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1. 发明专利

JP2015000179A 漆器製造方法有权
标题翻译：制造LACQUERWARE的方法
公开(公告)号：JP2015000179A
公开(公告)日：2015-01-05
申请号：JP2013126072
申请日：2013-06-14
申请人：株式会社堤淺吉漆店 , Tsutsumi Asakichi Urushiten Co Ltd , 高次北川 , Koji Kitagawa , 高次北川
发明人： KITAGAWA KOJI
IPC分类号： A47G19/00 , C09D193/00
摘要：【課題】温度変化が繰り返し付与されても漆の層の剥離が生じ難い漆器を製造する方法を提供する。【解決手段】凹部115を有する容器の形状に木を加工した木地11の外表面(本体外表面112)に漆12を塗布し(b)、該凹部115内を減圧する(c)。これにより、木地11が有する、原料の木の導管から成る微細空洞内に漆が浸透する。そのため、従来より微細空洞に蓋を形成するために用いられていた砥の粉等の天然鉱物から成る下地層を木地と漆の層の間に形成する必要がなく、木地の表面に直接、漆の層を形成することができる。木地と漆は、木地と下地層、あるいは下地層と漆の層よりも、互いの熱膨張率の差が小さいため、本発明の方法により製造された漆器は従来のものよりも、温度変化が繰り返し付与されても漆の層の剥離が生じ難い。【選択図】図1
摘要翻译：要解决的问题：提供一种制造漆器的方法，其漆层即使在重复施加温度变化时也不容易剥离。解决方案：在制造漆器的方法中，将漆12施加在木制基座11的外表面上（图中的（b））的具有凹部115的容器的处理的木材形成的（主体外表面112）），凹部115的内部被减压（图中的（c）），。由此，漆渗透到由木质基材11中包含的原料木材容器形成的微腔中，从而不需要形成由天然矿物制成的底层，例如通常用于在微孔中形成盖子的抛光粉末，并且可以在木质基材的表面上直接形成漆层。木基和漆之间的热膨胀系数的差异小于木质基底和底层或底层和漆层的热膨胀系数的差异; 因此，在通过使用本发明的方法制造的漆器中，与现有技术相比，即使重复使用温度变化，漆层也不容易剥离。

2. 发明专利

JP2013255626A Container made of ceramic 有权
标题翻译：陶瓷容器
公开(公告)号：JP2013255626A
公开(公告)日：2013-12-26
申请号：JP2012132581
申请日：2012-06-12
申请人： Takao Ogawa , 隆生小川 , Koji Kitagawa , 幸治北川 , Eisaku Kogiku , 栄作小菊
发明人： OGAWA TAKAO , KITAGAWA KOJI , KOGIKU EISAKU
IPC分类号： A47J27/00
摘要： PROBLEM TO BE SOLVED: To provide a container made of ceramic which enables efficient heating of a container itself by a simple composition on the occasion of heat treatment of an object to be treated by a microwave and thus enables excellent heat treatment of the material.SOLUTION: In regard to a container 1 made of ceramic which includes a laminated body composed by forming a heating element layer 3 on the surface of a base layer 2 and by forming a coating layer 4 on the surface of the heating element layer 3, the heating element layer 3 is formed by spraying a heating element 5 to be made to generate heat by a microwave, at least on a part of the surface of the base layer 2.
摘要翻译：要解决的问题：提供一种由陶瓷制成的容器，其能够通过微波对待处理物体进行热处理时通过简单的组成有效地加热容器本身，从而能够对材料进行优异的热处理。：关于由陶瓷制成的容器1，其包括通过在基层2的表面上形成加热元件层3并且在加热元件层3的表面上形成涂层4而构成的层叠体，元件层3是通过喷射加热元件5而形成的，所述加热元件5至少在基底层2的表面的一部分上通过微波产生热量。

3. 发明申请

US20140000580A1 METHOD FOR RESUMING OPERATION OF WIRE SAW AND WIRE SAW 有权
标题翻译：用于重复电线和线路操作的方法
公开(公告)号：US20140000580A1
公开(公告)日：2014-01-02
申请号：US14004791
申请日：2012-04-02
申请人： Koji Kitagawa
发明人： Koji Kitagawa
IPC分类号： B28D5/04
CPC分类号： B28D5/045 , B23D59/001
摘要： The present invention provides a method of resuming operation of a wire saw in which slicing of a workpiece is suspended and then resumed, including slicing the workpiece while detecting a traveling direction and a traveling speed of the reciprocating wire and recording them chronologically; and resuming the slicing while controlling the traveling direction and a traveling time in the traveling direction of the wire on a basis of a wire traveling history recorded until the suspending of the slicing of the workpiece such that the reciprocating cycle of the wire becomes continuous between before the suspending and after the resuming of the slicing of the workpiece. This method enables the slicing to be completed while the nanotopography of the sliced wafer is surely prevented from degrading, even when the slicing of the workpiece with a wire saw is suspended due to, for example, breaking of the wire.
摘要翻译：本发明提供了一种线锯的恢复操作方法，其中工件的切片暂停然后恢复，包括在检测往复导线的行进方向和行进速度并按时间顺序记录的同时切割工件; 并且基于记录的线材行进历史来控制行进方向的行进方向和行进方向的行驶时间，并重新开始切片，直到暂停工件的切割，使得电线的往复循环在之前连续变化暂停和恢复工件切片后。该方法能够在切片晶片的纳米形貌可靠地防止劣化的同时完成切片，即使当由于例如电线断裂而用线锯将工件切片悬挂时。

