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1. 发明授权

US5951282A Vertical heat treatment apparatus 失效
标题翻译：立式热处理设备
公开(公告)号：US5951282A
公开(公告)日：1999-09-14
申请号：US91420
申请日：1998-06-24
申请人： Kazunari Sakata , Tamotsu Tanifuji , Akihiko Tsukada
发明人： Kazunari Sakata , Tamotsu Tanifuji , Akihiko Tsukada
IPC分类号： H01L21/00 , F27D3/12
CPC分类号： H01L21/67109
摘要： The vertical heat treatment apparatus for semiconductor wafers (W) includes a heat treatment furnace (19). In the heat treatment furnace (19), the wafers (W) are subjected to a batch treatment in a state mounted on a boat (16). To the lower side of the heat treatment furnace (19), a preparatory vacuum chamber (102) is airtightly connected through a manifold (33). The manifold (33) has first and second parts (33a and 33b) separably coupled to each other, which are connected to the heat treatment furnace (19) and the preparatory vacuum chamber (102), respectively. The second part (33b) defines a valve seat on which a lid (22) is seated to cut off the communication between the heat treatment furnace (19) and the preparatory vacuum chamber (102). In a state where the lid (22) is seated on the valve seat to maintain the preparatory vacuum chamber (102) airtight, the heat treatment furnace (19) can be separated together with the first part (33a) of the manifold from the preparatory vacuum chamber (102) and the second part (33b) of the manifold.
摘要翻译： PCT No.PCT / JP97 / 03791 Sec。 371日期：1998年6月24日 102（e）1998年6月24日PCT 1997年10月21日PCT PCT。第WO98 / 19335号公报日期1998年5月7日半导体晶片用立式热处理装置（W）包括热处理炉（19）。在热处理炉（19）中，在安装在船（16）上的状态下对晶片（W）进行批处理。在热处理炉（19）的下侧，准备真空室（102）通过歧管（33）气密连接。歧管（33）具有分别彼此分离地连接到热处理炉（19）和预备真空室（102）的第一和第二部分（33a和33b）。第二部分（33b）限定了一个阀座，在其上安置有盖（22）以截断热处理炉（19）和预备真空室（102）之间的连通。在将盖（22）安置在阀座上以保持预备真空室（102）气密的状态下，热处理炉（19）可与歧管的第一部分（33a）一起从预备真空室（102）和歧管的第二部分（33b）。

2. 发明授权

US6042372A Heat treatment apparatus 失效
标题翻译：热处理设备
公开(公告)号：US6042372A
公开(公告)日：2000-03-28
申请号：US91419
申请日：1998-06-24
申请人： Kazunari Sakata , Tamotsu Tanifuji , Akihiko Tsukada
发明人： Kazunari Sakata , Tamotsu Tanifuji , Akihiko Tsukada
IPC分类号： H01L21/22 , B65G49/07 , C23C16/54 , C30B25/08 , C30B31/10 , C30B31/12 , C30B35/00 , H01L21/00 , H01L21/205 , H01L21/31 , H01L21/324 , H01L21/677
CPC分类号： H01L21/67757 , C23C16/54 , C30B25/08 , C30B31/10 , C30B31/12 , C30B35/005 , H01L21/67109 , Y10S414/138 , Y10S414/139 , Y10S414/14
摘要： A vertical heat treatment apparatus for semiconductor wafers (W) including a heat treating furnace (19) which is heated to 600.degree. C. or higher. In the heat treating furnace (19), the wafers (W) are subjected to batch treatment while they are placed on a boat (16). A preparatory vacuum chamber (102) is airtightly connected to a lower side of the heat treating furnace (19). Disposed in the preparatory vacuum chamber (102) are a horizontal transfer mechanism (201) and a vertical transfer mechanism (202) for transferring the boat (16). The two transfer mechanisms (201 and 202) are supported by support members (29a and 33a) mounted on a mechanical base (28). The preparatory vacuum chamber (102) and the support members (29a and 33a) are airtightly connected to each other by means of bellows.
摘要翻译： PCT No.PCT / JP97 / 03772 Sec。 371日期：1998年6月24日 102（e）日期1998年6月24日PCT 1997年10月20日PCT公布。公开号WO98 / 19334 日期1998年5月7日一种用于半导体晶片（W）的立式热处理装置，其包括加热至600℃或更高的热处理炉（19）。在热处理炉（19）中，将晶片（W）放置在船（16）上进行批处理。准备真空室（102）与热处理炉（19）的下侧气密连接。在准备真空室（102）中设置有水平传送机构（201）和用于传送船（16）的垂直传送机构（202）。两个传送机构（201和202）由安装在机械基座（28）上的支撑构件（29a和33a）支撑。准备真空室（102）和支撑构件（29a和33a）通过波纹管彼此气密地连接。

