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1. 发明申请

US20150206927A1 ORGANIC ELECTROLUMINESCENT DEVICE 审中-公开
标题翻译：有机电致发光器件
公开(公告)号：US20150206927A1
公开(公告)日：2015-07-23
申请号：US14408469
申请日：2012-06-20
申请人： Kazuo Kuroda , Hideo Kudo , Hiroshi Ohata , Toshiharu Uchida , Yohei Tanaka
发明人： Kazuo Kuroda , Hideo Kudo , Hiroshi Ohata , Toshiharu Uchida , Yohei Tanaka
IPC分类号： H01L27/32 , H01L51/52 , H01L51/00
CPC分类号： H01L27/3246 , H01L27/3283 , H01L51/0096 , H01L51/5215 , H01L51/5221 , H01L51/5275 , H05B33/28
摘要： An organic EL device includes at least one insulating bank disposed on a translucent substrate, a translucent electrode in contact with the bank, an organic layer containing a light-emitting layer and formed on the translucent electrode, and a reflection electrode formed on the organic layer. The bank is made from a translucent dielectric material having a low refractive index that is equal to or less than that of the organic layer. The bank has a side face that is a slope inclined with respect to the translucent substrate. The side face has a concave surface shape that faces the light-emitting layer from a slope in contact with the light-emitting layer to a slope in contact with a portion of the organic layer in the vicinity of the reflection electrode.
摘要翻译：一种有机EL器件，包括设置在透光性基板上的至少一个绝缘堤，与堤堤接触的透光性电极，形成在透光性电极上的含有发光层的有机层，形成在有机层上的反射电极。该堤由具有等于或小于有机层的折射率的低折射率的半透明介电材料制成。堤岸具有相对于半透明基板倾斜的斜面的侧面。侧面具有从与发光层接触的倾斜面到与反射电极附近的有机层的一部分接触的斜面的发光层的凹面形状。

2. 发明授权

US08118646B2 Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing method 有权
标题翻译：双面抛光装置的载体，使用它的双面研磨装置和双面抛光方法
公开(公告)号：US08118646B2
公开(公告)日：2012-02-21
申请号：US13055302
申请日：2009-07-23
申请人： Kazuya Sato , Junichi Ueno , Syuichi Kobayashi , Hideo Kudo
发明人： Kazuya Sato , Junichi Ueno , Syuichi Kobayashi , Hideo Kudo
IPC分类号： B24B1/00
CPC分类号： B24B37/28
摘要： A carrier for a double-side polishing apparatus, including at least: a carrier base placed between upper and lower turn tables, the carrier base having a holding hole therein, the holding hole holds the wafer sandwiched between the upper and lower turn tables. A ring-shaped resin ring disposed along an inner circumference of the holding hole, the resin ring protecting a chamfered portion by making contact with the chamfered portion of the held wafer, wherein the resin ring has a concave groove on an inner circumference thereof, upper and lower tapered surfaces are formed in the concave groove. A double-side polishing apparatus using the carrier and a double-side polishing method that can reduce the generation of taper in a polished surface and improve the flatness while suppressing the generation of an outer peripheral sag of the wafer.
摘要翻译：一种用于双面抛光装置的载体，其至少包括：设置在上下匝台之间的载体基座，所述载体基座在其中具有保持孔，所述保持孔保持夹在所述上下转台之间的所述晶片。环形树脂环沿着保持孔的内周设置，树脂环通过与保持晶片的倒角部分接触来保护倒角部分，其中树脂环在其内周上具有凹槽，上部并且在凹槽中形成下锥形表面。使用该载体的双面研磨装置和能够减少抛光面的锥形的产生的双面研磨方法，能够在抑制晶片的外周凹陷的产生的同时提高平坦度。