4. 发明授权

US08567384B2 Slicing method and wire saw apparatus 有权
标题翻译：切片方法和线锯装置
公开(公告)号：US08567384B2
公开(公告)日：2013-10-29
申请号：US12449484
申请日：2008-01-24
申请人： Hiroshi Oishi , Koji Kitagawa , Hideo Kudo
发明人： Hiroshi Oishi , Koji Kitagawa , Hideo Kudo
IPC分类号： B28D1/08
CPC分类号： B28D5/0064 , B28D5/0076 , B28D5/045
摘要： The invention is directed to a method for slicing an ingot in the form of a wafer by winding a wire around a plurality of grooved rollers and pressing the wire against the ingot while making the wire travel and supplying slicing slurry to the grooved rollers, in which when the ingot is sliced, an amount of displacement of the ingot changing in an axial direction is measured and an amount of axial displacement of the grooved rollers is controlled so as to correspond to the measured amount of axial displacement of the ingot, and thereby, the ingot is sliced while controlling a relative position of the wire relative to an entire length of the ingot changing in the axial direction. As a result, a slicing method and a wire saw apparatus are provided that can perform slicing in such a way that a Bow or a Warp in a wafer obtained by slicing can be reduced, for example, by controlling a slicing path built into an ingot so that, in particular, the slicing path becomes flattened.
摘要翻译：本发明涉及一种用于通过将线缠绕在多个带槽辊上并将线压在锭上并将线移动并将切片浆料供应到带槽辊的方法来切割晶片形式的方法，其中当锭被切片时，测量锭在轴向上变化的位移量，并且控制带槽辊的轴向位移量，以便对应于测量的锭的轴向位移量，从而，在控制线相对于锭的整个长度在轴向方向上的相对位置的同时对锭进行切片。结果，提供了一种切片方法和线锯装置，其可以执行切片，使得可以通过例如通过控制内置在锭中的切片路径来减少通过切片获得的晶片中的弓或翘曲使得特别是切片路径变平。

5. 发明授权

US08323075B2 Polishing head, polishing apparatus and method for demounting workpiece 有权
标题翻译：抛光头，抛光装置和拆卸工件的方法
公开(公告)号：US08323075B2
公开(公告)日：2012-12-04
申请号：US12734119
申请日：2007-11-21
申请人： Hisashi Masumura , Koji Kitagawa , Kouji Morita , Hiromi Kishida , Satoru Arakawa
发明人： Hisashi Masumura , Koji Kitagawa , Kouji Morita , Hiromi Kishida , Satoru Arakawa
IPC分类号： B24B5/00 , B24B41/06
CPC分类号： B24B37/30 , B24B37/345 , Y10T29/49826
摘要： A polishing head having a disklike carrier in which an annular projecting portion and a carrier-engagement portion are formed in a peripheral portion, a disklike head body in which a head-body-engagement portion is formed outside, a diaphragm for connecting the head body with the carrier, a spacer located between the carrier-engagement portion and the head-body-engagement portion in a part of the carrier-engagement portion and/or the head-body-engagement portion, in which the spacer abuts on the carrier-engagement portion and/or the head-body-engagement portion at the time of lifting the head body so that the workpiece is demounted from the polishing pad by lifting the carrier with it inclined. As a result, there is provided a polishing head in which the workpiece can be easily, safely and surely demounted from the polishing pad by lifting the polishing head holding the workpiece without overhanging the polishing head from the turn table and the like.
摘要翻译：一种抛光头，其具有圆盘状载体，其中环形突出部分和载体接合部分形成在周边部分中，盘状头体，其中头部体接合部分形成在外部;光阑，用于连接头部主体在载体接合部分和头部本体接合部分之间的间隔件位于载体接合部分和/或头部本体接合部分的一部分中，间隔件邻接在载体接合部分上，在抬起头部本体时使接合部和/或头体接合部通过使其倾斜地抬起托架而使抛光垫从抛光垫上拆下。结果，提供了一种研磨头，其中通过提起保持工件的抛光头而不会使抛光头从转台等悬垂，从而可以从抛光垫容易地，安全地和可靠地拆卸工件。

