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1. 发明授权

US4724280A Package for integrated circuit 失效
标题翻译：集成电路封装
公开(公告)号：US4724280A
公开(公告)日：1988-02-09
申请号：US894149
申请日：1986-08-07
申请人： Kazuto Tsuji , Tsuyoshi Aoki , Michio Ono , Rikio Sugiura
发明人： Kazuto Tsuji , Tsuyoshi Aoki , Michio Ono , Rikio Sugiura
IPC分类号： H01L23/50 , H01L23/28 , H01L23/31 , H01L23/48 , H01L23/495 , H05K3/34
CPC分类号： H01L23/3107 , H01L23/49555 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01067 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H05K3/3421
摘要： PLCC (Plastic Leaded Chip Carrier) for a LSI having protuberances on the bottom along its lateral side, is provided with interconnectors between leg portions of adjacent protuberances. Each interconnector is a swelling from the bottom surface of the main body of PLCC to fill the gap, i.e. a channel, between the protuberances. The height of the filling, namely the height of the interconnector, is lower than that of prior art protuberance to leave some space. This space, a channel, serves as a duct for solvent to flow therein smoothly to and from the narrow gap between the soldered lead and the top of the protuberance and is located adjoining this narrow gap. Therefore, the undesirably remaining flux in this narrow gap is perfectly removed by this smooth flow of the solvent. The leg portion of the protuberance is strengthened by the interconnector so that the occurrence of a crack of the protuberance when the moled PLCC is ejected from the molding cavities is considerably reduced. The structure, using the interconnector, can also avoid using a slanted protuberance having a sharp top which is likely to hurt the fingers of a PLCC handler, or which has too narrow a bottom as a channel for solvent to smoothly flow.
摘要翻译：用于具有沿着其侧面的底部突起的LSI的PLCC（塑料引线芯片载体）在相邻突起的腿部之间设置有互连器。每个互连器是从PLCC的主体的底表面膨胀以填充突起之间的间隙，即通道。填充物的高度，即互连器的高度，低于现有技术的突起以留下一些空间。这个空间，一个通道，用作溶剂的流通道，平滑地流到和焊接引线与凸起顶部之间的窄间隙，并且位于邻近该窄间隙处。因此，通过溶剂的这种平滑流动，可以完全去除在该狭窄间隙中不期望的剩余通量。突起的腿部通过互连器被加强，使得当从模制腔中排出弯曲的PLCC时突起的裂纹的发生显着减少。使用互连器的结构也可以避免使用具有尖锐顶部的倾斜突起，该倾斜突起可能伤害PLCC处理器的指状物，或者具有太窄的底部作为溶剂平滑流动的通道。

2. 发明授权

US5293072A Semiconductor device having spherical terminals attached to the lead frame embedded within the package body 失效
标题翻译：半导体器件具有附接到嵌入在封装主体内的引线框架的球形端子
公开(公告)号：US5293072A
公开(公告)日：1994-03-08
申请号：US53802
申请日：1993-04-29
申请人： Kazuto Tsuji , Tetsuya Hiraoka , Tsuyoshi Aoki , Junichi Kasai
发明人： Kazuto Tsuji , Tetsuya Hiraoka , Tsuyoshi Aoki , Junichi Kasai
IPC分类号： H01L21/48 , H01L21/56 , H01L23/495 , H05K3/34 , H01L23/48 , H01L29/44 , H01L29/52 , H01L29/60
CPC分类号： H01L21/4825 , H01L21/565 , H01L23/49517 , H05K3/3478 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/082 , Y10T29/49149
摘要： A semiconductor device accommodated in a package includes a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal members embedded in the package body in electrical connection to the semiconductor chip and projecting from a bottom surface of the package body, wherein each of said terminal members is of spherical form, and of a substantially identical diameter.
摘要翻译：容纳在封装中的半导体器件包括半导体芯片，用于容纳半导体芯片的封装体和与半导体芯片电连接并且从封装主体的底表面突出的嵌入封装体的多个端子构件，其中每个所述端子构件是球形的，并且具有基本相同的直径。

