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    • 6. 发明授权
    • Programmable memory array structure incorporating series-connected transistor strings and methods for fabrication and operation of same
    • 并联串联晶体管串的可编程存储器阵列结构及其制造和操作的方法
    • US07505321B2
    • 2009-03-17
    • US10335078
    • 2002-12-31
    • Roy E. ScheuerleinChristopher PettiAndrew J. WalkerEn-Hsing ChenSucheta NallamothuAlper IlkbaharLuca FasoliIgor Koutnetsov
    • Roy E. ScheuerleinChristopher PettiAndrew J. WalkerEn-Hsing ChenSucheta NallamothuAlper IlkbaharLuca FasoliIgor Koutnetsov
    • G11C11/34G11C16/04G11C5/06G11C8/00
    • H01L27/11568G11C11/5621G11C16/0483H01L27/115H01L27/1159
    • A three-dimensional flash memory array incorporates thin film transistors having a charge storage dielectric arranged in series-connected NAND strings to achieve a 4F2 memory cell layout. The memory array may be programmed and erased using only tunneling currents, and no leakage paths are formed through non-selected memory cells. Each NAND string includes two block select devices for respectively coupling one end of the NAND string to a global bit line, and the other end to a shared bias node. Pairs of NAND strings within a block share the same global bit line. The memory cells are preferably depletion mode SONOS devices, as are the block select devices. The memory cells may be programmed to a near depletion threshold voltage, and the block select devices are maintained in a programmed state having a near depletion mode threshold voltage. NAND strings on more than one layer may be connected to global bit lines on a single layer. By interleaving the NAND strings on each memory level and using two shared bias nodes per block, very little additional overhead is required for the switch devices at each end of the NAND strings. The NAND strings on different memory levels are preferably connected together by way of vertical stacked vias, each preferably connecting to more than one memory level. Each memory level may be produced with less than three masks per level.
    • 三维闪存阵列包括具有布置在串联连接的NAND串中的电荷存储电介质的薄膜晶体管,以实现4F2存储单元布局。 可以仅使用隧穿电流对存储器阵列进行编程和擦除,并且不通过未选择的存储器单元形成泄漏路径。 每个NAND串包括用于分别将NAND串的一端耦合到全局位线的两个块选择器件,另一端连接到共享偏置节点。 块内的一对NAND串共享相同的全局位线。 存储器单元优选地是耗尽型SONOS器件,块选择器件也是如此。 存储器单元可以被编程为接近耗尽阈值电压,并且块选择器件保持在具有接近耗尽模式阈值电压的编程状态。 多个层上的NAND串可以连接到单个层上的全局位线。 通过在每个存储器级别交错NAND串并且每个块使用两个共享偏置节点,对于NAND串的每一端的开关器件需要非常少的附加开销。 不同存储器级别的NAND串优选通过垂直堆叠的通孔连接在一起,每个优选地连接到多于一个的存储器级。 每个存储器级别可以以每级别少于三个掩码来生成。
    • 7. 发明授权
    • Method for fabricating programmable memory array structures incorporating series-connected transistor strings
    • 用于制造并入串联晶体管串的可编程存储器阵列结构的方法
    • US07005350B2
    • 2006-02-28
    • US10335089
    • 2002-12-31
    • Andrew J. WalkerEn-Hsing ChenSucheta NallamothuRoy E. ScheuerleinAlper IlkbaharLuca FasoliIgor KoutnetsovChristopher Petti
    • Andrew J. WalkerEn-Hsing ChenSucheta NallamothuRoy E. ScheuerleinAlper IlkbaharLuca FasoliIgor KoutnetsovChristopher Petti
    • H01L21/336
    • H01L27/11568G11C16/0483H01L27/115H01L27/11502
    • A three-dimensional flash memory array incorporates thin film transistors having a charge storage dielectric arranged in series-connected NAND strings to achieve a 4F2 memory cell layout. The memory array may be programmed and erased using only tunneling currents, and no leakage paths are formed through non-selected memory cells. Each NAND string includes two block select devices for respectively coupling one end of the NAND string to a global bit line, and the other end to a shared bias node. Pairs of NAND strings within a block share the same global bit line. The memory cells are preferably depletion mode SONOS devices, as are the block select devices. The memory cells may be programmed to a near depletion threshold voltage, and the block select devices are maintained in a programmed state having a near depletion mode threshold voltage. NAND strings on more than one layer may be connected to global bit lines on a single layer. By interleaving the NAND strings on each memory level and using two shared bias nodes per block, very little additional overhead is required for the switch devices at each end of the NAND strings. The NAND strings on different memory levels are preferably connected together by way of vertical stacked vias, each preferably connecting to more than one memory level. Each memory level may be produced with less than three masks per level.
    • 三维闪存阵列包括具有布置在串联连接的NAND串中的电荷存储电介质的薄膜晶体管,以实现4F 2存储单元布局。 可以仅使用隧穿电流对存储器阵列进行编程和擦除,并且不通过未选择的存储器单元形成泄漏路径。 每个NAND串包括用于分别将NAND串的一端耦合到全局位线的两个块选择器件,另一端连接到共享偏置节点。 块内的一对NAND串共享相同的全局位线。 存储器单元优选地是耗尽型SONOS器件,块选择器件也是如此。 存储器单元可以被编程为接近耗尽阈值电压,并且块选择器件保持在具有接近耗尽模式阈值电压的编程状态。 多个层上的NAND串可以连接到单个层上的全局位线。 通过在每个存储器级别交错NAND串并且每个块使用两个共享偏置节点,对于NAND串的每一端的开关器件需要非常少的附加开销。 不同存储器级别的NAND串优选通过垂直堆叠的通孔连接在一起,每个优选地连接到多于一个的存储器级。 每个存储器级别可以以每级别少于三个掩码来生成。