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1. 发明授权

US4984059A Semiconductor device and a method for fabricating the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US4984059A
公开(公告)日：1991-01-08
申请号：US539781
申请日：1983-10-07
申请人： Akihiro Kubota , Rikio Sugiura , Tsuyoshi Aoki , Michio Ono
发明人： Akihiro Kubota , Rikio Sugiura , Tsuyoshi Aoki , Michio Ono
IPC分类号： H01L23/48 , H01L21/56 , H01L21/60 , H01L23/31 , H01L23/495 , H01L23/50
CPC分类号： H01L23/49537 , H01L21/565 , H01L23/3107 , H01L23/3135 , H01L23/3157 , H01L23/495 , H01L23/49503 , H01L23/49589 , H01L2224/45014 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/49175 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , Y10S257/916
摘要： In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.
摘要翻译：在内部引线与模制塑料体中的半导体芯片重叠的塑料模制半导体器件中，芯片的宽度可以接近塑料体的宽度，而不会使内部引线的高电阻降低到拉出并且内引线的布局可以是不受限制的，因为内引线可能占据芯片上方的区域。

2. 发明授权

US4801997A High packing density lead frame and integrated circuit 失效
标题翻译：高封装密度引线框架和集成电路
公开(公告)号：US4801997A
公开(公告)日：1989-01-31
申请号：US185301
申请日：1988-04-19
申请人： Michio Ono , Akihiro Kubota , Tsuyoshi Aoki , Osamu Inoue , Rikio Sugiura
发明人： Michio Ono , Akihiro Kubota , Tsuyoshi Aoki , Osamu Inoue , Rikio Sugiura
IPC分类号： H01L23/50 , H01L23/495 , H01L23/48 , H01L29/44 , H01L29/52 , H01L29/60
CPC分类号： H01L23/49541 , H01L2224/48091 , H01L2224/48247
摘要： Lead frame for mounting a semiconductor chip and improving the packing density of devices such as a plastic chip carrier type IC is disclosed. A portion of inner leads, located parallel to the chip stage and the edge of a molded case is made as thin as possible and held by inner lead supporting bars to tie bars until the molding process is finished. After molding process is finished, these bars supporting the leads and stage are cut away. Packing density is improved an amount ranging from 20% to 30%.
摘要翻译：公开了用于安装半导体芯片的引线框架和提高诸如塑料芯片载体型IC的器件的封装密度。将内引线的一部分平行于芯片台和模制外壳的边缘制成尽可能薄，并由内引线支撑杆固定到连杆上，直到模制过程完成。成型工艺完成后，将这些支撑导线和平台的条子切掉。包装密度提高了20％〜30％。

3. 发明授权

US4724280A Package for integrated circuit 失效
标题翻译：集成电路封装
公开(公告)号：US4724280A
公开(公告)日：1988-02-09
申请号：US894149
申请日：1986-08-07
申请人： Kazuto Tsuji , Tsuyoshi Aoki , Michio Ono , Rikio Sugiura
发明人： Kazuto Tsuji , Tsuyoshi Aoki , Michio Ono , Rikio Sugiura
IPC分类号： H01L23/50 , H01L23/28 , H01L23/31 , H01L23/48 , H01L23/495 , H05K3/34
CPC分类号： H01L23/3107 , H01L23/49555 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01067 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H05K3/3421
摘要： PLCC (Plastic Leaded Chip Carrier) for a LSI having protuberances on the bottom along its lateral side, is provided with interconnectors between leg portions of adjacent protuberances. Each interconnector is a swelling from the bottom surface of the main body of PLCC to fill the gap, i.e. a channel, between the protuberances. The height of the filling, namely the height of the interconnector, is lower than that of prior art protuberance to leave some space. This space, a channel, serves as a duct for solvent to flow therein smoothly to and from the narrow gap between the soldered lead and the top of the protuberance and is located adjoining this narrow gap. Therefore, the undesirably remaining flux in this narrow gap is perfectly removed by this smooth flow of the solvent. The leg portion of the protuberance is strengthened by the interconnector so that the occurrence of a crack of the protuberance when the moled PLCC is ejected from the molding cavities is considerably reduced. The structure, using the interconnector, can also avoid using a slanted protuberance having a sharp top which is likely to hurt the fingers of a PLCC handler, or which has too narrow a bottom as a channel for solvent to smoothly flow.
摘要翻译：用于具有沿着其侧面的底部突起的LSI的PLCC（塑料引线芯片载体）在相邻突起的腿部之间设置有互连器。每个互连器是从PLCC的主体的底表面膨胀以填充突起之间的间隙，即通道。填充物的高度，即互连器的高度，低于现有技术的突起以留下一些空间。这个空间，一个通道，用作溶剂的流通道，平滑地流到和焊接引线与凸起顶部之间的窄间隙，并且位于邻近该窄间隙处。因此，通过溶剂的这种平滑流动，可以完全去除在该狭窄间隙中不期望的剩余通量。突起的腿部通过互连器被加强，使得当从模制腔中排出弯曲的PLCC时突起的裂纹的发生显着减少。使用互连器的结构也可以避免使用具有尖锐顶部的倾斜突起，该倾斜突起可能伤害PLCC处理器的指状物，或者具有太窄的底部作为溶剂平滑流动的通道。

