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1. 发明申请

US20100000469A1 DEPOSITION APPARATUS FOR ORGANIC EL AND EVAPORATING APPARATUS 审中-公开
标题翻译：有机EL和蒸发装置的沉积装置
公开(公告)号：US20100000469A1
公开(公告)日：2010-01-07
申请号：US12494453
申请日：2009-06-30
申请人： Yasushi Yagi , Shingo Watanabe , Yuji Ono , Hiroshi Kaneko , Koyu Hasegawa , Mitsuaki Komino
发明人： Yasushi Yagi , Shingo Watanabe , Yuji Ono , Hiroshi Kaneko , Koyu Hasegawa , Mitsuaki Komino
IPC分类号： C23C16/54
CPC分类号： C23C14/26 , C23C14/243 , H01L51/001
摘要： Provided is a deposition apparatus for organic EL capable of allowing vapor of a film forming material to be vapor deposited on a target object to be uniformly heated. A deposition apparatus, which performs a film forming process by vapor depositing a film forming material on a target object in a depressurized processing chamber, includes an evaporating head having a vapor discharge opening, disposed in the processing chamber, for discharging vapor of the film forming material. Inside the evaporating head, provided is a heater receiving member which is sealed with respect to an inside of the processing chamber, and installed is a communication path which allows the heater receiving member to communicate with an outside of the processing chamber. A power supply line for a heater received in the heater receiving member is disposed in the communication path and extended to the outside of the processing chamber.
摘要翻译：本发明提供一种能够使成膜材料的蒸气气相沉积在目标物体上以均匀加热的有机EL的沉积装置。通过在减压处理室中对目标物体上的成膜材料进行气相沉积而进行成膜处理的沉积装置包括具有蒸气排出口的蒸发头，设置在处理室中，用于排出成膜用蒸气材料。在蒸发头内部设置有相对于处理室的内部密封的加热器接收构件，并且设置有允许加热器接收构件与处理室的外部连通的连通路径。用于接收在加热器接收构件中的加热器的电源线设置在连通路径中并延伸到处理室的外部。

2. 发明申请

US20120001102A1 HIGHLY CLEAN AND HOT VALVE 审中-公开
标题翻译：高清洁和高温阀
公开(公告)号：US20120001102A1
公开(公告)日：2012-01-05
申请号：US12864382
申请日：2009-01-21
申请人： Yasuhiro Chiba , Kohei Yamamoto , Hiroshi Takada , Kota Koizumi , Yasushi Yagi , Shingo Watanabe , Yuji Ono , Hiroshi Kaneko , Koyu Hasegawa
发明人： Yasuhiro Chiba , Kohei Yamamoto , Hiroshi Takada , Kota Koizumi , Yasushi Yagi , Shingo Watanabe , Yuji Ono , Hiroshi Kaneko , Koyu Hasegawa
IPC分类号： F16K31/122
CPC分类号： F16K41/10 , F16K31/126 , F16K31/1268
摘要： A highly clean and high temperature valve apparatus includes a valve driving unit and a valve casing connected to a bonnet supporting a valve stem slidably. A stem portion has one end positioned in a circumferential wall closed at its two ends by upper and lower covers, and supports one end of the valve stem with its other end extending through the lower cover. The stem portion has its ends supported respectively by first and second bellows for closing an axial through hole of the lower cover tightly. A first pipe communicates with a first space isolated by the first bellows, and a second pipe communicates with a second space isolated by the first bellows. The fluid quantities in the first and second spaces are increased or decreased relative to each other, thereby to drive the stem portion supported in a floating state by the first and second bellows.
摘要翻译：高度清洁和高温的阀门装置包括阀驱动单元和阀壳，其可滑动地连接到支撑阀杆的阀盖。杆部分具有位于周向壁的一端，其两端通过上盖和下盖封闭，并且支撑阀杆的一端，其另一端延伸穿过下盖。杆部分的端部分别由第一和第二波纹管支撑，用于紧密地封闭下盖的轴向通孔。第一管与由第一波纹管隔离的第一空间连通，第二管与由第一波纹管隔离的第二空间连通。第一和第二空间中的流体量相对于彼此增加或减小，从而驱动由第一和第二波纹管以浮动状态支撑的杆部。