6. 发明申请

US20110059679A1 METHOD FOR SLICING WORKPIECE 有权
标题翻译：切割工作方法
公开(公告)号：US20110059679A1
公开(公告)日：2011-03-10
申请号：US12990985
申请日：2009-06-04
申请人： Koji Kitagawa , Kazuya Tomii
发明人： Koji Kitagawa , Kazuya Tomii
IPC分类号： B28D5/00 , B24B1/00
CPC分类号： B28D5/045 , B24B27/0633 , B28D5/0088
摘要： The present invention is a method for slicing a workpiece into wafers by pressing a cylindrical workpiece held with a workpiece holder against a wire row formed by a wire spirally wound between a plurality of wire guides and making the wire travel while supplying a slurry to a contact portion between the workpiece and the wire, wherein the workpiece is sliced with an axis direction of the workpiece inclined with respect to a plane formed by the wire row, after the workpiece is inclined in such a manner that a side far from the wire row plane is a side where the wire guides are to be axially expanded. As a result, there is provided a method for slicing that enable wafers having a good Warp shape to be obtained by precisely slicing a workpiece with a wire saw.
摘要翻译：本发明是一种通过将保持有工件保持件的圆柱形工件压靠在由螺旋形缠绕在多个导线器之间的线形成的线排上并使电线行进同时向接触件供应浆料的方法来将工件切割成晶片工件与线之间的部分，其中工件在工件以远离线排平面的一侧倾斜时相对于由线列形成的平面倾斜的工件的轴线方向切片是引导件被轴向膨胀的一侧。结果，提供了一种用于切割的方法，其使得能够通过用线锯精确地切割工件来获得具有良好翘曲形状的晶片。

7. 发明申请

US20100089377A1 SLICING METHOD AND WIRE SAW APPARATUS 有权
标题翻译：切片方法和线锯装置
公开(公告)号：US20100089377A1
公开(公告)日：2010-04-15
申请号：US12449484
申请日：2008-01-24
申请人： Hiroshi Oishi , Koji Kitagawa , Hideo Kudo
发明人： Hiroshi Oishi , Koji Kitagawa , Hideo Kudo
IPC分类号： B28D1/06 , B28D1/08
CPC分类号： B28D5/0064 , B28D5/0076 , B28D5/045
摘要： The invention is directed to a method for slicing an ingot in the form of a wafer by winding a wire around a plurality of grooved rollers and pressing the wire against the ingot while making the wire travel and supplying slicing slurry to the grooved rollers, in which when the ingot is sliced, an amount of displacement of the ingot changing in an axial direction is measured and an amount of axial displacement of the grooved rollers is controlled so as to correspond to the measured amount of axial displacement of the ingot, and thereby, the ingot is sliced while controlling a relative position of the wire relative to an entire length of the ingot changing in the axial direction. As a result, a slicing method and a wire saw apparatus are provided that can perform slicing in such a way that a Bow or a Warp in a wafer obtained by slicing can be reduced, for example, by controlling a slicing path built into an ingot so that, in particular, the slicing path becomes flattened.
摘要翻译：本发明涉及一种用于通过将线缠绕在多个带槽辊上并将线压在锭上并将线移动并将切片浆料供应到带槽辊的方法来切割晶片形式的方法，其中当锭被切片时，测量锭在轴向上变化的位移量，并且控制带槽辊的轴向位移量，以便对应于测量的锭的轴向位移量，从而，在控制线相对于锭的整个长度在轴向方向上的相对位置的同时对锭进行切片。结果，提供了一种切片方法和线锯装置，其可以执行切片，使得可以通过例如通过控制内置在锭中的切片路径来减少通过切片获得的晶片中的弓或翘曲使得特别是切片路径变平。

