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1. 发明授权

US5158645A Method of external circuitization of a circuit panel 失效
标题翻译：电路板外部电路化方法
公开(公告)号：US5158645A
公开(公告)日：1992-10-27
申请号：US754106
申请日：1991-09-03
申请人： Kathleen L. Covert , Charles C. Emmons , Elizabeth Foster , Richard W. Malek , Voya R. Markovich , Stephen L. Tisdale , Charyl L. Tytran
发明人： Kathleen L. Covert , Charles C. Emmons , Elizabeth Foster , Richard W. Malek , Voya R. Markovich , Stephen L. Tisdale , Charyl L. Tytran
IPC分类号： H05K3/00 , H05K3/10 , H05K3/18 , H05K3/38 , H05K3/42
CPC分类号： H05K3/427 , H05K3/0047 , H05K3/426 , H05K2203/0796 , H05K2203/1388 , H05K2203/1407 , H05K3/0055 , H05K3/108 , H05K3/181 , H05K3/184 , H05K3/389
摘要： A strippable thin film of Cu is applied above the surface features of a microelectronic circuit package to protect the features during mechanical working, for example drilling, the panel. The thin film is then stripped off of the panel. The thin film may be stripped off of the panel either prior to or after circuitization.
摘要翻译：在微电子电路封装的表面特征之上施加Cu的可剥离薄膜，以在机械加工（例如钻孔，面板）中保护特征。然后将薄膜从面板剥离。在电路之前或之后，薄膜可以从面板剥离。

2. 发明授权

US5374454A Method for conditioning halogenated polymeric materials and structures fabricated therewith 失效
标题翻译：用于调节卤化聚合物材料和用其制造的结构的方法
公开(公告)号：US5374454A
公开(公告)日：1994-12-20
申请号：US13652
申请日：1993-02-04
申请人： Harry R. Bickford , Peter J. Duke , Elizabeth Foster , Martin J. Goldberg , Voya R. Markovich , Linda C. Matthew , Donald G. McBride , Terrence R. O'Toole , Stephen L. Tisdale , Alfred Viehbeck
发明人： Harry R. Bickford , Peter J. Duke , Elizabeth Foster , Martin J. Goldberg , Voya R. Markovich , Linda C. Matthew , Donald G. McBride , Terrence R. O'Toole , Stephen L. Tisdale , Alfred Viehbeck
IPC分类号： C08J3/24 , C23C18/20 , C23C18/28 , C25D5/56 , H05K1/03 , H05K3/18 , H05K3/38 , H05K3/42 , B05D1/00
CPC分类号： H05K3/422 , C23C18/208 , C23C18/2093 , C23C18/30 , C25D5/56 , H05K3/381 , H05K1/034 , H05K3/181 , Y10S428/901 , Y10T428/24273 , Y10T428/24322 , Y10T428/24339 , Y10T428/24802 , Y10T428/3154 , Y10T428/31544 , Y10T428/31678
摘要： A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical conductivity therein. Also, new structures containing a free standing halogenated polymeric-containing layer and electrical conductive pattern thereon are provided.
摘要翻译：将卤化聚合物材料暴露于还原剂和/或电解质和施加的电压以使得能够被金属化并被蚀刻的暴露部分。暴露部分也可以被掺杂从而在其中诱导电导率。此外，提供了含有独立卤代聚合物层和在其上的导电图案的新结构。

3. 发明授权

US5556899A Fluorinated carbon polymer composites 失效
标题翻译：氟化碳聚合物复合材料
公开(公告)号：US5556899A
公开(公告)日：1996-09-17
申请号：US346766
申请日：1994-11-30
申请人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
IPC分类号： C08J7/00 , C08K3/04 , C08K9/02 , H01B3/30 , H01L21/312 , H05K1/03 , H05K3/10 , C08J5/18
CPC分类号： H05K1/0373 , C08K3/04 , C08K9/02 , H05K1/0346 , H05K2201/0154 , H05K2201/0239 , H05K2201/0323 , H05K2201/068 , H05K3/105 , Y10T428/31544
摘要： Disclosed is a process of effecting a change in the dielectric constant and coefficient of thermal expansion of a polyimide material, by forming a composite based on a dispersion of 2-60 wt. % of fluorinated particulate carbon material and a polyimide or polyimide precursor, and heating the dispersion to about 400.degree. C. at 65.degree.-200.degree. C./second.
摘要翻译：公开了通过基于2-60重量份的分散体形成复合材料来实现聚酰亚胺材料的介电常数和热膨胀系数的变化的方法。％的氟化颗粒碳材料和聚酰亚胺或聚酰亚胺前体，并将分散体在65℃-200℃/秒加热至约400℃。

4. 发明授权

US5571852A Fluorinated carbon polymer composites 失效
公开(公告)号：US5571852A
公开(公告)日：1996-11-05
申请号：US472120
申请日：1995-06-07
申请人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
IPC分类号： C08J7/00 , C08K3/04 , C08K9/02 , H01B3/30 , H01L21/312 , H05K1/03 , H05K3/10 , C08J3/28
CPC分类号： H05K1/0373 , C08K3/04 , C08K9/02 , H05K1/0346 , H05K2201/0154 , H05K2201/0239 , H05K2201/0323 , H05K2201/068 , H05K3/105 , Y10T428/31544
摘要： Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.The composite can be made conductive by irradiating it with an UV excimer laser.

