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1. 发明授权

US07677955B2 Grinding method for wafer 有权
标题翻译：晶圆研磨方法
公开(公告)号：US07677955B2
公开(公告)日：2010-03-16
申请号：US12243483
申请日：2008-10-01
申请人： Keiichi Kajiyama , Takatoshi Masuda , Shinya Watanabe , Shigehiko Aoki , Hirotoshi Hoshikawa , Yoshikazu Kobayashi , Seiji Harada , Setsuo Yamamoto
发明人： Keiichi Kajiyama , Takatoshi Masuda , Shinya Watanabe , Shigehiko Aoki , Hirotoshi Hoshikawa , Yoshikazu Kobayashi , Seiji Harada , Setsuo Yamamoto
IPC分类号： B24B49/00
CPC分类号： B24D7/18 , B24B1/00 , B24B7/228
摘要： A grinding method for a wafer having a plurality of devices on the front side, wherein the back side of the wafer is ground by a grinding wheel to suppress the motion of heavy metal in the wafer by a gettering effect and also to maintain the die strength of each device at about 1,000 MPa or more. The grinding wheel is composed of a frame and an abrasive member fixed to the free end of the frame. The abrasive member is produced by fixing diamond abrasive grains having a grain size of less than or equal to 1 μm with a vitrified bond. A protective member is attached to the front side of the wafer and the wafer is held on a chuck table in the condition where the protective member is in contact with the chuck table. The grinding wheel is rotated as rotating the chuck table to thereby grind the back side of the wafer by means of the abrasive member so that the average surface roughness of the back side of the wafer becomes less than or equal to 0.003 μm and the thickness of a strain layer remaining on the back side of the wafer becomes 0.05 μm.
摘要翻译：一种用于在前侧具有多个器件的晶片的研磨方法，其中晶片的背面通过砂轮研磨，以通过吸气效应抑制晶片中重金属的运动，并且还保持模具强度的每个装置在约1000MPa或更大。砂轮由固定在框架自由端的框架和研磨件构成。研磨构件通过用玻璃化粘合剂固定具有小于或等于1μm的晶粒尺寸的金刚石磨粒来制造。在保护构件与卡盘台接触的状态下，将保护构件安装在晶片的前侧，并将晶片保持在卡盘台上。砂轮沿着卡盘台转动而旋转，从而通过研磨部件磨削晶片的背面，使得晶片背面的平均表面粗糙度小于或等于0.003μm，厚度为残留在晶片背面的应变层为0.05μm。

2. 发明申请

US20090098808A1 GRINDING METHOD FOR WAFER 有权
标题翻译：砂轮研磨方法
公开(公告)号：US20090098808A1
公开(公告)日：2009-04-16
申请号：US12243483
申请日：2008-10-01
申请人： Keiichi Kajiyama , Takatoshi Masuda , Shinya Watanabe , Shigehiko Aoki , Hirotoshi Hoshikawa , Yoshikazu Kobayashi , Seiji Harada , Setsuo Yamamoto
发明人： Keiichi Kajiyama , Takatoshi Masuda , Shinya Watanabe , Shigehiko Aoki , Hirotoshi Hoshikawa , Yoshikazu Kobayashi , Seiji Harada , Setsuo Yamamoto
IPC分类号： B24B1/00 , B24B7/00
CPC分类号： B24D7/18 , B24B1/00 , B24B7/228
摘要： A grinding method for a wafer having a plurality of devices on the front side, wherein the back side of the wafer is ground by a grinding wheel to suppress the motion of heavy metal in the wafer by a gettering effect and also to maintain the die strength of each device at about 1,000 MPa or more. The grinding wheel is composed of a frame and an abrasive member fixed to the free end of the frame. The abrasive member is produced by fixing diamond abrasive grains having a grain size of less than or equal to 1 μm with a vitrified bond. A protective member is attached to the front side of the wafer and the wafer is held on a chuck table in the condition where the protective member is in contact with the chuck table. The grinding wheel is rotated as rotating the chuck table to thereby grind the back side of the wafer by means of the abrasive member so that the average surface roughness of the back side of the wafer becomes less than or equal to 0.003 μm and the thickness of a strain layer remaining on the back side of the wafer becomes 0.05 μm.
摘要翻译：一种用于在前侧具有多个器件的晶片的研磨方法，其中晶片的背面通过砂轮研磨，以通过吸气效应抑制晶片中重金属的运动，并且还保持模具强度的每个装置在约1000MPa或更大。砂轮由固定在框架自由端的框架和研磨件构成。研磨部件通过将具有小于或等于1μm的粒度的金刚石磨粒与玻璃化粘合固定而制成。在保护构件与卡盘台接触的状态下，将保护构件安装在晶片的前侧，并将晶片保持在卡盘台上。砂轮以旋转卡盘台的方式旋转，从而通过研磨部件磨削晶片的背面，使得晶片背面的平均表面粗糙度小于或等于0.003μm，厚度为残留在晶片背面的应变层为0.05μm。