3. 发明授权

US5403776A Process of using a jig to align and mount terminal conductors to a semiconductor plastic package 失效
标题翻译：使用夹具将端子导体对齐并安装到半导体塑料封装的工艺
公开(公告)号：US5403776A
公开(公告)日：1995-04-04
申请号：US152239
申请日：1993-11-16
申请人： Kazuto Tsuji , Tetsuya Hiraoka , Tsuyoshi Aoki , Junichi Kasai
发明人： Kazuto Tsuji , Tetsuya Hiraoka , Tsuyoshi Aoki , Junichi Kasai
IPC分类号： H01L21/48 , H01L21/56 , H01L23/495 , H05K3/34 , H01L21/28 , H01L21/58 , H01L21/60
CPC分类号： H01L21/4825 , H01L21/565 , H01L23/49517 , H05K3/3478 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/082 , Y10T29/49149
摘要： A process of manufacturing semiconductor device accommodated in a package including a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal members embedded in the package body in electrical connection to the semiconductor chip and projecting from a bottom surface of the package body, wherein each of said terminal members is of spherical form, such that the terminal members roll substantially freely when placed on a flat surface, and of a substantially identical diameter.
摘要翻译：一种制造半导体器件的方法，该半导体器件容纳在包括半导体芯片，用于容纳半导体芯片的封装主体和与半导体芯片电连接的嵌入封装主体中的多个端子构件的封装中，并且从底部表面突出封装体，其中每个所述端子构件是球形的，使得当放置在平坦表面上并且具有基本相同的直径时，端子构件基本上自由地滚动。

4. 发明授权

US07361980B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07361980B2
公开(公告)日：2008-04-22
申请号：US11137697
申请日：2005-05-26
申请人： Sumikazu Hosoyamada , Kazuto Tsuji , Yoshihiro Kubota
发明人： Sumikazu Hosoyamada , Kazuto Tsuji , Yoshihiro Kubota
IPC分类号： H01L23/02
CPC分类号： H01L23/5286 , H01L24/03 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device comprises a semiconductor chip in which a circuit part provided in a center of the semiconductor chip is connected with power-supply lines and power-supply electrodes to supply power from an external power source to the circuit part. A substrate is provided for carrying the semiconductor chip thereon and provided so that first terminals in a region encircling the semiconductor chip are electrically connected to the power-supply electrodes. A first opening is formed on the power-supply line in a center of the circuit part. A second opening is formed on the power-supply line at a peripheral part of the circuit part. A conductor layer is electrically connected to second terminals in the region encircling the semiconductor chip on the substrate, and provided so that the power-supply line in the first opening and the power-supply line in the second opening are connected together.
摘要翻译：半导体器件包括半导体芯片，其中设置在半导体芯片的中心的电路部分与电源线和电源电极连接，以从外部电源向电路部分供电。提供了用于在其上承载半导体芯片的基板，并且设置成使得包围半导体芯片的区域中的第一端子电连接到电源电极。在电路部分的中心的电源线上形成第一开口。在电路部分的周边部分的电源线上形成第二开口。导体层与围绕基板上的半导体芯片的区域中的第二端子电连接，并且设置为使得第一开口中的电源线和第二开口中的电源线连接在一起。

5. 发明授权

US07042102B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US07042102B2
公开(公告)日：2006-05-09
申请号：US10971692
申请日：2004-10-25
申请人： Kazuto Tsuji , Yoshihiro Kubota , Kenji Asada , Sumikazu Hosoyamada
发明人： Kazuto Tsuji , Yoshihiro Kubota , Kenji Asada , Sumikazu Hosoyamada
IPC分类号： H01L23/48 , H01L29/40
CPC分类号： H01L23/66 , H01L23/13 , H01L23/49838 , H01L23/552 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2224/451 , H01L2224/48011 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/4912 , H01L2224/49171 , H01L2224/49175 , H01L2224/85051 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/19011 , H01L2924/1903 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In a semiconductor device, bonding-wires can be applied parallel to each other to electrodes of high-speed signal lines when mounting a highly densified semiconductor element on a low-cost substrate while reducing a length of the bonding-wires. An impedance-matched substrate having wiring that impedance-matched with circuits of a semiconductor element is mounted on a substrate. A plurality of first metal wires connect between first electrodes of the semiconductor element and electrodes of the substrate. A plurality of second metal wires connect between second electrodes of the semiconductor element and first electrodes of the impedance-matched substrate. A plurality of third metal wires connect between second electrodes of the impedance-matched substrate and electrodes of the substrate. The second metal wires extend parallel to each other, and the third metal wires also extend parallel to each other.
摘要翻译：在半导体器件中，当将高度致密化的半导体元件安装在低成本基板上同时减少接合线的长度时，可以将接合线彼此平行地应用于高速信号线的电极。具有与半导体元件的电路阻抗匹配的布线的阻抗匹配基板安装在基板上。多个第一金属线连接在半导体元件的第一电极和基板的电极之间。多个第二金属线连接在半导体元件的第二电极和阻抗匹配衬底的第一电极之间。多个第三金属线连接在阻抗匹配衬底的第二电极和衬底的电极之间。第二金属线彼此平行地延伸，并且第三金属线也彼此平行地延伸。