5. 发明授权

US5591285A Fluorinated carbon polymer composites 失效
标题翻译：氟化碳聚合物复合材料
公开(公告)号：US5591285A
公开(公告)日：1997-01-07
申请号：US475670
申请日：1995-07-24
申请人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
IPC分类号： C08J7/00 , C08K3/04 , C08K9/02 , H01B3/30 , H01L21/312 , H05K1/03 , H05K3/10 , B32B31/28 , B32B27/16
CPC分类号： H05K1/0373 , C08K3/04 , C08K9/02 , H05K1/0346 , H05K2201/0154 , H05K2201/0239 , H05K2201/0323 , H05K2201/068 , H05K3/105 , Y10T428/31544
摘要： Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.The composite can be made conductive by irradiating it with an UV excimer laser.
摘要翻译：公开了包含分散在聚合物中的氟化颗粒碳的复合物的结构，氟化碳的存在量足以降低组合物的介电常数，该结构还包括电导体图案。可以通过用UV准分子激光器照射该复合材料来导电。

6. 发明授权

US5397863A Fluorinated carbon polymer composites 失效
标题翻译：氟化碳聚合物复合材料
公开(公告)号：US5397863A
公开(公告)日：1995-03-14
申请号：US929313
申请日：1992-08-13
申请人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
IPC分类号： C08J7/00 , C08K3/04 , C08K9/02 , H01B3/30 , H01L21/312 , H05K1/03 , H05K3/10
CPC分类号： H05K1/0373 , C08K3/04 , C08K9/02 , H05K1/0346 , H05K2201/0154 , H05K2201/0239 , H05K2201/0323 , H05K2201/068 , H05K3/105 , Y10T428/31544
摘要： Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns. The composite can be made conductive by irradiating it with an UV excimer laser.
摘要翻译：公开了包含分散在聚合物中的氟化颗粒碳的复合物的结构，氟化碳的存在量足以降低组合物的介电常数，该结构还包括电导体图案。可以通过用UV准分子激光器照射该复合材料来导电。

7. 发明授权

US4554182A Method for conditioning a surface of a dielectric substrate for electroless plating 失效
标题翻译：用于调理用于无电镀的电介质基板的表面的方法
公开(公告)号：US4554182A
公开(公告)日：1985-11-19
申请号：US696879
申请日：1985-01-31
申请人： James R. Bupp , Gary K. Lemon , Voya Markovich , Carlos J. Sambucetti , Stephen L. Tisdale , Donna J. Trevitt
发明人： James R. Bupp , Gary K. Lemon , Voya Markovich , Carlos J. Sambucetti , Stephen L. Tisdale , Donna J. Trevitt
IPC分类号： C23C18/28 , H05K3/38 , C23C18/24
CPC分类号： H05K3/381 , C23C18/28
摘要： Method for electroless plating metals, such as copper, onto non-conductive substrate surfaces. The method comprises bringing the surfaces into contact with an aqueous composition containing H.sub.2 SO.sub.4 and a multifunctional cationic copolymer containing at least two available cationic moieties and then activating the surfaces by treating them with a colloidal solution containing palladium chloride, stannous chloride and HCl.The inventive method is particularly useful in processes for producing metal circuits on substrates of glass, thermoplastics and thermosetting resins, such as epoxy cards and boards. The method is also applied in reworking substrates having already undergone copper plating and having been rejected due to failures.
摘要翻译：无电镀金属（如铜）在非导电基材表面上的方法。该方法包括使表面与含有H 2 SO 4的水性组合物和含有至少两种可得到的阳离子部分的多官能阳离子共聚物接触，然后通过用含氯化钯，氯化亚锡和HCl的胶体溶液处理表面来活化表面。本发明的方法特别适用于在玻璃，热塑性塑料和热固性树脂（例如环氧树脂卡和板）的基底上生产金属电路的方法。该方法也适用于已经经过镀铜并由于故障而被拒绝的基板。