3. 发明授权

US08025556B2 Method of grinding wafer 有权
标题翻译：研磨晶圆的方法
公开(公告)号：US08025556B2
公开(公告)日：2011-09-27
申请号：US12349770
申请日：2009-01-07
申请人： Keiichi Kajiyama , Takatoshi Masuda , Shinya Watanabe , Setsuo Yamamoto
发明人： Keiichi Kajiyama , Takatoshi Masuda , Shinya Watanabe , Setsuo Yamamoto
IPC分类号： B24B1/00
CPC分类号： B24B37/042 , B24B27/0076
摘要： A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck table by positioning a grinding surface of a rough grinding wheel at a predetermined inclination angle relative to the holding surface of said chuck table, and rotating the rough grinding wheel; and a finish grinding step for performing finish grinding of the wafer by positioning a grinding surface of a finish grinding wheel in parallel to the holding surface of the chuck table, and rotating the finish grinding wheel in a grinding region of the grinding wheel in a direction toward the vertex of the contact angle between the grinding surface of the finish grinding wheel and the surface to be ground of the wafer.
摘要翻译：一种研磨晶片的方法，包括：晶片保持步骤，用于将晶片保持在具有保持表面的卡盘台的锥形保持表面上; 通过将粗磨轮的研磨面相对于所述夹盘的保持面定位成预定的倾斜角度，对保持在卡盘台的保持面上的晶片进行粗磨，粗磨加工，轮; 以及精磨步骤，通过将精磨轮的研磨面与夹盘的保持面平行地定位，使精磨砂轮在砂轮的研磨区域中沿着方向朝向精磨轮的磨削表面与待研磨的表面之间的接触角的顶点。

4. 发明申请

US20090186562A1 METHOD OF GRINDING WAFER 有权
标题翻译：研磨方法
公开(公告)号：US20090186562A1
公开(公告)日：2009-07-23
申请号：US12349770
申请日：2009-01-07
申请人： Keiichi Kajiyama , Takatoshi Masuda , Shinya Watanabe , Setsuo Yamamoto
发明人： Keiichi Kajiyama , Takatoshi Masuda , Shinya Watanabe , Setsuo Yamamoto
IPC分类号： B24B1/00
CPC分类号： B24B37/042 , B24B27/0076
摘要： A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck table by positioning a grinding surface of a rough grinding wheel at a predetermined inclination angle relative to the holding surface of said chuck table, and rotating the rough grinding wheel; and a finish grinding step for performing finish grinding of the wafer by positioning a grinding surface of a finish grinding wheel in parallel to the holding surface of the chuck table, and rotating the finish grinding wheel in a grinding region of the grinding wheel in a direction toward the vertex of the contact angle between the grinding surface of the finish grinding wheel and the surface to be ground of the wafer.
摘要翻译：一种研磨晶片的方法，包括：晶片保持步骤，用于将晶片保持在具有保持表面的卡盘台的锥形保持表面上; 通过将粗磨轮的研磨面相对于所述夹盘的保持面定位成预定的倾斜角度，对保持在卡盘台的保持面上的晶片进行粗磨，粗磨加工，轮; 以及精磨步骤，通过将精磨轮的研磨面与夹盘的保持面平行地定位，使精磨砂轮在砂轮的研磨区域中沿着方向朝向精磨轮的磨削表面与待研磨的表面之间的接触角的顶点。