3. 发明授权

US07017749B2 Precision substrate storage container and retaining member therefor 失效
标题翻译：精密基板储存容器及其保持件
公开(公告)号：US07017749B2
公开(公告)日：2006-03-28
申请号：US10332616
申请日：2002-05-30
申请人： Toshitsugu Yajima , Masato Hosoi , Hideo Kudo , Takashi Matsuo
发明人： Toshitsugu Yajima , Masato Hosoi , Hideo Kudo , Takashi Matsuo
IPC分类号： B65D85/48
CPC分类号： H01L21/67369 , B29C45/16
摘要： A presser member (1) of the present invention is formed of different materials for the contacting part (5) to press-hold the precision substrates (15) and for the parts other than the contacting part (5). The presser member (1) is shaped from a thermoplastic elastomer for a rectangular frame part, and the contacting part (5) has a pair of structuring parts (4) provided in such a fashion as to inwardly extend from each of a pair of oppositely facing sides. A second contacting part (11) is formed in the extension peripheral part extending via a supporting part (10). The other parts are shaped from a thermoplastic resin. The aforementioned contacting part (5) is provided with grooves of a V-shaped cross section with inclinations changed in the middle for receiving the peripheries of precision substrates (15), and V-grooves for press-holding the peripheries of precision substrates are provided in resilient pieces (12) separated and protruding in a comb teeth-like fashion to form the second contacting part (11).
摘要翻译：本发明的按压部件（1）由用于接触部分（5）的不同材料形成以压紧精密基板（15）和除了接触部分（5）之外的部分。压紧构件（1）由用于矩形框架部分的热塑性弹性体成形，并且接触部分（5）具有一对结构部件（4），其以从一对相对的每一个向内延伸的方式设置面对面。第二接触部分（11）形成在经由支撑部分（10）延伸的延伸周边部分中。其他部分由热塑性树脂成型。上述接触部分（5）设置有V形横截面的凹槽，其倾斜在中间变化以接收精密基板（15）的周边，并且提供用于压紧精密基板周边的V形槽在弹性件（12）中以梳齿状分开并突出以形成第二接触部分（11）。

4. 发明授权

US06432837B1 Semiconductor wafer processing method and semiconductor wafers produced by the same 有权
公开(公告)号：US06432837B1
公开(公告)日：2002-08-13
申请号：US09778679
申请日：2001-02-07
申请人： Takashi Nihonmatsu , Seiichi Miyazaki , Masahiko Yoshida , Hideo Kudo , Tadahiro Kato
发明人： Takashi Nihonmatsu , Seiichi Miyazaki , Masahiko Yoshida , Hideo Kudo , Tadahiro Kato
IPC分类号： H01L21302
摘要： A method of processing a semiconductor wafer sliced from a monocrystalline ingot comprises at least the steps of chamfering, lapping, etching, mirror-polishing, and cleaning. In the etching step, alkali etching is first performed and then acid etching, preferably reaction-controlled acid etching, is performed. The etching amount of the alkali etching is greater than the etching amount of the acid etching. Alternatively, in the etching step, reaction-controlled acid etching is first performed and then diffusion-controlled acid etching is performed. The etching amount of the reaction-controlled acid etching is greater than the etching amount of the diffusion-controlled acid etching. The method can remove a mechanically formed damage layer, improve surface roughness, and efficiently decrease the depth of locally formed deep pits, while the flatness of the wafer attained through lapping is maintained, in order to produce a chemically etched wafer having a smooth and flat etched surface that hardly causes generation particles and contamination.

5. 发明授权

US5790252A Method of and apparatus for determining residual damage to wafer edges 失效
标题翻译：确定晶片边缘残余损伤的方法和装置
公开(公告)号：US5790252A
公开(公告)日：1998-08-04
申请号：US720065
申请日：1996-09-27
申请人： Hisashi Masumura , Hideo Kudo , Shingo Sumie , Hidetoshi Tsunaki , Yuji Hirao , Noritaka Morioka
发明人： Hisashi Masumura , Hideo Kudo , Shingo Sumie , Hidetoshi Tsunaki , Yuji Hirao , Noritaka Morioka
IPC分类号： H01L21/66 , G01B9/02
CPC分类号： H01L22/12
摘要： The invention seeks to permit evaluation of edge portion of like inclined surfaces of wafer with high accuracy without the conventional destruction process based on the selective etching process but with the contact-free, non-destructive and high accuracy optical acoustical process. To this end, the invention features determination of residual damages as crystal damages caused to wafer edge in an optical acoustical process, which comprises the steps of causing a measurement probe to face each of three exciting laser beam irradiation points on upper and lower inclined surfaces and at an accurate end of an edge portion of a semiconductor wafer, and determining a thermal response induced by the exciting laser beam by a laser interference process.
摘要翻译：本发明试图允许以高精度评估晶片的倾斜表面的边缘部分，而不需要基于选择性蚀刻工艺的常规的破坏过程，而是利用无接触的非破坏性和高精度的光学声学过程。为此，本发明的特征在于确定作为在光学声学过程中对晶片边缘引起的晶体损伤的残余损伤，其包括以下步骤：使测量探针面对上和下倾斜表面上的三个激发激光束照射点中的每一个，在半导体晶片的边缘部分的精确端处，并且通过激光干涉处理确定由激发激光束引起的热响应。