4. 发明授权

US4698660A Resin-molded semiconductor device 失效
标题翻译：树脂模制半导体器件
公开(公告)号：US4698660A
公开(公告)日：1987-10-06
申请号：US833535
申请日：1986-02-12
申请人： Akihiro Kubota , Tsuyoshi Aoki , Michio Ono , Rikio Sugiura
发明人： Akihiro Kubota , Tsuyoshi Aoki , Michio Ono , Rikio Sugiura
IPC分类号： H01L23/50 , H01L23/28 , H01L23/31 , H01L23/495 , H05K3/34 , H01L23/00
CPC分类号： H05K3/3426 , H01L23/3107 , H01L23/49555 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , Y02P70/613
摘要： A resin-molded semiconductor package device includes a plurality of grooves which are spaced a predetermined distance from each other in the edge portions defined by the main surface and the side surfaces of the main body of a resin-molded package, which grooves correspond to a plurality of external leads. The external leads are folded, the tips of the external leads are positioned in the grooves, and the middle portions of the external leads are located above the main surface of the package so that a predetermined standoff distance is maintained between the middle portions of the external leads and the package.
摘要翻译：树脂封装半导体封装器件包括多个槽，它们在由树脂模制封装的主体的主表面和侧表面限定的边缘部分中彼此隔开预定距离，该沟槽对应于多个外部引线。外部引线被折叠，外部引线的尖端位于槽中，并且外部引线的中间部分位于封装的主表面上方，使得在外部引线的中间部分之间保持预定的间隔距离线索和包装。

5. 发明授权

US4575748A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US4575748A
公开(公告)日：1986-03-11
申请号：US564711
申请日：1983-12-23
申请人： Kazuo Terui , Rikio Sugiura , Takehisa Sugawara
发明人： Kazuo Terui , Rikio Sugiura , Takehisa Sugawara
IPC分类号： H01L23/50 , H01L23/495 , H01L23/02 , H01L23/12
CPC分类号： H01L23/49541 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L24/48 , H01L2924/00014 , H01L2924/01015 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/14
摘要： A semiconductor device having a base which receives therein a semiconductor chip and a plurality of lead terminals having inner ends which are connected to the semiconductor chip by connecting wires. The lead terminals are, at their outer ends, spaced from one another at a constant pitch, and are bent toward the respective outermost lead terminals between the inner ends and the outer ends and outside the base.
摘要翻译：一种半导体器件，具有在其中容纳半导体芯片的基座和具有通过连接线连接到半导体芯片的内端的多个引线端子。引线端子在其外端处以恒定间距彼此间隔开，并且在内端和外端之间以及在基座外部朝向相应的最外引线端子弯曲。

6. 再颁专利

USRE35109E Semiconductor device and method for fabricating the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：USRE35109E
公开(公告)日：1995-12-05
申请号：US1613
申请日：1993-01-07
申请人： Akihiro Kubota , Rikio Sugiura , Tsuyoshi Aoki , Michio Ono
发明人： Akihiro Kubota , Rikio Sugiura , Tsuyoshi Aoki , Michio Ono
IPC分类号： H01L23/48 , H01L21/56 , H01L21/60 , H01L23/31 , H01L23/495 , H01L23/50 , H01L29/46 , H01L29/62 , H01L29/64
CPC分类号： H01L23/49537 , H01L21/565 , H01L23/3107 , H01L23/3135 , H01L23/3157 , H01L23/495 , H01L23/49503 , H01L23/49589 , H01L2224/45014 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/49175 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , Y10S257/916
摘要： In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.
摘要翻译：在内部引线与模制塑料体中的半导体芯片重叠的塑料模制半导体器件中，芯片的宽度可以接近塑料体的宽度，而不会使内部引线的高电阻降低到拉出并且内引线的布局可以是不受限制的，因为内引线可能占据芯片上方的区域。

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