5. 发明授权

US06221519B1 Magnetic recording medium and process for producing the same 失效
标题翻译：磁记录介质及其制造方法
公开(公告)号：US06221519B1
公开(公告)日：2001-04-24
申请号：US09272622
申请日：1999-03-19
申请人： Takanori Doi , Kousaku Tamari , Yasuo Kakihara , Kenichi Nakata , Mitsuru Matsuura , Setsuo Yamamoto
发明人： Takanori Doi , Kousaku Tamari , Yasuo Kakihara , Kenichi Nakata , Mitsuru Matsuura , Setsuo Yamamoto
IPC分类号： G11B566
CPC分类号： G11B5/7325 , G11B5/656 , G11B5/84 , G11B5/8404 , Y10S428/90
摘要： A magnetic recording medium comprising: a plastic substrate; a nickel oxide underlayer formed on said substrate; and a cobalt-containing maghemite thin film formed on said nickel oxide underlayer, containing cobalt at a molar ratio of cobalt to iron of 0.01:1 to 0.1:1, and having either a spacing of a plane (311) of not more than 2.510 Å, a spacing of a plane (222) of not more than 2.415 Å or a spacing of a plane (220) of not more than 2.950 Å, a ratio value of an X-ray diffraction pattern peak intensity of either of the planes (311), (222) and (220) of said cobalt-containing maghemite thin film to an X-ray diffraction pattern peak intensity of the plane (400) thereof being more than 0.5. Such magnetic recording medium suitably applicable to existent magnetic recording systems using a ring-type magnetic head and capable of using a plastic substrate for providing a magnetic recording medium for high-density recording.
摘要翻译：一种磁记录介质，包括：塑料基板;形成在所述基板上的氧化镍底层; 和在所述氧化镍底层上形成的含钴的磁赤铁矿薄膜，其含有钴与铁的摩尔比为0.01:1至0.1:1的钴，并且具有不大于2.510的平面（311）的间隔，平面（222）的间距不大于2.415或平面（220）的间距不大于2.950，任一平面（311）的X射线衍射图峰值强度的比值），所述含钴磁赤铁矿薄膜的（222）和（220）相对于所述平面（400）的X射线衍射图峰值强度大于0.5。这种磁记录介质适用于使用环形磁头的现有磁记录系统，并能够使用塑料基板提供用于高密度记录的磁记录介质。

6. 发明授权

US5119317A Routing method and system 失效
标题翻译：路由方法和系统
公开(公告)号：US5119317A
公开(公告)日：1992-06-02
申请号：US323832
申请日：1989-03-15
申请人： Noboru Narikawa , Setsuo Yamamoto , Takuji Takayama , Norio Sasaki
发明人： Noboru Narikawa , Setsuo Yamamoto , Takuji Takayama , Norio Sasaki
IPC分类号： G06F17/50
CPC分类号： G06F17/509 , G06F2217/08 , G06F2217/34
摘要： A routing system for finding a route which satisfies predetermined limiting conditions in a space of an object space with an aid of a computer, includes a first processor for dividing at least the object area into a plurality of areas and extracting a divided area or divided areas which satisfy the predetermined limiting conditions from the plurality of divided areas, and a second processor for further dividing the divided area or divided areas extracted by the first processor into a plurality of subdivided areas and extracting a subdivided area or subdivided areas which satisfy the predetermined limiting conditions from the plurality of subdivided areas.
摘要翻译：一种借助计算机找到满足对象空间空间中的预定限制条件的路由的路由系统，包括：第一处理器，用于至少将对象区域划分成多个区域，并提取分割区域或划分区域其满足来自多个分割区域的预定限制条件，以及第二处理器，用于将由第一处理器提取的划分区域或划分区域进一步划分为多个细分区域，并提取满足预定限制的细分区域或细分区域条件从多个细分区域。