7. 发明授权

US06376921B1 Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame 有权
标题翻译：半导体装置，半导体装置的制造方法，引线框架及其制造方法
公开(公告)号：US06376921B1
公开(公告)日：2002-04-23
申请号：US09192201
申请日：1998-11-16
申请人： Yoshiyuki Yoneda , Ryuji Nomoto , Toshiyuki Motooka , Kazuto Tsuji , Junichi Kasai , Toshimi Kawahara , Hideharu Sakoda , Kenji Itasaka , Terumi Kamifukumoto
发明人： Yoshiyuki Yoneda , Ryuji Nomoto , Toshiyuki Motooka , Kazuto Tsuji , Junichi Kasai , Toshimi Kawahara , Hideharu Sakoda , Kenji Itasaka , Terumi Kamifukumoto
IPC分类号： H01L2328
CPC分类号： H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6833 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L24/97 , H01L25/105 , H01L29/0657 , H01L2224/05554 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45144 , H01L2224/45565 , H01L2224/45644 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/4848 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/7865 , H01L2224/83001 , H01L2224/85001 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85365 , H01L2224/85986 , H01L2224/92247 , H01L2224/97 , H01L2225/1035 , H01L2225/107 , H01L2225/1094 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10161 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/18165 , H01L2924/19043 , H01L2924/3011 , H05K1/181 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K3/3442 , H05K2201/09045 , H05K2201/10727 , H05K2201/10977 , Y02P70/613 , H01L2224/85 , H01L2924/01004 , H01L2924/00011 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts.
摘要翻译：半导体器件包括半导体元件，密封半导体元件的树脂封装，从树脂封装的安装表面向下突出的树脂突起，设置在树脂突起上的金属膜部分和将半导体元件电连接到金属膜的连接构件部分。

8. 发明授权

US5891758A Semiconductor device and method for manufacturing semiconductor device 失效
标题翻译：半导体装置及半导体装置的制造方法
公开(公告)号：US5891758A
公开(公告)日：1999-04-06
申请号：US962395
申请日：1997-10-31
申请人： Toshiyuki Honda , Akihiro Oku , Takanori Watanabe , Kazuto Tsuji , Yoshiyuki Yoneda
发明人： Toshiyuki Honda , Akihiro Oku , Takanori Watanabe , Kazuto Tsuji , Yoshiyuki Yoneda
IPC分类号： H01L23/12 , H01L21/56 , H01L21/68 , H01L23/31 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/568 , H01L21/565 , H01L23/3107 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2924/18165 , Y10T29/49169
摘要： A method of manufacturing a semiconductor device includes the steps of: mounting a semiconductor chip on a holding board having electrode accommodation recesses formed thereon, and mounting electrode members to the electrode accommodation recesses, the electrode members being formed separately from the semiconductor element; electrically connecting electrode pads formed on the semiconductor chip with the electrode members; forming a resin package for sealing the semiconductor chip on the holding board by using a die, the holding board serving as a part of the die; and separating the resin package including the electrode members from the holding board. A semiconductor device includes: a semiconductor chip; a resin package for sealing the semiconductor chip; electrode members which are embedded in and held by the resin package and which are partly exposed from a mounting surface so as to form external connection terminals; and connecting parts electrically connecting electrode pads on the semiconductor chip with the electrode members.
摘要翻译：一种制造半导体器件的方法包括以下步骤：将半导体芯片安装在其上形成有电极容纳凹部的保持板上，以及将电极构件安装到电极容置凹部，电极构件与半导体元件分开形成; 将形成在半导体芯片上的电极焊盘与电极部件电连接; 通过使用模具形成用于将所述保持板上的半导体芯片密封的树脂封装，所述保持板用作所述管芯的一部分; 以及将包括电极构件的树脂封装从保持板分离。半导体器件包括：半导体芯片; 用于密封半导体芯片的树脂封装; 电极构件，其嵌入并保持在树脂封装中，并且从安装表面部分露出以形成外部连接端子; 以及将半导体芯片上的电极焊盘与电极部件电连接的部分。

