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1. 发明授权

US08459116B2 Physical quantity sensor 有权
标题翻译：物理量传感器
公开(公告)号：US08459116B2
公开(公告)日：2013-06-11
申请号：US13296991
申请日：2011-11-15
申请人： Akira Miyatake , Toru Takahashi , Hisanobu Ohkawa , Katsuya Kikuiri , Hisayuki Yazawa , Toshihiro Kobayashi , Yoshitaka Uto
发明人： Akira Miyatake , Toru Takahashi , Hisanobu Ohkawa , Katsuya Kikuiri , Hisayuki Yazawa , Toshihiro Kobayashi , Yoshitaka Uto
IPC分类号： G01P15/125
CPC分类号： G01P15/08 , B81B3/001 , B81B3/0021 , G01P15/0802 , G01P15/125 , G01P2015/0837 , G01P2015/0871
摘要： A physical quantity sensor includes an anchor portion, a movable portion displaceable in a height direction, a supporting portion rotatably connected to the anchor portion and the movable portion, and a detection portion. The supporting portion includes a first connection arm connecting the anchor portion and the movable portion to each other and a leg portion extending from the anchor portion in a direction opposite to the first connection arm, the leg portion being displaced in a direction opposite to a displacement direction of the movable portion when the supporting portion rotates. A stopper surface is disposed at a position to which a distal end portion of the leg portion is contactable when the leg portion is displaced in the direction opposite to the displacement direction of the movable portion. Displacement of the movable portion is restricted when the distal end portion of the leg portion contacts the stopper surface.
摘要翻译：物理量传感器包括锚固部分，在高度方向上可移动的可移动部分，可转动地连接到锚定部分和可移动部分的支撑部分，以及检测部分。所述支撑部包括将所述锚固部和所述可动部彼此连接的第一连接臂和从所述锚定部沿与所述第一连接臂相反的方向延伸的脚部，所述腿部沿与所述第一连接臂相反的方向移位支撑部旋转时的可动部的方向。止动器表面设置在腿部在与可动部的移动方向相反的方向移位的状态下，腿部的前端部可接触的位置。当腿部的远端部分接触止动表面时，可动部分的位移受到限制。

2. 发明申请

US20120104520A1 MEMS SENSOR 审中-公开
标题翻译： MEMS传感器
公开(公告)号：US20120104520A1
公开(公告)日：2012-05-03
申请号：US13347483
申请日：2012-01-10
申请人： Yoshitaka UTO , Kiyoshi KOBAYASHI , Toshihiro KOBAYASHI , Toru TAKAHASHI , Jun SUZUKI , Katsuya KIKUIRI
发明人： Yoshitaka UTO , Kiyoshi KOBAYASHI , Toshihiro KOBAYASHI , Toru TAKAHASHI , Jun SUZUKI , Katsuya KIKUIRI
IPC分类号： H01L29/84
CPC分类号： G01P15/125 , B81B3/0051 , B81B3/0056 , B81B2201/0292 , G01C19/56 , G01C25/005 , G01P15/0802 , G01P2015/0837 , G01P2015/0845 , G01P2015/0877
摘要： An MEMS sensor includes: a functional layer having a sensor section; a wiring substrate disposed facing the functional layer and having a conduction pathway for the sensor section; a first metal layer provided on the surface of the sensor section which faces the wiring substrate; and a second metal layer provided on the surface of the wiring substrate which faces the sensor section, wherein the first and second metal layers are joined to each other, a space is formed between a movable portion of the sensor section and the wiring substrate, and a stopper which is composed of a third metal layer being the same film as the first metal layer formed on the functional layer side and a contact portion formed on the wiring substrate side which come into contact with each other is formed between the functional layer and the wiring substrate.
摘要翻译： MEMS传感器包括：具有传感器部分的功能层; 配置在所述功能层上的配线基板，具有所述传感器部的导通路径; 设置在传感器部分的面对布线基板的表面上的第一金属层; 以及设置在所述布线基板的面对所述传感器部的表面的第二金属层，其中，所述第一和第二金属层彼此接合，在所述传感器部的可动部和所述布线基板之间形成空间，以及由功能层和第一金属层构成的第三金属层与形成在功能层侧的第一金属层相同的第三金属层和形成在布线基板一侧的接触部分形成的塞子形成在功能层和第二金属层之间，布线基板。

3. 发明申请

US20120055249A1 PHYSICAL QUANTITY SENSOR 有权
标题翻译：物理量传感器
公开(公告)号：US20120055249A1
公开(公告)日：2012-03-08
申请号：US13296991
申请日：2011-11-15
申请人： Akira MIYATAKE , Toru TAKAHASHI , Hisanobu OHKAWA , Katsuya KIKUIRI , Hisayuki YAZAWA , Toshihiro KOBAYASHI , Yoshitaka UTO
发明人： Akira MIYATAKE , Toru TAKAHASHI , Hisanobu OHKAWA , Katsuya KIKUIRI , Hisayuki YAZAWA , Toshihiro KOBAYASHI , Yoshitaka UTO
IPC分类号： G01P15/125
CPC分类号： G01P15/08 , B81B3/001 , B81B3/0021 , G01P15/0802 , G01P15/125 , G01P2015/0837 , G01P2015/0871
摘要： A physical quantity sensor includes an anchor portion, a movable portion displaceable in a height direction, a supporting portion rotatably connected to the anchor portion and the movable portion, and a detection portion. The supporting portion includes a first connection arm connecting the anchor portion and the movable portion to each other and a leg portion extending from the anchor portion in a direction opposite to the first connection arm, the leg portion being displaced in a direction opposite to a displacement direction of the movable portion when the supporting portion rotates. A stopper surface is disposed at a position to which a distal end portion of the leg portion is contactable when the leg portion is displaced in the direction opposite to the displacement direction of the movable portion. Displacement of the movable portion is restricted when the distal end portion of the leg portion contacts the stopper surface.
摘要翻译：物理量传感器包括锚固部分，在高度方向上可移动的可移动部分，可转动地连接到锚定部分和可移动部分的支撑部分，以及检测部分。所述支撑部包括将所述锚固部和所述可动部彼此连接的第一连接臂和从所述锚定部沿与所述第一连接臂相反的方向延伸的脚部，所述腿部沿与所述第一连接臂相反的方向移位支撑部旋转时的可动部的方向。止动器表面设置在腿部在与可动部的移动方向相反的方向移位的状态下，腿部的前端部可接触的位置。当腿部的远端部分接触止动表面时，可动部分的位移受到限制。