3. 发明授权

US06419482B1 Opening and closing apparatus of an opening and closing lid of a box accommodating an object to be processed and a processing system of an object to be processed 失效
标题翻译：装有被处理物的箱体的开闭盖的开闭装置以及被处理物的处理系统
公开(公告)号：US06419482B1
公开(公告)日：2002-07-16
申请号：US09640908
申请日：2000-08-18
申请人： Kazunari Sakata , Tamotsu Tanifuji , Masahiro Ogawa
发明人： Kazunari Sakata , Tamotsu Tanifuji , Masahiro Ogawa
IPC分类号： F27D118
CPC分类号： H01L21/67373 , H01L21/67772
摘要： An opening and closing apparatus (52, 54) opens and closes an opening and closing lid (10) which closes an opening part (4) of an accommodating box (2) for accommodating an object (W) to be processed and is locked by a locking mechanism (12). A key member (26) is mounted to a base table (90) via a bearing mechanism (92) in a state in which the key member is rotatable with respect to the base table (90) and movable in a vertical direction with respect to a front surface of the base table (90). A part of the opening and closing lid (10) is held by being put between the key member (26) and an elastic member (98) provided on a front surface of the base table. Thereby, the opening and closing lid (10) is prevented from being displaced with respect to the base table (90) when the opening and closing lid (10) is removed from the accommodation box (2).
摘要翻译：打开和关闭装置（52,54）打开和关闭用于封闭用于容纳待处理物体（W）的收纳箱（2）的开口部分（4）的开闭盖（10），并被锁定机构（12）。键构件（26）经由轴承机构（92）被安装到基座台（90）上，在该状态下，键构件可相对于基台（90）旋转，并且可相对于基台（90）的前表面。打开和关闭盖（10）的一部分通过放置在键构件（26）和设置在基座的前表面上的弹性构件（98）之间而被保持。因此，当开闭盖（10）从收纳箱（2）移除时，防止开关盖（10）相对于基台（90）移位。

4. 发明授权

US5447294A Vertical type heat treatment system 失效
标题翻译：立式热处理系统
公开(公告)号：US5447294A
公开(公告)日：1995-09-05
申请号：US184055
申请日：1994-01-21
申请人： Kazunari Sakata , Masato Kadobe , Isao Furuya , Shingo Watanabe , Hiroki Fukushima , Hiroyuki Iwai
发明人： Kazunari Sakata , Masato Kadobe , Isao Furuya , Shingo Watanabe , Hiroki Fukushima , Hiroyuki Iwai
IPC分类号： H01L21/00
CPC分类号： H01L21/67109
摘要： A vertical heat treatment system for heat treating a large number of semiconductor wafers housed in a boat at once includes a heat treatment unit having a boat loading/unloading port, a boat section communicating with the heat treatment unit through the boat loading/unloading port, an elevator mechanism for loading/unloading the boat between the boat section and the heat treatment unit through the boat loading/unloading port, a cassette section provided adjacent to the boat section, a wafer transfer mechanism for transferring wafers between a cassette and the boat, a gas supply mechanism for supplying a non-oxidization gas into the boat section, and a gas shower means for blowing the non-oxidization gas to the wafers in the vicinity of the boat loading/unloading port.
摘要翻译：用于一次热处理容纳在船上的大量半导体晶片的立式热处理系统包括具有船装卸口的热处理单元，通过船装卸口与热处理单元连通的船段，用于通过船舶装载/卸载端口在船舶部分和热处理单元之间装载/卸载船舶的电梯机构，与船舱部分相邻设置的舱室部分，用于在盒和船之间传送晶片的晶片传送机构，用于将非氧化气体供应到船舶部分中的气体供给机构，以及用于将非氧化气体吹送到船舶装载/卸载端口附近的晶片的气体淋浴装置。

