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1. 发明申请

US20070115609A1 CAPACITIVE PRESSURE SENSOR AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：电容式压力传感器及其制造方法
公开(公告)号：US20070115609A1
公开(公告)日：2007-05-24
申请号：US11558602
申请日：2006-11-10
申请人： Tetsuya Fukuda , Katsuya Kikuiri , Kiyoshi Sato , Yoshinobu Nakamura , Hiroyuki Kobayashi
发明人： Tetsuya Fukuda , Katsuya Kikuiri , Kiyoshi Sato , Yoshinobu Nakamura , Hiroyuki Kobayashi
IPC分类号： H01G7/00
CPC分类号： G01L9/0073
摘要： A capacitive pressure sensor and method of manufacturing the same is provided. The capactive pressure sensor includes a glass substrate that has a pair of surfaces opposite to each other. A recessed portion is provided to form a cavity on one of the pair of principal surfaces. A first protruding portion provided in the recessed portion. A first silicon substrate has a fixed electrode formed on the first protruding portion, and a movable electrode disposed with a predetermined interval between the fixed electrode and the movable electrode.
摘要翻译：提供一种电容式压力传感器及其制造方法。电容式压力传感器包括具有彼此相对的一对表面的玻璃基板。设置凹部以在一对主表面之一上形成空腔。设置在凹部中的第一突出部。第一硅衬底具有形成在第一突出部分上的固定电极和在固定电极和可动电极之间以预定间隔布置的可移动电极。

2. 发明申请

US20100072563A1 SUBSTRATE BONDED MEMS SENSOR 有权
标题翻译：基板结合MEMS传感器
公开(公告)号：US20100072563A1
公开(公告)日：2010-03-25
申请号：US12560645
申请日：2009-09-16
申请人： Kiyoshi Sato , Kiyoshi Kobayashi , Yoshitaka Uto , Katsuya Kikuiri , Kazuyoshi Takahashi , Jun Suzuki , Hideki Gochou , Toru Takahashi , Hisanobu Ohkawa
发明人： Kiyoshi Sato , Kiyoshi Kobayashi , Yoshitaka Uto , Katsuya Kikuiri , Kazuyoshi Takahashi , Jun Suzuki , Hideki Gochou , Toru Takahashi , Hisanobu Ohkawa
IPC分类号： H01L29/84
CPC分类号： B81B7/007 , B81B2207/097
摘要： A MEMS sensor includes a first substrate; a second substrate; a movable electrode portion and a fixed electrode portion which are arranged between the first substrate and the second substrate, wherein: conductive supporting portions of the movable electrode portion and the fixed electrode portion are, respectively, fixedly secured to a surface of the first substrate via a first insulating layer; a second insulating layer, a lead layer buried into the second insulating layer, and connection electrode portions that are electrically connected to the lead layer to be individually connected to the conductive supporting portions are provided on a surface of the second substrate; a metallic connection layer is formed on the surface of one of the respective conductive supporting portions; one of the respective connection electrode portions and the metallic connection layer are bonded together by eutectic bonding or diffusion bonding; and, at least each of the connection electrode portions has a thickness of about 4 μm or smaller.
摘要翻译： MEMS传感器包括第一基板; 第二基板; 布置在所述第一基板和所述第二基板之间的可移动电极部分和固定电极部分，其中：所述可动电极部分和所述固定电极部分的导电支撑部分分别固定地固定到所述第一基板的表面，第一绝缘层; 第二绝缘层，埋入第二绝缘层中的引线层和与导电层电连接以连接到导电支撑部分的连接电极部分设置在第二基板的表面上; 在各个导电支撑部分之一的表面上形成金属连接层; 各个连接电极部分和金属连接层中的一个通过共晶接合或扩散接合结合在一起; 并且至少每个连接电极部分具有约4μm或更小的厚度。