4. 发明申请

US20100072563A1 SUBSTRATE BONDED MEMS SENSOR 有权
标题翻译：基板结合MEMS传感器
公开(公告)号：US20100072563A1
公开(公告)日：2010-03-25
申请号：US12560645
申请日：2009-09-16
申请人： Kiyoshi Sato , Kiyoshi Kobayashi , Yoshitaka Uto , Katsuya Kikuiri , Kazuyoshi Takahashi , Jun Suzuki , Hideki Gochou , Toru Takahashi , Hisanobu Ohkawa
发明人： Kiyoshi Sato , Kiyoshi Kobayashi , Yoshitaka Uto , Katsuya Kikuiri , Kazuyoshi Takahashi , Jun Suzuki , Hideki Gochou , Toru Takahashi , Hisanobu Ohkawa
IPC分类号： H01L29/84
CPC分类号： B81B7/007 , B81B2207/097
摘要： A MEMS sensor includes a first substrate; a second substrate; a movable electrode portion and a fixed electrode portion which are arranged between the first substrate and the second substrate, wherein: conductive supporting portions of the movable electrode portion and the fixed electrode portion are, respectively, fixedly secured to a surface of the first substrate via a first insulating layer; a second insulating layer, a lead layer buried into the second insulating layer, and connection electrode portions that are electrically connected to the lead layer to be individually connected to the conductive supporting portions are provided on a surface of the second substrate; a metallic connection layer is formed on the surface of one of the respective conductive supporting portions; one of the respective connection electrode portions and the metallic connection layer are bonded together by eutectic bonding or diffusion bonding; and, at least each of the connection electrode portions has a thickness of about 4 μm or smaller.
摘要翻译： MEMS传感器包括第一基板; 第二基板; 布置在所述第一基板和所述第二基板之间的可移动电极部分和固定电极部分，其中：所述可动电极部分和所述固定电极部分的导电支撑部分分别固定地固定到所述第一基板的表面，第一绝缘层; 第二绝缘层，埋入第二绝缘层中的引线层和与导电层电连接以连接到导电支撑部分的连接电极部分设置在第二基板的表面上; 在各个导电支撑部分之一的表面上形成金属连接层; 各个连接电极部分和金属连接层中的一个通过共晶接合或扩散接合结合在一起; 并且至少每个连接电极部分具有约4μm或更小的厚度。

5. 发明授权

US08207586B2 Substrate bonded MEMS sensor 有权
标题翻译：基板结合MEMS传感器
公开(公告)号：US08207586B2
公开(公告)日：2012-06-26
申请号：US12560645
申请日：2009-09-16
申请人： Kiyoshi Sato , Kiyoshi Kobayashi , Yoshitaka Uto , Katsuya Kikuiri , Kazuyoshi Takahashi , Jun Suzuki , Hideki Gochou , Toru Takahashi , Hisanobu Ohkawa
发明人： Kiyoshi Sato , Kiyoshi Kobayashi , Yoshitaka Uto , Katsuya Kikuiri , Kazuyoshi Takahashi , Jun Suzuki , Hideki Gochou , Toru Takahashi , Hisanobu Ohkawa
IPC分类号： H01L29/84
CPC分类号： B81B7/007 , B81B2207/097
摘要： A MEMS sensor includes a first substrate; a second substrate; a movable electrode portion and a fixed electrode portion which are arranged between the first substrate and the second substrate, wherein: conductive supporting portions of the movable electrode portion and the fixed electrode portion are, respectively, fixedly secured to a surface of the first substrate via a first insulating layer; a second insulating layer, a lead layer buried into the second insulating layer, and connection electrode portions that are electrically connected to the lead layer to be individually connected to the conductive supporting portions are provided on a surface of the second substrate; a metallic connection layer is formed on the surface of one of the respective conductive supporting portions; one of the respective connection electrode portions and the metallic connection layer are bonded together by eutectic bonding or diffusion bonding; and, at least each of the connection electrode portions has a thickness of about 4 μm or smaller.
摘要翻译： MEMS传感器包括第一基板; 第二基板; 布置在所述第一基板和所述第二基板之间的可移动电极部分和固定电极部分，其中：所述可动电极部分和所述固定电极部分的导电支撑部分分别固定地固定到所述第一基板的表面，第一绝缘层; 第二绝缘层，埋入第二绝缘层中的引线层和与导电层电连接以连接到导电支撑部分的连接电极部分设置在第二基板的表面上; 在各个导电支撑部分之一的表面上形成金属连接层; 各个连接电极部分和金属连接层中的一个通过共晶接合或扩散接合结合在一起; 并且至少每个连接电极部分具有约4μm或更小的厚度。

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