8. 发明授权

US5318803A Conditioning of a substrate for electroless plating thereon 失效
标题翻译：调理用于无电镀的基板
公开(公告)号：US5318803A
公开(公告)日：1994-06-07
申请号：US614669
申请日：1990-11-13
申请人： Harry R. Bickford , Dennis A. Canfield , Arthur E. Graham , Stephen L. Tisdale , Alfred Viehbeck
发明人： Harry R. Bickford , Dennis A. Canfield , Arthur E. Graham , Stephen L. Tisdale , Alfred Viehbeck
IPC分类号： C23C18/52 , C23C18/28 , C23C18/31 , H05K3/18 , B05D1/00
CPC分类号： H05K3/181 , C23C18/28
摘要： A dielectric substrate is conditioned for subsequent electroless plating thereon by contacting with a catalytic metal salt and then with a reducing agent and with an electroless metal plating bath followed by contacting with a second catalytic metal salt. In addition, a dielectric substrate is conditioned for electroless plating thereon by obtaining a substrate of a dielectric material that contains metal particles therein and contacting with a catalytic metal salt.
摘要翻译：通过与催化金属盐接触，然后与还原剂和无电金属电镀浴接触，然后与第二催化金属盐接触，对电介质基板进行后续的化学镀处理。此外，通过获得在其中含有金属颗粒并与催化金属盐接触的电介质材料的基底，调节电介质基板上的化学镀。

9. 发明授权

US06510392B2 In-situ test for embedded passives 失效
公开(公告)号：US06510392B2
公开(公告)日：2003-01-21
申请号：US09752659
申请日：2000-12-28
申请人： Yutaka Doi , Stephen L. Tisdale
发明人： Yutaka Doi , Stephen L. Tisdale
IPC分类号： G01R2700
CPC分类号： G01R31/27
摘要： Methods and apparatus for improved impedance measurements are which allow for shorter delays during recalibration and which eliminate the need to physically disconnect and reconnect test leads after initial calibration has been completed. In particular, an adjustment factor is calculated based on impedances measured during initial calibration and is used to adjust future impedance measurements. Moreover, a plurality of loads having pre-measured impedances are switchably connected to the meter such that re-calibration using said loads may be accomplished without the physical connection or disconnection of test leads. The plurality of loads are preferably incorporated into a test board which also comprises additional test leads and a switching mechanism to alternately connect the various loads and test leads to the meter.

10. 发明授权

US5725668A Expandable fluid treatment device for tublar surface treatments 失效
标题翻译：可膨胀流体处理装置，用于表面处理
公开(公告)号：US5725668A
公开(公告)日：1998-03-10
申请号：US770067
申请日：1996-12-19
申请人： Elizabeth F. Foster , Jeffrey C. Hedrick , Stephen L. Tisdale , Alfred Viehbeck
发明人： Elizabeth F. Foster , Jeffrey C. Hedrick , Stephen L. Tisdale , Alfred Viehbeck
IPC分类号： B05B13/02 , B05B15/04 , B08B3/02 , B05C1/04
CPC分类号： B08B3/022 , B05B13/0207 , B05B15/0406 , Y02P70/36 , Y10S118/11
摘要： An apparatus for applying a fluid to an outer surface of an elongated work piece having a longitudinal axis and a cross sectional shape, perpendicular to the longitudinal axis. The apparatus has a head member having an interior wall cross sectional shape adapted for receiving the cross sectional shape of the elongated work piece. The interior cross sectional shape defines an interior wall of the head member. The head member has an input end and an output end. The interior wall has means for applying the fluid to a surface of said elongated member. The head member has preferable a first part and a second part which are joined by an expandable member. The means for applying said fluid comprises a plurality of jets for directing said fluid on said surface and a plurality of output parts for recovering said fluid for applying a fluid to an outer surface, said elongated work piece having a longitudinal axis and a cross sectional shape, perpendicular to said longitudinal axis, comprising: a head member having an interior wall cross sectional shape adapted for receiving said cross sectional shape of said elongated work piece; said interior cross sectional shape defining an interior wall of said head member; said head member has an input end and an output end; said interior wall has means for applying said fluid to a surface of said elongated member.
摘要翻译：一种用于将流体施加到具有垂直于纵向轴线的纵向轴线和横截面形状的细长工件的外表面的装置。该装置具有头部构件，其具有适于接收细长工件的横截面形状的内壁横截面形状。内部横截面形状限定了头部构件的内壁。头部构件具有输入端和输出端。内壁具有将流体施加到所述细长构件的表面的装置。头部构件具有优选的第一部分和第二部分，其通过可扩张构件接合。用于施加所述流体的装置包括用于将所述流体引导在所述表面上的多个喷嘴和用于回收用于将流体施加到外表面的所述流体的多个输出部分，所述细长工件具有纵向轴线和横截面形状垂直于所述纵向轴线，包括：头部构件，其具有适于接收所述细长工件的所述横截面形状的内壁横截面形状; 所述内部横截面形状限定所述头部构件的内壁; 所述头部构件具有输入端和输出端; 所述内壁具有将所述流体施加到所述细长构件的表面的装置。

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