5. 发明授权

US5261935A Clean air apparatus 失效
标题翻译：清洁空气装置
公开(公告)号：US5261935A
公开(公告)日：1993-11-16
申请号：US23394
申请日：1993-02-26
申请人： Katsumi Ishii , Takanobu Asano , Masaharu Abe , Kenichi Yamaga , Kazunari Sakata , Takashi Tanahashi , Syuji Moriya
发明人： Katsumi Ishii , Takanobu Asano , Masaharu Abe , Kenichi Yamaga , Kazunari Sakata , Takashi Tanahashi , Syuji Moriya
IPC分类号： C30B33/00 , H01L21/00 , H01L21/677 , B01D46/04
CPC分类号： H01L21/67757 , C30B33/00 , H01L21/67017 , H01L21/67769 , H01L21/67772 , Y10S414/137 , Y10S414/139 , Y10S414/14
摘要： A clean air apparatus includes a housing having an opening through which a carrier housing semiconductor wafers is supplied into the housing and an I/O port for supporting the carrier and a furnace for treating the wafer, provided in the upper portion of the housing. The carriers are at the same time supported by a first carrier stage provided in the upper portion of the housing and supported by a second carrier stage provided in the lower portion of the housing. The carrier or carriers are selectively moved between the I/O port and the first stage, between the I/O port and the second stage, and between the first stage and the second stage. A clean air is applied to the wafers in the carriers supported by the I/O port, the first stage and the second stage.
摘要翻译：清洁空气装置包括壳体，壳体具有开口，载体壳体半导体晶片被供给到壳体中，以及用于支撑载体的I / O端口和设置在壳体的上部中的晶片处理炉。载体同时由设置在壳体的上部中的第一载体台支撑并由设置在壳体的下部中的第二载体台支撑。载体或载体选择性地在I / O端口和第一级之间，I / O端口和第二级之间以及在第一级和第二级之间移动。将清洁空气施加到由I / O端口，第一级和第二级支撑的载体中的晶片。

6. 发明授权

US07059849B2 Heat treatment system and a method for cooling a loading chamber 有权
标题翻译：热处理系统和冷却装载室的方法
公开(公告)号：US07059849B2
公开(公告)日：2006-06-13
申请号：US09934756
申请日：2001-08-23
申请人： Kazunari Sakata , Koyu Hasegawa , Keiichi Katabuchi , Shingo Watanabe , Shinya Mochizuki , Motoki Akimoto , Hiroshi Motono
发明人： Kazunari Sakata , Koyu Hasegawa , Keiichi Katabuchi , Shingo Watanabe , Shinya Mochizuki , Motoki Akimoto , Hiroshi Motono
IPC分类号： F27D9/00
CPC分类号： H01L21/67373 , F27B5/04 , F27B17/0025 , F27D3/0084 , F27D5/0037 , H01L21/67017 , H01L21/67109 , H01L21/67379 , H01L21/67389 , H01L21/67393 , H01L21/67739 , H01L21/67769 , H01L21/67772 , H01L21/67775 , H01L21/67778 , H01L21/68707 , Y10S269/903 , Y10S414/135 , Y10S414/137
摘要： A heat treatment system and method for cooling a loading chamber that includes a heat treatment furnace for heat-treating an object to be treated. The heat treatment furnace includes a throat for carrying the object in and out, and a cooling mechanism for cooling the vicinity of the throat. The cooling mechanism has a ventilating unit with a ventilating port for sending a cooling fluid toward the vicinity of the throat and a heat exchanger arranged so as to face the ventilating port in the vicinity of the throat. The cooling mechanism also has an intake fan for sucking the cooling fluid in the vicinity of the throat over the heat exchanger. When the object to be treated is carried in, the structure of various mechanisms in the vicinity of the throat is simplified, and space is saved.
摘要翻译：一种用于冷却装载室的热处理系统和方法，其包括用于对待处理物体进行热处理的热处理炉。热处理炉包括用于输入和输出物体的喉部和用于冷却喉部附近的冷却机构。冷却机构具有通风单元，其具有用于向喉部附近发送冷却流体的通风口和布置成面对喉部附近的通气口的热交换器。冷却机构还具有用于吸引热交换器上的喉部附近的冷却流体的进气扇。当被处理物被携带时，喉部附近的各种机构的结构被简化，节省了空间。

7. 发明授权

US5181819A Apparatus for processing semiconductors 失效
标题翻译：半导体处理装置
公开(公告)号：US5181819A
公开(公告)日：1993-01-26
申请号：US772836
申请日：1991-10-08
申请人： Kazunari Sakata , Katsumi Ishii , Kenichi Yamaga
发明人： Kazunari Sakata , Katsumi Ishii , Kenichi Yamaga
IPC分类号： B65G49/07 , H01L21/00 , H01L21/677
CPC分类号： H01L21/67757 , H01L21/67017 , H01L21/67769 , H01L21/67772 , Y10S414/137 , Y10S414/139 , Y10S414/14
摘要： A semiconductor processing apparatus comprises a main body having an air passage, a plurality of filter units connected in series with the air passage in the main body, each filter unit having an air intake port, an air otlet port and an air blower, the air intake port of each filter unit communicating with the air outlet ports of the filter units disposed upstream side of the air passage, and a mechanism for arranging articles to be processed close to the air outlet port of each filter unit such that air is supplied to the articles to be processed after the air has passed through the corresponding filter units.
摘要翻译：半导体处理装置包括具有空气通道的主体，与主体中的空气通道串联连接的多个过滤器单元，每个过滤单元具有进气口，空气口和送风机，空气每个过滤器单元的进气口与设置在空气通道的上游侧的过滤器单元的空气出口连通，以及用于将待加工物品靠近每个过滤器单元的空气出口排列的机构，在空气通过相应的过滤器单元后待处理的物品。

