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    • 7. 发明申请
    • Non-volatile semiconductor memory device and method for producing same
    • 非易失性半导体存储器件及其制造方法
    • US20050230766A1
    • 2005-10-20
    • US11131865
    • 2005-05-18
    • Kazumasa NomotoHiroshi AozasaIchiro FujiwaraShinji Tanaka
    • Kazumasa NomotoHiroshi AozasaIchiro FujiwaraShinji Tanaka
    • H01L21/8247H01L21/28H01L21/318H01L21/762H01L27/115H01L27/12H01L29/788H01L29/792H01L21/336
    • H01L29/792H01L21/28282H01L21/7624
    • The memory device has a plurality of dielectric films including charge storage layers CS having a charge holding capability therein and stacked on an active region of a semiconductor SUB and electrodes G on the plurality of dielectric films. Each charge storage layer CS includes a first nitride film CS1 made of silicon nitride or silicon oxynitride and a second nitride film CS2 made of silicon nitride or silicon oxynitride and having a higher charge trap density than the first nitride film CS1. The first nitride film CS1 is formed by chemical vapor deposition using a first gas which contains a first silicon-containing gas containing chlorine with a predetermined percent composition and a nitrogen-containing gas as starting materials. The second nitride film CS2 is formed by chemical vapor deposition using a second gas which contains a second silicon-containing gas having a lower chlorine percent composition than the above predetermined percent composition and a nitrogen-containing gas as starting materials.
    • 存储器件具有多个电介质膜,其包括其中具有电荷保持能力的电荷存储层CS,并且堆叠在半导体SUB的有源区和多个介电膜上的电极G. 每个电荷存储层CS包括由氮化硅或氮氧化硅制成的第一氮化物膜CS 1和由氮化硅或氮氧化硅制成并且具有比第一氮化物膜CS 1更高的电荷陷阱密度的第二氮化物膜CS 2。 第一氮化物膜CS1通过化学气相沉积形成,该第一气体含有含有预定百分比组成的含氯的第一含硅气体和含氮气体作为原料。 第二氮化物膜CS2通过使用包含比上述预定百分比组成低的氯百分含量的第二含硅气体和含氮气体作为起始材料的第二气体进行化学气相沉积而形成。
    • 8. 发明授权
    • Non-volatile semiconductor memory device and process for fabricating the same
    • 非易失性半导体存储器件及其制造方法
    • US06885060B2
    • 2005-04-26
    • US10101191
    • 2002-03-19
    • Kazumasa NomotoToshio Kobayashi
    • Kazumasa NomotoToshio Kobayashi
    • H01L21/8247H01L21/8246H01L27/115H01L29/788H01L29/792H01L29/00
    • H01L27/11568H01L27/115H01L29/792Y10S438/954
    • A non-volatile semiconductor memory device comprising a first conductive semiconductor having steps on a surface thereof, a second conductive semiconductor region formed on an upper portion and a bottom portion of each of the steps and being separated in a direction perpendicular to the main surface of the first conductive semiconductor to function as a source or a drain, a gate dielectric film containing therein charge storage means which is spatially discrete and being formed on the first conductive semiconductor so as to coat at least a sidewall of each of the steps, and a gate electrode formed on the gate dielectric film. Accordingly, there are provided a non-volatile semiconductor memory device which suffers almost no deterioration in the properties and can perform the operation of recording of 2 bits per unit memory device even when the size of the semiconductor memory device in the semiconductor substrate is scaled down, and a process for fabricating the non-volatile semiconductor memory device.
    • 一种非易失性半导体存储器件,包括在其表面上具有台阶的第一导电半导体区,形成在每个台阶的上部和底部上的第二导电半导体区域,并且沿垂直于主表面的方向分离 用作源极或漏极的第一导电半导体,其中包含电荷存储装置的栅极电介质膜,空间上离散并形成在第一导电半导体上,以便涂覆至少每一个步骤的侧壁,以及 栅电极形成在栅极电介质膜上。 因此,提供了几乎不会劣化的性能的非易失性半导体存储器件,并且即使当半导体衬底中的半导体存储器件的尺寸缩小时也可以执行每单位存储器件的2位的记录操作 ,以及用于制造非易失性半导体存储器件的工艺。
    • 9. 发明授权
    • Method of forming a semiconductor thin film on a plastic substrate
    • 在塑料基板上形成半导体薄膜的方法
    • US06376290B1
    • 2002-04-23
    • US09116119
    • 1998-07-16
    • Dharam Pal GosainJonathan WestwaterMiyako NakagoeSetsuo UsuiKazumasa Nomoto
    • Dharam Pal GosainJonathan WestwaterMiyako NakagoeSetsuo UsuiKazumasa Nomoto
    • H01L2100
    • H01L29/66765H01L29/78603
    • A method is provided for forming a semiconductor thin film which is free from damage to the film with radiation of a pulse laser beam with the optimum energy value for perfect polycrystallization. For forming an amorphous silicon thin film, a surface of a plastic substrate as a base and insulating layers are each radiated with a pulse laser beam for removing volatile contaminants like a resist as a pretreatment. Damage to the film caused by a gas emitted from the base substrate and the insulating layers resulting from volatile contaminants is thus prevented. A protective layer including a gas barrier layer and a refractory buffer layer is formed on the substrate. Gas penetration from the substrate to the amorphous silicon film is thereby prevented. Conduction of heat produced by energy beam radiation to the substrate is prevented as well. It is possible to increase energy intensity of energy beam radiated for polycrystallization of the amorphous silicon film to the optimal value for perfect polycrystallization.
    • 提供了一种用于形成半导体薄膜的方法,该半导体薄膜不会损坏具有用于完美多晶化的最佳能量值的脉冲激光束的辐射。 为了形成非晶硅薄膜,以用作去除挥发性污染物如抗蚀剂的脉冲激光束作为基底和绝缘层的塑料基板的表面各自辐射,作为预处理。 因此防止了由基底衬底发出的气体和由挥发性污染物引起的绝缘层引起的膜损伤。 在基板上形成包括阻气层和难熔缓冲层的保护层。 从而防止了从基板到非晶硅膜的气体渗透。 也可以防止能量束辐射产生的热量传导到基板上。 可以将非晶硅膜的多晶化辐射的能量束的能量强度提高到完美多晶化的最佳值。