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    • 8. 发明授权
    • Programmable memory array structure incorporating series-connected transistor strings and methods for fabrication and operation of same
    • 并联串联晶体管串的可编程存储器阵列结构及其制造和操作的方法
    • US07505321B2
    • 2009-03-17
    • US10335078
    • 2002-12-31
    • Roy E. ScheuerleinChristopher PettiAndrew J. WalkerEn-Hsing ChenSucheta NallamothuAlper IlkbaharLuca FasoliIgor Koutnetsov
    • Roy E. ScheuerleinChristopher PettiAndrew J. WalkerEn-Hsing ChenSucheta NallamothuAlper IlkbaharLuca FasoliIgor Koutnetsov
    • G11C11/34G11C16/04G11C5/06G11C8/00
    • H01L27/11568G11C11/5621G11C16/0483H01L27/115H01L27/1159
    • A three-dimensional flash memory array incorporates thin film transistors having a charge storage dielectric arranged in series-connected NAND strings to achieve a 4F2 memory cell layout. The memory array may be programmed and erased using only tunneling currents, and no leakage paths are formed through non-selected memory cells. Each NAND string includes two block select devices for respectively coupling one end of the NAND string to a global bit line, and the other end to a shared bias node. Pairs of NAND strings within a block share the same global bit line. The memory cells are preferably depletion mode SONOS devices, as are the block select devices. The memory cells may be programmed to a near depletion threshold voltage, and the block select devices are maintained in a programmed state having a near depletion mode threshold voltage. NAND strings on more than one layer may be connected to global bit lines on a single layer. By interleaving the NAND strings on each memory level and using two shared bias nodes per block, very little additional overhead is required for the switch devices at each end of the NAND strings. The NAND strings on different memory levels are preferably connected together by way of vertical stacked vias, each preferably connecting to more than one memory level. Each memory level may be produced with less than three masks per level.
    • 三维闪存阵列包括具有布置在串联连接的NAND串中的电荷存储电介质的薄膜晶体管,以实现4F2存储单元布局。 可以仅使用隧穿电流对存储器阵列进行编程和擦除,并且不通过未选择的存储器单元形成泄漏路径。 每个NAND串包括用于分别将NAND串的一端耦合到全局位线的两个块选择器件,另一端连接到共享偏置节点。 块内的一对NAND串共享相同的全局位线。 存储器单元优选地是耗尽型SONOS器件,块选择器件也是如此。 存储器单元可以被编程为接近耗尽阈值电压,并且块选择器件保持在具有接近耗尽模式阈值电压的编程状态。 多个层上的NAND串可以连接到单个层上的全局位线。 通过在每个存储器级别交错NAND串并且每个块使用两个共享偏置节点,对于NAND串的每一端的开关器件需要非常少的附加开销。 不同存储器级别的NAND串优选通过垂直堆叠的通孔连接在一起,每个优选地连接到多于一个的存储器级。 每个存储器级别可以以每级别少于三个掩码来生成。
    • 9. 发明授权
    • Method for fabricating programmable memory array structures incorporating series-connected transistor strings
    • 用于制造并入串联晶体管串的可编程存储器阵列结构的方法
    • US07005350B2
    • 2006-02-28
    • US10335089
    • 2002-12-31
    • Andrew J. WalkerEn-Hsing ChenSucheta NallamothuRoy E. ScheuerleinAlper IlkbaharLuca FasoliIgor KoutnetsovChristopher Petti
    • Andrew J. WalkerEn-Hsing ChenSucheta NallamothuRoy E. ScheuerleinAlper IlkbaharLuca FasoliIgor KoutnetsovChristopher Petti
    • H01L21/336
    • H01L27/11568G11C16/0483H01L27/115H01L27/11502
    • A three-dimensional flash memory array incorporates thin film transistors having a charge storage dielectric arranged in series-connected NAND strings to achieve a 4F2 memory cell layout. The memory array may be programmed and erased using only tunneling currents, and no leakage paths are formed through non-selected memory cells. Each NAND string includes two block select devices for respectively coupling one end of the NAND string to a global bit line, and the other end to a shared bias node. Pairs of NAND strings within a block share the same global bit line. The memory cells are preferably depletion mode SONOS devices, as are the block select devices. The memory cells may be programmed to a near depletion threshold voltage, and the block select devices are maintained in a programmed state having a near depletion mode threshold voltage. NAND strings on more than one layer may be connected to global bit lines on a single layer. By interleaving the NAND strings on each memory level and using two shared bias nodes per block, very little additional overhead is required for the switch devices at each end of the NAND strings. The NAND strings on different memory levels are preferably connected together by way of vertical stacked vias, each preferably connecting to more than one memory level. Each memory level may be produced with less than three masks per level.