8. 发明授权

US09079332B2 Method for resuming operation of wire saw and wire saw 有权
标题翻译：线锯和线锯恢复运行的方法
公开(公告)号：US09079332B2
公开(公告)日：2015-07-14
申请号：US14004791
申请日：2012-04-02
申请人： Koji Kitagawa
发明人： Koji Kitagawa
IPC分类号： B28D5/04 , B23D59/00
CPC分类号： B28D5/045 , B23D59/001
摘要： The present invention provides a method of resuming operation of a wire saw in which slicing of a workpiece is suspended and then resumed, including slicing the workpiece while detecting a traveling direction and a traveling speed of the reciprocating wire and recording them chronologically; and resuming the slicing while controlling the traveling direction and a traveling time in the traveling direction of the wire on a basis of a wire traveling history recorded until the suspending of the slicing of the workpiece such that the reciprocating cycle of the wire becomes continuous between before the suspending and after the resuming of the slicing of the workpiece. This method enables the slicing to be completed while the nanotopography of the sliced wafer is surely prevented from degrading, even when the slicing of the workpiece with a wire saw is suspended due to, for example, breaking of the wire.
摘要翻译：本发明提供了一种线锯的恢复操作方法，其中工件的切片暂停然后恢复，包括在检测往复导线的行进方向和行进速度并按时间顺序记录的同时切割工件; 并且基于记录的线材行进历史来控制行进方向的行进方向和行进方向的行驶时间，并重新开始切片，直到暂停工件的切割，使得电线的往复循环在之前连续变化暂停和恢复工件切片后。该方法能够在切片晶片的纳米形貌可靠地防止劣化的同时完成切片，即使当由于例如电线断裂而用线锯将工件切片悬挂时。

9. 发明授权

US08146581B2 Method for slicing workpiece 有权
标题翻译：切割工件的方法
公开(公告)号：US08146581B2
公开(公告)日：2012-04-03
申请号：US12990985
申请日：2009-06-04
申请人： Koji Kitagawa , Kazuya Tomii
发明人： Koji Kitagawa , Kazuya Tomii
IPC分类号： B28D1/08
CPC分类号： B28D5/045 , B24B27/0633 , B28D5/0088
摘要： The present invention is a method for slicing a workpiece into wafers by pressing a cylindrical workpiece held with a workpiece holder against a wire row formed by a wire spirally wound between a plurality of wire guides and making the wire travel while supplying a slurry to a contact portion between the workpiece and the wire, wherein the workpiece is sliced with an axis direction of the workpiece inclined with respect to a plane formed by the wire row, after the workpiece is inclined in such a manner that a side far from the wire row plane is a side where the wire guides are to be axially expanded. As a result, there is provided a method for slicing that enable wafers having a good Warp shape to be obtained by precisely slicing a workpiece with a wire saw.
摘要翻译：本发明是一种通过将保持有工件保持件的圆柱形工件压靠在由螺旋形缠绕在多个导线器之间的线形成的线排上并使电线行进同时向接触件供应浆料的方法来将工件切割成晶片工件与线之间的部分，其中工件在工件以远离线排平面的一侧倾斜时相对于由线列形成的平面倾斜的工件的轴线方向切片是引导件被轴向膨胀的一侧。结果，提供了一种用于切割的方法，其使得能够通过用线锯精确地切割工件来获得具有良好翘曲形状的晶片。

10. 发明授权

US08092281B2 Polishing head and polishing apparatus 有权
标题翻译：抛光头和抛光装置
公开(公告)号：US08092281B2
公开(公告)日：2012-01-10
申请号：US12311690
申请日：2007-10-18
申请人： Hisashi Masumura , Koji Kitagawa , Kouji Morita , Hiromi Kishida , Satoru Arakawa
发明人： Hisashi Masumura , Koji Kitagawa , Kouji Morita , Hiromi Kishida , Satoru Arakawa
IPC分类号： B24B5/35
CPC分类号： B24B37/30
摘要： The present invention is a polishing head provided with an annular rigid ring, a rubber film bonded to the rigid ring with a uniform tension, a mid plate joined to the rigid ring and forming a space portion together with the rubber film and the rigid ring, and an annular template provided concentrically with the rigid ring in a peripheral portion on a lower face part of the rubber film and having an outer diameter larger than an inner diameter of the rigid ring, in which a pressure of the space portion can be changed by a pressure adjustment mechanism, a back face of a work is held on the lower face part of the rubber film, and a surface of the work is brought into sliding contact with the polishing pad attached onto a turn table for performing polishing, and an inner diameter of the template is smaller than an inner diameter of the rigid ring, and a ratio between an inner diameter difference between the rigid ring and the template and a difference between the inner diameter and an outer diameter of the template is 26% or more and 45% or less. Thereby, a polishing head and the like that can obtain constant flatness stably can be provided.
摘要翻译：本发明是一种抛光头，其具有环形刚性环，橡胶膜以均匀的张力粘合到刚性环上，中间板与刚性环接合并与橡胶膜和刚性环一起形成空间部分，以及环形模板，其与所述刚性环同心地设置在所述橡胶膜的下表面部分上的周边部分中，并且具有大于所述刚性环的内径的外径，其中所述空间部分的压力可以通过压力调节机构，工件的背面被保持在橡胶膜的下表面部分上，并且工件的表面与附着在用于抛光的转台上的抛光垫滑动接触，并且内部模板的直径小于刚性环的内径，刚性环与模板之间的内径差与内径与外径之间的差模板的直径为26％以上且45％以下。由此，可以提供能够稳定地获得恒定的平坦度的抛光头等。

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