9. 发明授权

US5656550A Method of producing a semicondutor device having a lead portion with outer connecting terminal 失效
标题翻译：一种具有带有外部连接端子的引线部分的半导体器件的制造方法
公开(公告)号：US5656550A
公开(公告)日：1997-08-12
申请号：US611007
申请日：1996-03-05
申请人： Kazuto Tsuji , Yoshiyuki Yoneda , Hideharu Sakoda , Ryuji Nomoto , Eiji Watanabe , Seiichi Orimo , Masanori Onodera , Masaki Waki
发明人： Kazuto Tsuji , Yoshiyuki Yoneda , Hideharu Sakoda , Ryuji Nomoto , Eiji Watanabe , Seiichi Orimo , Masanori Onodera , Masaki Waki
IPC分类号： H01L21/56 , H01L21/68 , H01L23/31 , H01L23/495 , H01L21/60
CPC分类号： H01L24/49 , H01L21/565 , H01L21/6835 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/49548 , H01L23/49551 , H01L24/97 , H01L2221/68377 , H01L2224/05554 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45164 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/49433 , H01L2224/73265 , H01L2224/97 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/3011 , Y10T29/49121
摘要： This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device has a semiconductor chip, a lead member having a lead portion and an outer connecting terminal connected integrally to the lead portion, the lead portion electrically connected to the semiconductor chip, the lead portion extending outwardly from the semiconductor chip, the outer connecting terminal extending downwardly from the lead portion, a sealing resin sealing the semiconductor chip and the lead portion, a bottom face of the semiconductor chip and a bottom face of the lead portion being exposed from the sealing resin, and an insulating member covering the bottom face of the semiconductor chip and the bottom face of the lead portion. Also, the semiconductor device has a semiconductor chip having a predetermined number of electrode pads, a predetermined number of leads electrically connected to the electrode pads, each of the leads having a projecting terminal portion formed by bending the lead, and a resin portion sealing the semiconductor chip and the leads, wherein the terminal portions are exposed from one face of the resin portion.
摘要翻译：本发明涉及一种半导体器件，其中多个外部端子以平坦表面的格子状排列。半导体器件具有半导体芯片，具有引线部分的引线部分和与引线部分整体连接的外部连接端子，引线部分电连接到半导体芯片，引线部分从半导体芯片向外延伸，外部连接从所述引线部分向下延伸的端子，密封所述半导体芯片和所述引线部分的密封树脂，所述半导体芯片的底面和所述引线部分的底面从所述密封树脂露出;以及绝缘构件，和半导体芯片的底面。此外，半导体器件具有预定数量的电极焊盘的半导体芯片，与电极焊盘电连接的预定数量的引线，每个引线具有通过弯曲引线形成的突出端子部分和密封半导体芯片和引线，其中端子部分从树脂部分的一个面露出。

10. 发明授权

US5654243A Process for fabricating a semiconductor device in a resin package housed in a frame having high conductivity 失效
标题翻译：用于在容纳在具有高导热性的框架中的树脂封装中制造半导体器件的工艺
公开(公告)号：US5654243A
公开(公告)日：1997-08-05
申请号：US696598
申请日：1996-08-14
申请人： Yoshiyuki Yoneda , Kazuto Tsuji
发明人： Yoshiyuki Yoneda , Kazuto Tsuji
IPC分类号： H01L23/28 , H01L23/08 , H01L23/12 , H01L23/24 , H01L23/31 , H01L23/367 , H01L23/433 , H01L23/498 , H05K1/02 , H05K3/30 , H05K3/34 , H01L21/60
CPC分类号： H01L23/24 , H01L23/3128 , H01L23/367 , H01L23/4334 , H01L23/49816 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K1/0201 , H05K3/303 , H05K3/3431 , Y10T29/49144 , Y10T29/49146
摘要： A semiconductor device including a substrate, solder bumps provided on a lower major surface of the substrate, a semiconductor chip provided on an upper major surface of the substrate, a resin package body provided on the upper major surface of the substrate so as to bury the semiconductor chip therein, a thermally conductive frame member having a flange part supporting the substrate of a rim part of the substrate, wherein the thermal conductive frame member has a thermal conductivity substantially larger than that of the resin package body and extending along to and in an intimate contact with side walls of the resin package body.
摘要翻译：一种半导体器件，包括衬底，设置在衬底的下主表面上的焊料凸块，设置在衬底的上主表面上的半导体芯片，设置在衬底的上主表面上的树脂封装体，以便将衬底半导体芯片，导热框架构件，其具有支撑衬底的边缘部分的衬底的凸缘部分，其中导热框架构件的热导率基本上大于树脂封装主体的导热系数，并且延伸到与树脂封装体的侧壁紧密接触。

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