3. 发明授权

US07506548B2 Pressure sensor package structure 失效
标题翻译：压力传感器封装结构
公开(公告)号：US07506548B2
公开(公告)日：2009-03-24
申请号：US11865479
申请日：2007-10-01
申请人： Tetsuya Fukuda , Katsuya Kikuiri , Kiyoshi Sato , Mitsuru Watanabe , Yoshinobu Nakamura
发明人： Tetsuya Fukuda , Katsuya Kikuiri , Kiyoshi Sato , Mitsuru Watanabe , Yoshinobu Nakamura
IPC分类号： G01L7/00
CPC分类号： G01L19/0069 , G01L19/147 , H01L2224/48091 , H01L2924/16195 , H01L2924/00014
摘要： A package is mainly formed of a package body having a storage area for storing a pressure sensor, a capacity type pressure sensor stored in the storage area of the package body, a lid seals the package body in which the pressure sensor is stored, an adhesive agent for fixing the pressure sensor to the package body, and a bonding wire for electrically coupling a bonding pad of the pressure sensor and a conductive portion of the package body. An adhesive area of the package body and the pressure sensor is set to the area other than a projection area of the diaphragm of the pressure sensor on a mount bottom surface. This makes it possible to provide the package for the pressure sensor capable of detecting the pressure with high sensitivity although the gap between the substrate and the diaphragm has the value with the magnitude of several μms.
摘要翻译：封装主要由具有用于存储压力传感器的存储区域的存储区域，存储在封装体的存储区域中的容量型压力传感器，密封保存有压力传感器的封装体的封装体，粘合剂用于将压力传感器固定到封装主体的代理，以及用于将压力传感器的焊盘电耦接到封装体的导电部分的接合线。包装体和压力传感器的粘合区域设置在除了压力传感器的隔膜的投影区域之外的区域在安装底面上。这使得可以提供能够以高灵敏度检测压力的压力传感器的封装，尽管基板和隔膜之间的间隙具有几个数量级的值。

4. 发明申请

US20080054889A1 MAGNETIC DETECTION DEVICE INCLUDING CIRCUIT SWITCHING AND PROCESSING INPUT OF TWO BRIDGE CIRCUITS 有权
标题翻译：包括电路切换和两个桥接电路的处理输入的磁检测装置
公开(公告)号：US20080054889A1
公开(公告)日：2008-03-06
申请号：US11679093
申请日：2007-02-26
申请人： Katsuya KIKUIRI , Kiyoshi Sato
发明人： Katsuya KIKUIRI , Kiyoshi Sato
IPC分类号： G01B7/14
CPC分类号： G01R33/093 , B82Y25/00 , H04M1/0216 , H04M1/0245
摘要： A magnetic detection device of a NS detection type is provided. A magnetic detection device comprising a first series circuit, a second series circuit, and a third series circuit. At least one of a plurality of resistance elements forming the first series circuit includes a first magneto-resistance element using a magneto-resistance effect, of which an electric resistance varies with an external magnetic field of any one direction. At least one of a plurality of resistance elements forming the second series circuit includes a second magneto-resistance element using a magneto-resistance effect, of which an electric resistance varies with an external magnetic field of a direction apposite to the one direction.
摘要翻译：提供了一种NS检测类型的磁检测装置。一种磁检测装置，包括第一串联电路，第二串联电路和第三串联电路。形成第一串联电路的多个电阻元件中的至少一个包括使用磁阻效应的第一磁阻元件，其中电阻随着任何一个方向的外部磁场而变化。形成第二串联电路的多个电阻元件中的至少一个包括使用磁阻效应的第二磁阻元件，其中电阻随着与该一个方向相反的方向的外部磁场而变化。

5. 发明申请

US20070095147A1 CAPACITIVE PRESSURE SENSOR 有权
标题翻译：电容式压力传感器
公开(公告)号：US20070095147A1
公开(公告)日：2007-05-03
申请号：US11553861
申请日：2006-10-27
申请人： Katsuya Kikuiri , Kiyoshi Sato , Tetsuya Fukuda , Yoshinobu Nakamura , Hiroyuki Kobayashi
发明人： Katsuya Kikuiri , Kiyoshi Sato , Tetsuya Fukuda , Yoshinobu Nakamura , Hiroyuki Kobayashi
IPC分类号： G01L9/12
CPC分类号： G01L9/0073
摘要： A capacitive pressure sensor is provided. The capacitive pressure sensor includes a glass substrate that has a pair of surfaces facing each other. A first silicon substrate has a fixed electrode passing through the glass substrate to be exposed at one surface and a projection passing through the glass substrate to be exposed at the one surface. A second silicon substrate is bonded to the one surface of the glass substrate and is disposed to face the fixed electrode so as to form a cavity between the second silicon substrate and the fixed electrode.
摘要翻译：提供电容式压力传感器。电容式压力传感器包括具有彼此面对的一对表面的玻璃基板。第一硅衬底具有穿过玻璃衬底的固定电极，以在一个表面上暴露，并且穿过玻璃衬底的突起在一个表面处露出。第二硅衬底被结合到玻璃衬底的一个表面上并且被设置为面对固定电极，以在第二硅衬底和固定电极之间形成空腔。

