part and drying it and has a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90%RH of 500 g/m2·24 h or less; and a semiconductor device having the protective film.
摘要翻译：作为必要成分（A）热塑性树脂，（B）环氧树脂，（C）偶联剂，（D）粉末状无机填料，（E）具有橡胶弹性的粉末和（F）有机溶剂，当涂布并干燥时，得到空隙率为3体积％以上的涂膜，在40℃，90％RH下测定的水蒸气透过率为500g / m 2·24h，减; 通过将糊剂组合物涂布在半导体部件的表面并干燥而形成的保护膜，其空隙率为3体积％以上，水分透过率为40℃，90％RH 500 g / m2.24 h以下; 以及具有保护膜的半导体器件。

2. 发明授权

US06611064B1 Semiconductor device and method for manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06611064B1
公开(公告)日：2003-08-26
申请号：US09744577
申请日：2001-04-05
申请人： Takashi Kousaka , Naoya Suzuki , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
发明人： Takashi Kousaka , Naoya Suzuki , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
IPC分类号： H01L2329
CPC分类号： H01L24/83 , H01L23/3121 , H01L23/3128 , H01L23/49816 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83136 , H01L2224/8319 , H01L2224/83855 , H01L2224/92247 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/12044 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/20753
摘要： In the present invention, provided are a semiconductor device having a semiconductor-element-mounting substrate on which a semiconductor element has been mounted via an adhesive having an exothermic-reaction curing start temperature of 130° C. or below as measured with a differential scanning calorimeter at a heating rate of 10° C./minute, and a process for its fabrication.
摘要翻译：在本发明中，提供了一种半导体器件，其具有半导体元件安装基板，半导体元件已经通过具有130℃或更低的放热反应固化开始温度的粘合剂安装在其上，用差示扫描测量量热计，加热速率为10℃/分钟，其制造方法。

3. 发明授权

US06223429B1 Method of production of semiconductor device 失效
标题翻译：半导体器件的生产方法
公开(公告)号：US06223429B1
公开(公告)日：2001-05-01
申请号：US08981509
申请日：1998-07-30
申请人： Aizou Kaneda , Masaaki Yasuda , Itsuo Watanabe , Tomohisa Ohta , Fumio Inoue , Yoshiaki Tsubomatsu , Toshio Yamazaki , Hiroto Ohata , Kenzo Takemura , Akira Nagai , Osamu Watanabe , Naoyuki Shiozawa , Kazuyoshi Kojima , Toshiaki Tanaka , Kazunori Yamamoto
发明人： Aizou Kaneda , Masaaki Yasuda , Itsuo Watanabe , Tomohisa Ohta , Fumio Inoue , Yoshiaki Tsubomatsu , Toshio Yamazaki , Hiroto Ohata , Kenzo Takemura , Akira Nagai , Osamu Watanabe , Naoyuki Shiozawa , Kazuyoshi Kojima , Toshiaki Tanaka , Kazunori Yamamoto
IPC分类号： H05K330
CPC分类号： H01L24/83 , H01L23/3121 , H01L23/49816 , H01L23/49883 , H01L24/29 , H01L24/32 , H01L24/97 , H01L25/18 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29384 , H01L2224/29444 , H01L2224/29469 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/73253 , H01L2224/81192 , H01L2224/8319 , H01L2224/838 , H01L2224/83951 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2924/00 , H01L2224/13111 , H01L2924/00014
摘要： To provide a highly reliable semiconductor device structure that enables cost reduction in the production of packages, inclusive of the cost for chips, and may cause less changes in connection resistance even under conditions of a long-term environmental resistance test. In a semiconductor device comprising a semiconductor chip face-down bonded to a wiring board, it has a structure wherein projecting metal portions are provided at the opposing wiring board terminals without forming bumps on bonding pads of the chip, the whole chip surface is bonded with an organic, anisotropic conductive adhesive material, and the whole or at least an edge of the back of the chip is covered with a sealing material.
摘要翻译：为了提供高可靠性的半导体器件结构，其能够降低封装的生产成本，包括芯片的成本，并且即使在长期耐环境测试的条件下也可能导致连接电阻的变化较小。在包括面向下接合到布线板的半导体芯片，其结构是在相对的布线板端子处设置突出的金属部分，而不在芯片的焊盘上形成凸块，整个芯片表面用有机的各向异性导电粘合剂材料，并且芯片的背面的整个或至少一个边缘被密封材料覆盖。

4. 发明授权

US07061081B2 Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof 失效
公开(公告)号：US07061081B2
公开(公告)日：2006-06-13
申请号：US10220846
申请日：2001-03-06
申请人： Yasuhiro Yano , Hidekazu Matsuura , Yoshihiro Nomura , Yoshii Morishita , Touichi Sakata , Hiroshi Nishizawa , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
发明人： Yasuhiro Yano , Hidekazu Matsuura , Yoshihiro Nomura , Yoshii Morishita , Touichi Sakata , Hiroshi Nishizawa , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
IPC分类号： C08L79/08 , H01L23/48
CPC分类号： H01L21/02118 , G03F7/0387 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/312 , H01L21/3122 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.