    • 三维闪存阵列包括具有布置在串联连接的NAND串中的电荷存储电介质的薄膜晶体管,以实现4F 2存储单元布局。 可以仅使用隧穿电流对存储器阵列进行编程和擦除,并且不通过未选择的存储器单元形成泄漏路径。 每个NAND串包括用于分别将NAND串的一端耦合到全局位线的两个块选择器件,另一端连接到共享偏置节点。 块内的一对NAND串共享相同的全局位线。 存储器单元优选地是耗尽型SONOS器件,块选择器件也是如此。 存储器单元可以被编程为接近耗尽阈值电压,并且块选择器件保持在具有接近耗尽模式阈值电压的编程状态。 多个层上的NAND串可以连接到单个层上的全局位线。 通过在每个存储器级别交错NAND串并且每个块使用两个共享偏置节点,对于NAND串的每一端的开关器件需要非常少的附加开销。 不同存储器级别的NAND串优选通过垂直堆叠的通孔连接在一起,每个优选地连接到多于一个的存储器级。 每个存储器级别可以以每级别少于三个掩码来生成。
    • 10. 发明授权
    • Voltage protection device
    • 电压保护装置
    • US08278684B1
    • 2012-10-02
    • US11954514
    • 2007-12-12
    • Andrew J. WalkerHelmut Puchner
    • Andrew J. WalkerHelmut Puchner
    • H01L29/66
    • H01L29/7436H01L27/0262H01L29/0603
    • A voltage protection device and method is provided to prevent accidental triggering of an silicon-controlled rectifier (SCR) unless the electrostatic discharge (ESD) is at a predefined threshold above the normal power supply operating voltage or below the ground supply operating voltage. The holding voltage upon the SCR is maintained above the threshold voltage to prevent accidental triggering. The present SCR avoids use of an additional field effect transistor (FET), and avoids relying upon the breakdown of the drain terminal of the FET, but instead programs the amount of holding voltage needed above the power supply voltage using mask-programmability, fuses, or other means for maintaining the holding voltage to a desired range above the power supply voltage. The programmed holding voltage is implemented using a barrier region between the PNP and the NPN of the PNPN junctions of the SCR. In addition to or as an alternative to the barrier region, hole sink junctions can be implemented close to the anode to reduce the substrate resistance in the vicinity of the anode and, therefore, extract holes from their normal target destination.
    • 提供了一种电压保护装置和方法,以防止硅可控整流器(SCR)的意外触发,除非静电放电(ESD)处于高于正常电源工作电压或低于接地电源工作电压的预定阈值。 SCR上的保持电压保持在阈值电压以上,以防止意外触发。 当前的SCR避免使用附加的场效应晶体管(FET),并且避免依赖于FET的漏极端子的击穿,而是使用掩模可编程性,保险丝来编程所需的高于电源电压的保持电压量, 或用于将保持电压维持在高于电源电压的期望范围的其它装置。 编程的保持电压使用PNP与SCR的PNPN结的NPN之间的屏障区域来实现。 除了作为屏障区域的替代方案之外,可以在阳极附近实现空穴接合点,以降低阳极附近的衬底电阻,并因此从其正常目标目的地提取孔。