6. 发明授权

US5768243A Optical recording medium and its recording apparatus and reproducing apparatus 失效
标题翻译：光记录介质及其记录装置和再现装置
公开(公告)号：US5768243A
公开(公告)日：1998-06-16
申请号：US824466
申请日：1997-03-26
申请人： Hideo Kudo , Yoshimi Tomita
发明人： Hideo Kudo , Yoshimi Tomita
IPC分类号： G11B7/24 , G11B7/00 , G11B7/0037 , G11B7/004 , G11B7/0045 , G11B7/005 , G11B7/007 , G11B7/085 , G11B7/14 , G11B20/12
CPC分类号： G11B7/24082 , G11B7/0037 , G11B7/0079 , G11B7/14 , G11B7/0045 , G11B7/005 , Y10S428/913 , Y10S430/146 , Y10T428/21
摘要： An optical recording medium which is constructed in a manner such that a plurality of recording areas in which an information signal is recorded along vortical spiral tracks are arranged in a ring shape on a recording surface and a vortex direction of the spiral track of the outside recording area among the plurality of recording areas differs from that of the spiral track of the inside recording area. When the information signal is recorded to the recording medium, the first writing device executes the writing operation from the outer rim side toward the inner rim side of the spiral track of the outside recording area and the second writing device executes the writing operation from the inner rim side toward the outer rim side of the spiral track of the outside recording area. When the recorded information signal is reproduced, the first reading device executes the reading operation from the outer rim side toward the inner rim side of the spiral track of the outside recording area and the second reading device executes the reading operation from the inner rim side toward the outer rim side of the spiral track of the outside recording area.
摘要翻译：一种光学记录介质，其被构造成使得沿着涡旋螺旋轨道记录信息信号的多个记录区域以记录表面和外部记录的螺旋轨道的涡流方向环状地布置多个记录区域中的区域与内部记录区域的螺旋轨道的区域不同。当信息信号被记录到记录介质上时，第一写入装置执行从外部记录区域的螺旋形轨迹的外缘侧到内缘侧的写入操作，并且第二写入装置从内部执行写入操作边缘朝向外部记录区域的螺旋轨迹的外缘侧。当记录的信息信号被再现时，第一读取装置执行从外部记录区域的螺旋形轨道的外缘侧朝向内缘侧的读取操作，并且第二读取装置执行从内缘侧到外部记录区域的螺旋轨迹的外缘侧。

7. 发明授权

US5474644A Method and apparatus for high-flatness etching of wafer 失效
标题翻译：晶圆高平面蚀刻的方法和装置
公开(公告)号：US5474644A
公开(公告)日：1995-12-12
申请号：US278132
申请日：1994-07-21
申请人： Tadahiro Kato , Hideo Kudo
发明人： Tadahiro Kato , Hideo Kudo
IPC分类号： H01L21/306 , B05C5/00
CPC分类号： H01L21/02019 , H01L21/30604
摘要： A method and an apparatus for high-flatness etching a semiconductor single crystal wafer wherein said wafer is so rotated in a flow of an ethchant radially spreading in a plane that the main surface of said wafer may move parallelly with the flow of said etchant.
摘要翻译：一种用于高平坦度蚀刻半导体单晶晶片的方法和装置，其中所述晶片以在所述晶片的主表面可以与所述蚀刻剂的流动平行移动的平面中径向扩散的脉冲流旋转。

