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    • 10. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US06911691B2
    • 2005-06-28
    • US10343393
    • 2002-05-31
    • Hideto TomiieToshio TeranoToshio Kobayashi
    • Hideto TomiieToshio TeranoToshio Kobayashi
    • H01L21/8247G11C16/04H01L21/28H01L27/10H01L27/115H01L29/788H01L29/792
    • H01L21/28282G11C16/0475H01L29/7923
    • To propose a new channel structure suitable for high efficiency source side injection, and provide a non-volatile semiconductor memory device and a charge injection method using the same. The non-volatile memory device includes a first conductivity type semiconductor substrate (SUB), a first conductivity type inversion layer-forming region (CH1), second conductivity type accumulation layer-forming regions (ACLa, ACL2b), second conductivity type regions (S/D1, S/D2), an insulating film (GD0) and a first conductive layer (CL) formed on the inversion layer-forming region (CH1). A charge accumulation film (GD) and a second conductive layer (WL) are stacked on an upper surface and side surface of the first conductive layer (CL), an exposure surface of the inversion layer-forming region (CH1), and an upper surface of the accumulation layer-forming regions (ACLa, ACLb) and the second conductivity type regions (S/D1, S/D2). The second conductive layer (WL) is connected to a word line and second conductivity type regions (S/D1, S/D2) are connected to bit lines (Bla, BLb).
    • 提出一种适用于高效率源侧注入的新型通道结构,并提供一种非易失性半导体存储器件及使用其的电荷注入方法。 非易失性存储器件包括第一导电型半导体衬底(SUB),第一导电类型反型层形成区(CH 1),第二导电型蓄积层形成区(ACLa,ACL2b),第二导电类型 在反转层形成区域(CH 1)上形成的区域(S / D 1,S / D 2),绝缘膜(GD 0)和第一导电层(CL)。 电荷累积膜(GD)和第二导电层(WL)层叠在第一导电层(CL)的上表面和侧表面上,反型层形成区域(CH 1)的曝光表面和 蓄积层形成区域(ACLa,ACLb)和第二导电类型区域(S / D 1,S / D 2)的上表面。 第二导电层(WL)连接到字线,第二导电类型区域(S / D 1,S / D 2)连接到位线(Bla,BLb)。