6. 发明授权

US08207586B2 Substrate bonded MEMS sensor 有权
标题翻译：基板结合MEMS传感器
公开(公告)号：US08207586B2
公开(公告)日：2012-06-26
申请号：US12560645
申请日：2009-09-16
申请人： Kiyoshi Sato , Kiyoshi Kobayashi , Yoshitaka Uto , Katsuya Kikuiri , Kazuyoshi Takahashi , Jun Suzuki , Hideki Gochou , Toru Takahashi , Hisanobu Ohkawa
发明人： Kiyoshi Sato , Kiyoshi Kobayashi , Yoshitaka Uto , Katsuya Kikuiri , Kazuyoshi Takahashi , Jun Suzuki , Hideki Gochou , Toru Takahashi , Hisanobu Ohkawa
IPC分类号： H01L29/84
CPC分类号： B81B7/007 , B81B2207/097
摘要： A MEMS sensor includes a first substrate; a second substrate; a movable electrode portion and a fixed electrode portion which are arranged between the first substrate and the second substrate, wherein: conductive supporting portions of the movable electrode portion and the fixed electrode portion are, respectively, fixedly secured to a surface of the first substrate via a first insulating layer; a second insulating layer, a lead layer buried into the second insulating layer, and connection electrode portions that are electrically connected to the lead layer to be individually connected to the conductive supporting portions are provided on a surface of the second substrate; a metallic connection layer is formed on the surface of one of the respective conductive supporting portions; one of the respective connection electrode portions and the metallic connection layer are bonded together by eutectic bonding or diffusion bonding; and, at least each of the connection electrode portions has a thickness of about 4 μm or smaller.
摘要翻译： MEMS传感器包括第一基板; 第二基板; 布置在所述第一基板和所述第二基板之间的可移动电极部分和固定电极部分，其中：所述可动电极部分和所述固定电极部分的导电支撑部分分别固定地固定到所述第一基板的表面，第一绝缘层; 第二绝缘层，埋入第二绝缘层中的引线层和与导电层电连接以连接到导电支撑部分的连接电极部分设置在第二基板的表面上; 在各个导电支撑部分之一的表面上形成金属连接层; 各个连接电极部分和金属连接层中的一个通过共晶接合或扩散接合结合在一起; 并且至少每个连接电极部分具有约4μm或更小的厚度。

7. 发明申请

US20100281980A1 PHYSICAL QUANTITY SENSOR 有权
标题翻译：物理量传感器
公开(公告)号：US20100281980A1
公开(公告)日：2010-11-11
申请号：US12841748
申请日：2010-07-22
申请人： Hisayuki Yazawa , Kiyoshi Sato , Katsuya Kikuiri , Toru Takahashi , Hisanobu Ohkawa
发明人： Hisayuki Yazawa , Kiyoshi Sato , Katsuya Kikuiri , Toru Takahashi , Hisanobu Ohkawa
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , B81B3/0078 , B81B2201/0235 , B81B2203/053 , G01P15/0802 , G01P2015/0831
摘要： A physical quantity sensor includes a support substrate, anchor portions fixed to a top surface of the support substrate, a movable portion positioned above the support substrate and supported by the anchor portions with support portions provided therebetween such that the movable portion is movable in a height direction, and detection portions for detecting a displacement of the movable portion. The support portions include beam portions provided between the movable portion and the anchor portions such that spring portions are provided between the beam portions and each of the movable portion and the anchor portions, the beam portions having a rigidity higher than a rigidity of the spring portions. The movable portion translates in the height direction owing to twisting of the spring portions and displacements in the height direction of distal ends of the beam portions, the movable portion being supported at the distal end.
摘要翻译：物理量传感器包括支撑基板，固定到支撑基板的顶表面的锚定部分，位于支撑基板上方并由锚定部分支撑的可移动部分，其中支撑部分设置在支撑基板之间，使得可移动部分能够在高度方向和检测部分，用于检测可动部分的位移。支撑部分包括设置在可动部分和锚固部分之间的梁部分，使得弹簧部分设置在梁部分与可动部分和锚固部分中的每一个之间，梁部分的刚度高于弹簧部分的刚度。可移动部分由于弹簧部分的扭转和梁部分的远端的高度方向上的位移而在高度方向上平移，可移动部分被支撑在远端。