5. 发明授权

US07560307B2 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same 有权
标题翻译：树脂组合物，耐热树脂膏和使用这些的半导体器件及其制备方法
公开(公告)号：US07560307B2
公开(公告)日：2009-07-14
申请号：US11403810
申请日：2006-04-14
申请人： Yasuhiro Yano , Hidekazu Matsuura , Yoshihiro Nomura , Yoshii Morishita , Touichi Sakata , Hiroshi Nishizawa , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
发明人： Yasuhiro Yano , Hidekazu Matsuura , Yoshihiro Nomura , Yoshii Morishita , Touichi Sakata , Hiroshi Nishizawa , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L21/4763 , H01L21/469 , H01L21/31
CPC分类号： H01L21/02118 , G03F7/0387 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/312 , H01L21/3122 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.
摘要翻译：公开了一种树脂组合物，其包含（A）在室温下可溶于溶剂的耐热树脂，（B）耐热树脂，其在室温下不溶于溶剂但通过加热变得可溶，（C）溶剂; 进一步含有（D）表示橡胶弹性的颗粒或液态物质D的耐热树脂糊料; 以及使用该半导体器件的半导体器件及其制造方法。

6. 发明申请

US20060180908A1 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same 有权
公开(公告)号：US20060180908A1
公开(公告)日：2006-08-17
申请号：US11403810
申请日：2006-04-14
申请人： Yasuhiro Yano , Hidekazu Matsuura , Yoshihiro Nomura , Yoshii Morishita , Touichi Sakata , Hiroshi Nishizawa , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
发明人： Yasuhiro Yano , Hidekazu Matsuura , Yoshihiro Nomura , Yoshii Morishita , Touichi Sakata , Hiroshi Nishizawa , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
IPC分类号： H01L23/02
CPC分类号： H01L21/02118 , G03F7/0387 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/312 , H01L21/3122 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.

7. 发明授权

US08233774B2 Video recorder and method of processing recording schedule 有权
标题翻译：视频录像机和处理记录时间表的方法
公开(公告)号：US08233774B2
公开(公告)日：2012-07-31
申请号：US12267236
申请日：2008-11-07
申请人： Hideyuki Aisu , Tomoyuki Miura , Takashi Doi , Toshiaki Tanaka , Hiroyuki Kamio , Masatoshi Murakami , Yoshio Kataoka , Akinori Ohta
发明人： Hideyuki Aisu , Tomoyuki Miura , Takashi Doi , Toshiaki Tanaka , Hiroyuki Kamio , Masatoshi Murakami , Yoshio Kataoka , Akinori Ohta
IPC分类号： H04N5/93
CPC分类号： H04N7/163 , H04N21/21 , H04N21/23 , H04N21/4334 , H04N21/4583 , H04N21/47214
摘要： A video recorder includes a schedule reconfiguration section having: a local deterioration determining module that determines whether a local deterioration in a recording state occurs by performing simulating the recording state obtained when the reallocated resources are used for performing the programmed recordings and comparing the simulated recording state with a recording state obtained when the resources before the reallocation is used for performing the programmed recordings; and an allocation restoring module that restores the reallocated resources at a part causing the local deterioration to the resources allocated before the reallocation when the local deterioration determining module determines the occurrence of the local deterioration.
摘要翻译：视频记录器包括一个调度重新配置部分，具有：局部劣化确定模块，通过执行模拟当使用重新分配的资源来执行编程记录时所获得的记录状态，并且比较模拟的记录状态，确定是否发生记录状态的局部恶化当将重新分配前的资源用于执行编程记录时获得记录状态; 以及分配恢复模块，其在局部劣化确定模块确定局部劣化的发生时，在重新分配前分配的资源的局部劣化部分恢复重新分配的资源。