7. 发明授权

US4449662A Corner holder for use with boxes 失效
标题翻译：角箱用于盒子
公开(公告)号：US4449662A
公开(公告)日：1984-05-22
申请号：US406834
申请日：1982-08-10
申请人： Kouichi Okamura , Yukio Eriguchi , Katsushige Hagio , Setsuo Yamamoto
发明人： Kouichi Okamura , Yukio Eriguchi , Katsushige Hagio , Setsuo Yamamoto
IPC分类号： B65D5/00 , B65D5/42 , B65D5/44 , B65D6/26 , B65D6/24
CPC分类号： B65D5/4283 , B65D5/006 , B65D5/445 , Y10T403/725
摘要： A corner holder for use with a box of corrugated cardboard having a pair of slots in sidewalls thereof adjacent to a corner of the box, comprises a pair of inserts each including a tongue-shaped base plate and a U-shaped flange on the base plate, and a flexible connector web joined between the inserts. The base plate and the flange jointly define a channel or groove extending along opposite side edges and an arcuate bottom edge of the base plate. When the corner holder is installed on the box, the inserts are inserted in the slots, respectively, with edges of the sidewalls which define the slots being fitted in the grooves in the inserts. The corner of the box is thus clamped and reinforced by the corner holder. The box can readily be folded into a collapsed form simply by removing the inserts out of the slots.
摘要翻译：一个用于与箱体相邻的侧壁中的一对槽的瓦楞纸箱一起使用的角架，包括一对插入件，每个插入件包括在基板上的舌形基板和U形凸缘以及连接在插入件之间的柔性连接片。底板和凸缘共同限定了一个通道或凹槽，该通道或凹槽沿相对的侧边缘和基板的弓形底部边缘延伸。当角落架安装在箱体上时，插入件分别插入插槽中，侧壁边界限定槽插入插入槽中。盒子的角部由夹具固定并加固。通过将插入物从插槽中取出，该盒子可以容易地折叠成折叠形式。

8. 发明授权

US3939929A Apparatus for regulating supply quantity of textile fibers to a weighing device 失效
标题翻译：用于将称量装置的纺织纤维供给量调节的装置
公开(公告)号：US3939929A
公开(公告)日：1976-02-24
申请号：US551655
申请日：1975-02-21
申请人： Hideo Hidaka , Setsuo Yamamoto
发明人： Hideo Hidaka , Setsuo Yamamoto
IPC分类号： D01G13/00 , D01G23/04 , G01G13/08 , G01G13/28 , G01G17/02 , G01G13/04
CPC分类号： D01G23/045 , D01G13/00 , G01G13/08 , G01G13/28 , G01G17/02
摘要： In a spinning machine having a weighing device for receiving fiber tufts from a hopper thereof and for intermittently supplying a block of fiber tufts of a predetermined quantity to a subsequent process by repeated unit supply operations, the gauge between a lifting apron and an evener cylinder of the opening machine is reduced to a predetermined small gauge during a last period of each unit supply operation. Further the driving speed of the lifting apron is capable of selectively reducing during the above-mentioned last period and the supplying operation is continued until the quantity of fiber tufts accumulated in a weigh pan of the weighing mechanism becomes a predetermined final quantity for the unit supply operation.
摘要翻译：在具有用于从其料斗接收纤维簇的称重装置的纺丝机中，通过重复的单元供给操作，间歇地向预定量的纤维簇供给预定量的纤维簇，提升围裙与提升滚筒之间的量规在每个单元供应操作的最后期间，打开机器被减小到预定的小规格。进一步，在上述最后期间，提升围裙的行驶速度能够选择性地降低，供给运转持续到堆积在称重机构的称重盘内的纤维簇的数量成为单位供给量的规定的最终量操作。