8. 发明授权

US07382599B2 Capacitive pressure sensor 有权
标题翻译：电容式压力传感器
公开(公告)号：US07382599B2
公开(公告)日：2008-06-03
申请号：US11553861
申请日：2006-10-27
申请人： Katsuya Kikuiri , Kiyoshi Sato , Tetsuya Fukuda , Yoshinobu Nakamura , Hiroyuki Kobayashi
发明人： Katsuya Kikuiri , Kiyoshi Sato , Tetsuya Fukuda , Yoshinobu Nakamura , Hiroyuki Kobayashi
IPC分类号： H01G7/00
CPC分类号： G01L9/0073
摘要： A capacitive pressure sensor is provided. The capacitive pressure sensor includes a glass substrate that has a pair of surfaces facing each other. A first silicon substrate has a fixed electrode passing through the glass substrate to be exposed at one surface and a projection passing through the glass substrate to be exposed at the one surface. A second silicon substrate is bonded to the one surface of the glass substrate and is disposed to face the fixed electrode so as to form a cavity between the second silicon substrate and the fixed electrode.
摘要翻译：提供电容式压力传感器。电容式压力传感器包括具有彼此面对的一对表面的玻璃基板。第一硅衬底具有穿过玻璃衬底的固定电极，以在一个表面上暴露，并且穿过玻璃衬底的突起在一个表面处露出。第二硅衬底被结合到玻璃衬底的一个表面上并且被设置为面对固定电极，以在第二硅衬底和固定电极之间形成空腔。

9. 发明申请

US20080078251A1 PRESSURE SENSOR PACKAGE STRUCTURE 失效
标题翻译：压力传感器包装结构
公开(公告)号：US20080078251A1
公开(公告)日：2008-04-03
申请号：US11865479
申请日：2007-10-01
申请人： Tetsuya Fukuda , Katsuya Kikuiri , Kiyoshi Sato , Mitsuru Watanabe , Yoshinobu Nakamura
发明人： Tetsuya Fukuda , Katsuya Kikuiri , Kiyoshi Sato , Mitsuru Watanabe , Yoshinobu Nakamura
IPC分类号： G01L7/00
CPC分类号： G01L19/0069 , G01L19/147 , H01L2224/48091 , H01L2924/16195 , H01L2924/00014
摘要： A package is mainly formed of a package body having a storage area for storing a pressure sensor, a capacity type pressure sensor stored in the storage area of the package body, a lid seals the package body in which the pressure sensor is stored, an adhesive agent for fixing the pressure sensor to the package body, and a bonding wire for electrically coupling a bonding pad of the pressure sensor and a conductive portion of the package body. An adhesive area of the package body and the pressure sensor is set to the area other than a projection area of the diaphragm of the pressure sensor on a mount bottom surface. This makes it possible to provide the package for the pressure sensor capable of detecting the pressure with high sensitivity although the gap between the substrate and the diaphragm has the value with the magnitude of several μms.
摘要翻译：封装主要由具有用于存储压力传感器的存储区域的存储区域，存储在封装体的存储区域中的容量型压力传感器，密封保存有压力传感器的封装体的封装体，粘合剂用于将压力传感器固定到封装主体的代理，以及用于将压力传感器的焊盘电耦接到封装体的导电部分的接合线。包装体和压力传感器的粘合区域设置在除了压力传感器的隔膜的投影区域之外的区域在安装底面上。这使得可以提供能够以高灵敏度检测压力的压力传感器的封装，尽管基板和隔膜之间的间隙具有几个数量级的值。

10. 发明授权

US07345867B2 Capacitive pressure sensor and method of manufacturing the same 有权
标题翻译：电容式压力传感器及其制造方法
公开(公告)号：US07345867B2
公开(公告)日：2008-03-18
申请号：US11558602
申请日：2006-11-10
申请人： Tetsuya Fukuda , Katsuya Kikuiri , Kiyoshi Sato , Yoshinobu Nakamura , Hiroyuki Kobayashi
发明人： Tetsuya Fukuda , Katsuya Kikuiri , Kiyoshi Sato , Yoshinobu Nakamura , Hiroyuki Kobayashi
IPC分类号： H01G7/00 , G01I9/12
CPC分类号： G01L9/0073
摘要： A capacitive pressure sensor and method of manufacturing the same is provided. The capactive pressure sensor includes a glass substrate that has a pair of surfaces opposite to each other. A recessed portion is provided to form a cavity on one of the pair of principal surfaces. A first protruding portion provided in the recessed portion. A first silicon substrate has a fixed electrode formed on the first protruding portion, and a movable electrode disposed with a predetermined interval between the fixed electrode and the movable electrode.
摘要翻译：提供一种电容式压力传感器及其制造方法。电容式压力传感器包括具有彼此相对的一对表面的玻璃基板。设置凹部以在一对主表面之一上形成空腔。设置在凹部中的第一突出部。第一硅衬底具有形成在第一突出部分上的固定电极和在固定电极和可动电极之间以预定间隔布置的可移动电极。

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