8. 发明申请

US20120165339A1 CYCLOPROPANE DERIVATIVES 审中-公开
标题翻译：环丙基衍生物
公开(公告)号：US20120165339A1
公开(公告)日：2012-06-28
申请号：US13330972
申请日：2011-12-20
申请人： Taro Terauchi , Ayumi Takemura , Yuji Kazuta , Fumihiro Ozaki , Takashi Doko , Yu Yoshida , Toshiaki Tanaka , Keiichi Sorimachi , Yoshimitsu Naoe , Carsten Beuckmann
发明人： Taro Terauchi , Ayumi Takemura , Yuji Kazuta , Fumihiro Ozaki , Takashi Doko , Yu Yoshida , Toshiaki Tanaka , Keiichi Sorimachi , Yoshimitsu Naoe , Carsten Beuckmann
IPC分类号： A61K31/501 , A61K31/444 , A61K31/443 , A61K31/4439 , A61K31/44 , A61K31/4196 , A61K31/427 , A61K31/428 , A61K31/42 , A61K31/4184 , A61K31/415 , A61K31/165 , C07D237/16 , C07D413/12 , C07D401/12 , C07D405/12 , C07D213/75 , C07D285/08 , C07D417/12 , C07D275/03 , C07D261/14 , C07D249/08 , C07D231/56 , C07D231/18 , C07C233/60 , A61P25/20 , A61K31/50
CPC分类号： C07D231/20 , C07C235/40 , C07D213/55 , C07D213/65 , C07D213/68 , C07D213/69 , C07D213/75 , C07D231/12 , C07D233/60 , C07D235/12 , C07D237/16 , C07D237/20 , C07D239/42 , C07D241/18 , C07D253/065 , C07D261/14 , C07D261/20 , C07D271/10 , C07D275/03 , C07D277/24 , C07D277/36 , C07D277/46 , C07D285/08 , C07D285/135 , C07D401/12 , C07D405/12 , C07D413/12 , C07D417/12
摘要： A cyclopropane derivative represented by the following formula (I) or a pharmaceutically acceptable salt thereof has orexin receptor inhibitory action, and thus, is extremely useful as an agent for preventing or treating sleep disorder or dyssomnia caused by orexin, including insomnia as a typical example: wherein A1, A2 and A3 each independently represent an aryl group, a heterocyclyl group or the like, R1, R2 and R3 each independently represent a hydrogen atom, a C1-6 alkyl group or the like, X represents an oxygen atom or the like, and L represents a bond or the like.
摘要翻译：由下式（I）表示的环丙烷衍生物或其药学上可接受的盐具有食欲素受体抑制作用，因此作为典型的例子，包括失眠引起的睡眠障碍或睡眠障碍引起的睡眠障碍或睡眠不适，：其中A1，A2和A3各自独立地表示芳基，杂环基等，R1，R2和R3各自独立地表示氢原子，C1-6烷基等，X表示氧原子或类似，L表示键或类似物。

9. 发明授权

US08022431B2 Illuminating apparatus, method for fabricating the using the same and display apparatus using the same 有权
标题翻译：照明装置，使用其的制造方法以及使用其的显示装置
公开(公告)号：US08022431B2
公开(公告)日：2011-09-20
申请号：US11265258
申请日：2005-11-03
申请人： Hiroki Kaneko , Ikuo Hiyama , Toshiaki Tanaka , Masaya Adachi , Tsunenori Yamamoto , Haruo Akahoshi
发明人： Hiroki Kaneko , Ikuo Hiyama , Toshiaki Tanaka , Masaya Adachi , Tsunenori Yamamoto , Haruo Akahoshi
IPC分类号： H01L33/00
CPC分类号： G02F1/133603 , G02F2001/133612 , H01L25/0753 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16245 , H01L2224/32245 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An illuminating apparatus has a reduced number of mounting spots by soldering or the like to permit an increased yield rate and a reduced cost. The illuminating apparatus has light emitting diodes, lead frames, and a transparent sealer. N light emitting diodes, N sets of lead frames mounted with the N light emitting diodes, and one set or more of lead frames each not mounted with a light emitting diode are sealed by the transparent sealer for integration into a modular illuminating apparatus. Also provided are a method for fabricating the illuminating apparatus, and a display apparatus using the illuminating apparatus.
摘要翻译：照明装置通过焊接等减少安装点的数量以允许提高的产量和降低的成本。照明装置具有发光二极管，引线框架和透明的封口机。 N个发光二极管，安装有N个发光二极管的N组引线框和每个未安装有发光二极管的一个或多个引线框被透明封口机密封，用于集成到模块化照明装置中。还提供了用于制造照明装置的方法和使用该照明装置的显示装置。

10. 发明授权

US08010834B2 Failure information monitoring apparatus and failure information monitoring method 失效
标题翻译：故障信息监控设备和故障信息监控方法
公开(公告)号：US08010834B2
公开(公告)日：2011-08-30
申请号：US12569956
申请日：2009-09-30
申请人： Toshiaki Tanaka , Palina Inthavong
发明人： Toshiaki Tanaka , Palina Inthavong
IPC分类号： G06F11/00
CPC分类号： G06F11/3476 , G06F11/0706 , G06F11/0781
摘要： According to an aspect of the embodiment, an area control unit refers to usage information of an area management table based on a determined type of an extracted failure information, determines whether the extracted failure information can be stored in a identified lower storage areas, determines a storage location for the extracted failure information in the identified lower storage areas when the extracted failure information can be stored in the identified lower storage areas, and determines a storage location for the extracted failure information in the upper storage areas other than an upper storage area including the identified lower storage areas based on the area management table when the extracted failure information cannot be stored in the identified lower storage areas.
摘要翻译：根据实施例的一个方面，区域控制单元基于所提取的故障信息的确定类型来参考区域管理表的使用信息，确定提取的故障信息是否可以存储在识别的下部存储区域中，确定当所提取的故障信息可以存储在所识别的下部存储区域中时，在所识别的下部存储区域中提取的故障信息的存储位置，并且确定除了上部存储区域之外的上部存储区域中提取的故障信息的存储位置，所述上部存储区域包括当所提取的故障信息不能存储在所识别的下部存储区域中时，基于区域管理表来识别的下部存储区域。

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