9. 发明授权

US07736215B2 Polishing tool and polishing method and apparatus using same 有权
标题翻译：抛光工具及抛光方法及使用方法
公开(公告)号：US07736215B2
公开(公告)日：2010-06-15
申请号：US11987382
申请日：2007-11-29
申请人： Sinnosuke Sekiya , Setsuo Yamamoto , Yutaka Koma , Masashi Aoki
发明人： Sinnosuke Sekiya , Setsuo Yamamoto , Yutaka Koma , Masashi Aoki
IPC分类号： B24B1/00
CPC分类号： B24D11/00 , B24B7/228 , B24D13/147
摘要： A polishing tool comprising a support member, and polishing means fixed to the support member. The polishing means is composed of felt having a density of 0.20 g/cm3 or more and a hardness of 30 or more, and abrasive grains dispersed in the felt. A polishing method and apparatus involving pressing the polishing means against a surface of a workpiece to be polished, while rotating the workpiece and also rotating the polishing tool.
摘要翻译：一种抛光工具，包括支撑构件和固定到支撑构件上的抛光装置。抛光装置由密度为0.20g / cm 3以上且硬度为30以上的毡和分散在毡中的磨粒组成。一种抛光方法和装置，包括在旋转工件的同时将抛光装置压靠待抛光工件的表面并且还旋转抛光工具。

10. 发明授权

US09274021B2 Leakage inspection apparatus and leakage inspection method 有权
标题翻译：泄漏检查装置和泄漏检查方法
公开(公告)号：US09274021B2
公开(公告)日：2016-03-01
申请号：US13808226
申请日：2011-07-01
申请人： Setsuo Yamamoto , Hiroki Kurisu , Naoki Takada , Mitsugu Nakagawa , Katsushi Tsuge , Yukihiro Ishikawa
发明人： Setsuo Yamamoto , Hiroki Kurisu , Naoki Takada , Mitsugu Nakagawa , Katsushi Tsuge , Yukihiro Ishikawa
IPC分类号： G01M3/20 , G01M3/22 , G01M3/32
CPC分类号： G01M3/20 , G01M3/229 , G01M3/3281
摘要： Provided are a leakage inspection apparatus and a leakage inspection method for inspecting the flow rate of leakage from a tested body disposed in a tested-body chamber 21. The leakage inspection apparatus includes liquid supplying and pressurizing means 11 for supplying a probe liquid to the inside of the tested-body chamber 21 and pressurizing the probe liquid to a high pressure 0.1 MPa or more, vacuum evacuation means 22-b, 23-b and a quadrupole mass spectrometer 34. The tested body 21 is evacuated, the probe liquid is supplied to the inside of the tested body and pressurized to 0.1 MPa or more and the concentration of a probe medium leaked from the tested body and evaporated in a vacuum is measured by the quadrupole mass spectrometer 34, thereby measuring the flow rate of leakage from the tested body. This makes it possible to determine the flow rate of leakage using a liquid as a probe medium and simultaneously possible to perform a pressure tightness inspection at an atmospheric pressure of 0.1 MPa or more, especially at a high pressure ranging from 1 MPa to 1 GPa.
摘要翻译：提供了一种用于检查设置在被测体室21中的被测体的泄漏流量的泄漏检查装置和泄漏检查方法。泄漏检查装置包括用于向内部供给探针液的液体供给和加压装置11 的试验体室21，将探针液加压至高压0.1MPa以上的真空排气装置22-b，23-b和四极质谱仪34.将被检体21抽真空，供给探针液到被测体的内部并加压到0.1MPa以上，并且通过四极质谱仪34测量从测试体泄漏并在真空中蒸发的探针介质的浓度，由此测量来自测试体的泄漏流量身体。这使得可以使用液体作为探针介质来确定泄漏流量，并且同时可以在大气压为0.1MPa以上，特别是在1MPa〜1GPa的高压下进行压力密封性检查。

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