8. 发明授权

US06729823B2 Processing system for object to be processed 有权
标题翻译：待处理对象的处理系统
公开(公告)号：US06729823B2
公开(公告)日：2004-05-04
申请号：US09934757
申请日：2001-08-23
申请人： Kazunari Sakata , Yasushi Takeuchi
发明人： Kazunari Sakata , Yasushi Takeuchi
IPC分类号： B65G106
CPC分类号： H01L21/67769 , H01L21/67017 , H01L21/67373 , H01L21/67393 , H01L21/67757 , H01L21/67772
摘要： A processing system for an object to be processed has a housing defining a closed space. The housing is provided with an opening through which an airtight carrying box is carried in and carried out. The carrying box hermetically contains the object to be processed. A lid operating mechanism for opening and closing the lid of the carrying box is disposed near the opening. A contamination preventing duct covers a space around the lid of the carrying box and supplies a clean gas of a high cleanliness therein at least when the lid of the carrying box is opened.
摘要翻译：用于待处理物体的处理系统具有限定封闭空间的壳体。壳体设置有开口，气密携带箱通过该开口被携带并被执行。携带箱气密地包含待处理的物体。用于打开和关闭搬运箱盖的盖操作机构设置在开口附近。防污染管道覆盖承载箱盖周围的空间，并且至少在打开搬运箱的盖子时，提供高清洁度的洁净气体。

9. 发明授权

US5556275A Heat treatment apparatus 失效
标题翻译：热处理设备
公开(公告)号：US5556275A
公开(公告)日：1996-09-17
申请号：US317653
申请日：1994-09-30
申请人： Kazunari Sakata , Kenji Tago , Mitsuo Mizukami
发明人： Kazunari Sakata , Kenji Tago , Mitsuo Mizukami
IPC分类号： C23C16/455 , C23C16/54 , H01L21/00 , H01L21/677 , F27D3/12
CPC分类号： H01L21/67109 , C23C16/455 , C23C16/54 , H01L21/67778
摘要： A heat treatment apparatus comprising a holder, a hollow cylindrical cover, a flat plate, and a processing chamber. The holder holds disk-shaped objects, each having an orientation flat portion at circumference. The objects are arranged coaxially and spaced at predetermined intervals, with the orientation flat portions aligned with one another. The cover has gas ports and surrounds the objects held by the holder and is spaced from a circumference of each object by a predetermined distance. The flat plate is mounted on an inner surface of the cover and opposes the orientation flat portions of the objects. In the processing chamber, the objects held by the holder are processed by using a process gas.
摘要翻译：一种热处理装置，包括保持器，中空圆柱形盖，平板和处理室。保持器保持圆盘形物体，每个物体在圆周处具有取向平坦部分。物体被同轴地布置并且以预定间隔间隔开，其中定向平坦部分彼此对准。盖具有气体端口并且围绕由保持器保持的物体并且与每个物体的圆周间隔开预定距离。平板安装在盖的内表面上并与物体的取向平坦部分相对。在处理室中，由保持器保持的物体通过使用处理气体进行处理。

10. 发明授权

US5261167A Vertical heat treating apparatus 失效
标题翻译：立式热处理装置
公开(公告)号：US5261167A
公开(公告)日：1993-11-16
申请号：US766205
申请日：1991-09-27
申请人： Kazunari Sakata
发明人： Kazunari Sakata
IPC分类号： F26B21/00 , F26B21/02 , H01L21/00 , H01L21/677 , F26B21/06
CPC分类号： H01L21/67109 , F26B21/003 , F26B21/02 , H01L21/67017
摘要： A vertical heat treating apparatus comprises a casing having an opening through which articles to be processed are loaded and unloaded, a heat treating furnace provided in the casing, a loading and unloading mechanism provided under the heat treating furnace so as to load the articles to be processed in and unload the same from the heat treating furnace, and a clean air flow forming unit provided in a space which is formed in the casing and in which the loading and unloading mechanism is provided so as to form a clean air flow conducted from one side of the casing to the opposite side thereof.
摘要翻译：立式热处理装置包括具有开口的壳体，通过该开口装载和卸载待处理的物品，设置在壳体中的热处理炉，设置在热处理炉下方的加载和卸载机构，以将物品装载为从热处理炉中加工和卸载的清洁空气流形成单元，以及设置在形成在壳体中的空间中的清洁空气流形成单元，其中设置有装载和卸载机构以形成从一个一侧到另一侧。

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