3. 发明申请

US20100126417A1 DEPOSITION SOURCE UNIT, DEPOSITION APPARATUS AND TEMPERATURE CONTROLLER OF DEPOSITION SOURCE UNIT 审中-公开
标题翻译：沉积源单元，沉积源单元的沉积装置和温度控制器
公开(公告)号：US20100126417A1
公开(公告)日：2010-05-27
申请号：US12593753
申请日：2008-03-25
申请人： Koyu Hasegawa , Yuji Ono
发明人： Koyu Hasegawa , Yuji Ono
IPC分类号： C23C16/52 , C23C16/00
CPC分类号： C23C16/4481 , H01L51/0008 , H01L51/56 , H05B33/10
摘要： A deposition apparatus includes a deposition source unit, a transport mechanism for transporting a vaporized film forming material and a blowing device for blowing off the transported film forming material. The deposition source unit includes a vapor deposition source assembly, a housing and a water cooling jacket. The vapor deposition source assembly includes a gas supply mechanism, a gas inlet and a first material evaporating chamber formed as one body. A heater of the housing heats a film forming material in the first material evaporating chamber and the carrier gas flowing in a plurality of gas passages. The vaporized film forming material is transported by an argon gas. The water cooling jacket is installed apart from an outer peripheral surface of the housing at a certain distance and cools the deposition source unit.
摘要翻译：沉积装置包括沉积源单元，用于输送蒸发的成膜材料的输送机构和用于吹出传送的成膜材料的吹塑装置。沉积源单元包括气相沉积源组件，壳体和水冷套。气相沉积源组件包括气体供应机构，气体入口和形成为一体的第一材料蒸发室。外壳的加热器加热第一材料蒸发室中的成膜材料和在多个气体通道中流动的载气。蒸发的成膜材料通过氩气输送。水冷却套筒以一定距离与壳体的外周表面分开安装，并冷却沉积源单元。

4. 发明授权

US07059849B2 Heat treatment system and a method for cooling a loading chamber 有权
标题翻译：热处理系统和冷却装载室的方法
公开(公告)号：US07059849B2
公开(公告)日：2006-06-13
申请号：US09934756
申请日：2001-08-23
申请人： Kazunari Sakata , Koyu Hasegawa , Keiichi Katabuchi , Shingo Watanabe , Shinya Mochizuki , Motoki Akimoto , Hiroshi Motono
发明人： Kazunari Sakata , Koyu Hasegawa , Keiichi Katabuchi , Shingo Watanabe , Shinya Mochizuki , Motoki Akimoto , Hiroshi Motono
IPC分类号： F27D9/00
CPC分类号： H01L21/67373 , F27B5/04 , F27B17/0025 , F27D3/0084 , F27D5/0037 , H01L21/67017 , H01L21/67109 , H01L21/67379 , H01L21/67389 , H01L21/67393 , H01L21/67739 , H01L21/67769 , H01L21/67772 , H01L21/67775 , H01L21/67778 , H01L21/68707 , Y10S269/903 , Y10S414/135 , Y10S414/137
摘要： A heat treatment system and method for cooling a loading chamber that includes a heat treatment furnace for heat-treating an object to be treated. The heat treatment furnace includes a throat for carrying the object in and out, and a cooling mechanism for cooling the vicinity of the throat. The cooling mechanism has a ventilating unit with a ventilating port for sending a cooling fluid toward the vicinity of the throat and a heat exchanger arranged so as to face the ventilating port in the vicinity of the throat. The cooling mechanism also has an intake fan for sucking the cooling fluid in the vicinity of the throat over the heat exchanger. When the object to be treated is carried in, the structure of various mechanisms in the vicinity of the throat is simplified, and space is saved.
摘要翻译：一种用于冷却装载室的热处理系统和方法，其包括用于对待处理物体进行热处理的热处理炉。热处理炉包括用于输入和输出物体的喉部和用于冷却喉部附近的冷却机构。冷却机构具有通风单元，其具有用于向喉部附近发送冷却流体的通风口和布置成面对喉部附近的通气口的热交换器。冷却机构还具有用于吸引热交换器上的喉部附近的冷却流体的进气扇。当被处理物被携带时，喉部附近的各种机构的结构被简化，节省了空间。