8. 发明授权

US5282289A Scrubber apparatus for cleaning a thin disk work 失效
标题翻译：用于清洁薄磁盘工作的清洗设备
公开(公告)号：US5282289A
公开(公告)日：1994-02-01
申请号：US998076
申请日：1992-12-28
申请人： Fumihiko Hasegawa , Makoto Tsukada , Hideo Kudo , Masayuki Yamada , Isao Uchiyama
发明人： Fumihiko Hasegawa , Makoto Tsukada , Hideo Kudo , Masayuki Yamada , Isao Uchiyama
IPC分类号： H01L21/304 , B08B1/04 , H01L21/00 , B08B11/02
CPC分类号： H01L21/67028 , B08B1/04
摘要： A scrubber cleaner for cleaning the unsucked face and peripheral chamfers of a semiconductor wafer. A wafer holder capable of holding the wafer by vacuum suction and turning the wafer circumferentially, and including a wafer suction head for fixing the wafer on it and a motor to rotate the suction head. A brush assembly including a rotatory plate having a brushing surface on one side consisting of a flat ring portion and a side-of-cylinder portion, and being capable of shifting axially and in radial directions; a motor for rotating the rotatory plate circumferentially; an air cylinder for shifting the rotatory plate axially; and another air cylinder for shifting the rotatory plate in radial directions. The side-of-cylinder portion of the brushing surface axially extends from the inner boundary of the ring portion, and the rotatory plate is disposed such that the flat ring portion of the brushing surface of the brush is opposed to and in parallel to the unsucked face of the wafer which is held on the suction head.
摘要翻译：洗涤器清洁器，用于清洁半导体晶片的未起落的表面和周边倒角。一种晶片保持器，其能够通过真空吸附保持晶片，并且周向地转动晶片，并且包括用于将晶片固定在其上的晶片吸入头和用于旋转吸头的电动机。一种刷组件，包括：旋转板，其一侧具有由平环部和侧筒部组成的一侧的刷表面，能够沿轴向和径向移动; 周向旋转旋转板的马达; 轴向移动旋转板的气缸; 以及用于沿径向方向移动旋转板的另一气缸。刷子表面的圆筒部分从环部的内边缘轴向延伸，并且旋转板被设置成使得刷子的刷洗表面的平环部分与未塞的部件相对并平行保持在吸头上的晶片的表面。

9. 发明授权

US5025439A Method for recording and reproducing of information on an optical disk of a phase-change type 失效
标题翻译：用于在相变型光盘上记录和再现信息的方法
公开(公告)号：US5025439A
公开(公告)日：1991-06-18
申请号：US236913
申请日：1988-08-26
申请人： Toshihiro Komaki , Hideo Kudo , Tomonori Ishizuki , Shinichi Yokozeki
发明人： Toshihiro Komaki , Hideo Kudo , Tomonori Ishizuki , Shinichi Yokozeki
IPC分类号： G11B7/0055 , G11B7/006
CPC分类号： G11B7/00557 , G11B7/006
摘要： A method for recording and reproducing data on an optical disk of a phase-change type which is capable of being over-written, comprising steps of: writing the data by a writing light beam, erasing the written data by an erasing light beam, and reading the written data by a reading light beam, characterized by a step for initializing the optical disk so that a width of an initialized region is wider than the diameter of a spot written by the writing light beam on the optical disk.
摘要翻译：一种用于在能够被重写的相变型光盘上记录和再现数据的方法，包括以下步骤：通过写入光束写入数据，通过擦除光束擦除写入的数据，以及通过读取光束读取写入的数据，其特征在于用于初始化光盘的步骤，使得初始化区域的宽度比由写入光束在光盘上写入的点的直径宽。

10. 发明授权

US08454410B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US08454410B2
公开(公告)日：2013-06-04
申请号：US12449400
申请日：2008-01-29
申请人： Koji Kitagawa , Junichi Ueno , Syuichi Kobayashi , Hideo Kudo , Tadakazu Miyashita , Atsushi Kajikura , Yoshinobu Nishimoto
发明人： Koji Kitagawa , Junichi Ueno , Syuichi Kobayashi , Hideo Kudo , Tadakazu Miyashita , Atsushi Kajikura , Yoshinobu Nishimoto
IPC分类号： B24B29/00
CPC分类号： B24B37/015 , B24B37/08 , B24B55/06
摘要： Provided is a polishing apparatus comprising a lower stool (12), a motor (18a) and a speed reducer (19a) for driving the lower stool, and a box (17) for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (31a and 31b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.
摘要翻译：本发明提供一种抛光装置，其包括下部凳子（12），用于驱动下部凳子的电动机（18a）和减速器（19a）以及用于至少覆盖下部工作部分的下部凳子的箱体（17）动作面。抛光装置通过迫使晶片接触下粪和旋转下粪来抛光晶片。箱体的内部由隔板（31a和31b）分隔成多个区域，并且用于驱动下部便器的电动机布置在除了包含下部凳子的区域以外的区域中。抛光装置可以制造具有稳定形状的晶片，而与运行开始所经过的时间和抛光装置的停止的存在/不存在无关。

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