5. 发明申请

US20100071623A1 EVAPORATING APPARATUS 审中-公开
标题翻译：蒸气装置
公开(公告)号：US20100071623A1
公开(公告)日：2010-03-25
申请号：US12441934
申请日：2007-10-01
申请人： Shingo Watanabe , Yuji Ono , Koyu Hasegawa , Masahiro Ogawa , Kouichi Honda
发明人： Shingo Watanabe , Yuji Ono , Koyu Hasegawa , Masahiro Ogawa , Kouichi Honda
IPC分类号： C23C16/00
CPC分类号： C23C14/12 , C23C14/243
摘要： Disclosed is an evaporating apparatus for performing a film forming process on a target object to be processed by vapor deposition, wherein a processing chamber and a vapor generating chamber are disposed adjacent to each other, gas exhaust mechanisms for depressurizing an inside of the processing chamber and an inside of the vapor generating chamber are installed, a vapor discharge opening for discharging a vapor of the film forming material is disposed in the processing chamber, vapor generating units for vaporizing the film forming material and control valves for controlling a supply of the vapor of the film forming material are disposed in the vapor generating chamber, and flow paths, which are not exposed to an outside of the processing chamber and the vapor generating chamber, for supplying the vapor of the film forming material generated in the vapor generating units to the vapor discharge opening are installed.
摘要翻译：本发明公开了一种用于对通过气相沉积处理的目标物体进行成膜处理的蒸发装置，其中处理室和蒸汽发生室彼此相邻设置，用于对处理室内部进行减压的排气机构，蒸汽发生室内部安装有用于排出成膜材料的蒸汽的蒸汽排放口，用于蒸发成膜材料的蒸汽发生单元和用于控制成膜材料供应的控制阀成膜材料设置在蒸汽发生室中，并且没有暴露于处理室和蒸气发生室的外部的流路用于将在蒸汽发生单元中产生的成膜材料的蒸汽供应到安装蒸汽排放口。

6. 发明申请

US20070166657A1 Heat treatment system and method therefore 有权
标题翻译：热处理系统和方法因此
公开(公告)号：US20070166657A1
公开(公告)日：2007-07-19
申请号：US11705443
申请日：2007-02-13
申请人： Kazunari Sakata , Koyu Hasegawa , Keiichi Katabuchi , Shingo Watanabe , Shinya Mochizuki , Motoki Akimoto , Hiroshi Motono
发明人： Kazunari Sakata , Koyu Hasegawa , Keiichi Katabuchi , Shingo Watanabe , Shinya Mochizuki , Motoki Akimoto , Hiroshi Motono
IPC分类号： F27D1/18
CPC分类号： H01L21/67373 , F27B5/04 , F27B17/0025 , F27D3/0084 , F27D5/0037 , H01L21/67017 , H01L21/67109 , H01L21/67379 , H01L21/67389 , H01L21/67393 , H01L21/67739 , H01L21/67769 , H01L21/67772 , H01L21/67775 , H01L21/67778 , H01L21/68707 , Y10S269/903 , Y10S414/135 , Y10S414/137
摘要： There is provided a vertical heat treatment system capable of simplifying the structure of various mechanisms in the vicinity of an opening which is formed in a partition wall separating a housing-box transfer area from a treating-object transfer area (a wafer transfer area), and of contributing to space saving, when an object to be treated is carried in the vertical heat treatment system through the opening to carry out a predetermined treatment. In a vertical heat treatment system for carrying an object W to be treated, which is housed in a treating-object housing box 2 closed by an opening/closing lid 10, in a treating-object transfer area 46 via an opening 28, which is formed in a partition wall 26 separating a housing-box transfer area 44 for transferring the treating-object housing box from the treating-object transfer area 46 in an atmosphere of an inert gas, to carry out a predetermined treatment, a standby box transfer means 60 is provided in the housing-box transfer area for holding a treating-object housing box, which houses therein the next object to be carried in the treating-object transfer area, in the vicinity of the opening to cause the treating-object housing box to stand by. Thus, when the object to be treated is carried in via the opening of the partition wall, which separates the housing-box transfer area from the treating-object transfer area (wafer transfer area), to carry out a predetermined treatment, the structure of various mechanisms in the vicinity of the opening is simplified, and the space is saved.
摘要翻译：提供了一种垂直式热处理系统，其能够简化形成在将箱体搬送区域从处理对象搬送区域（晶片转移区域）分离的分隔壁的开口附近的各种机构的结构，并且当通过开口在垂直热处理系统中承载待处理物体时，有助于节省空间，以进行预定处理。在用于承载被打开/关闭盖10封闭的处理对象收纳箱2中的待处理对象物W的立式热处理系统经由开口28在处理对象转移区域46中形成在隔离壁26中，隔离箱26分离用于在惰性气体气氛中将处理对象收纳箱从处理对象转移区域46传送的收纳箱传送区域44，以执行预定处理;待机箱传送装置 60设置在用于保持处理对象收纳箱的收纳箱传送区域中，处理对象收纳箱在其内容纳有待处理对象转移区域中的下一个物体的开口附近，从而使处理对象收纳箱待命因此，当待处理物体经由将箱体转移区域从处理对象转移区域（晶片转移区域）分离的分隔壁的开口进行预定处理时，结构简化了开口附近的各种机构，节省了空间。

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