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    • 4. 发明申请
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINED WITH SUCH A METHOD
    • 制造半导体器件的方法和采用这种方法获得的半导体器件
    • WO2006024979A1
    • 2006-03-09
    • PCT/IB2005/052660
    • 2005-08-10
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.SURDEANU, RaduHIJZEN, ErwinIN 'T ZANDT, Michael, A., A.HUETING, Raymond, J., E.
    • SURDEANU, RaduHIJZEN, ErwinIN 'T ZANDT, Michael, A., A.HUETING, Raymond, J., E.
    • H01L21/336H01L29/786
    • H01L29/66772H01L29/78648
    • The-invention relates to a method of manufacturing a semiconductor device (1.0) with a dual gate field effect transistor, in which method a semiconductor body (1) of a semiconductor material is provided at a surface thereof with a source region (2) and a drain region (3) of a first conductivity type and with a channel region (4) of a second conductivity type opposite to the first conductivity type between the source region (2) and the drain region (3) and with a first gate region (5) separated from the surface of the semiconductor body by a first gate dielectric (6) above the channel region (4) and with a second gate region (7) situated opposite to the first gate region (5) and formed within a recess (20) in an opposite surface of the semiconductor body (1) so as to be separated from the channel region (4) by a second gate dielectric (8), wherein the recess (20) is formed by means of a local change of the doping (9) of the channel region (4) and by performing an etching step starting from the opposite surface of the semiconductor body (1).
    • 本发明涉及一种制造具有双栅场效应晶体管的半导体器件(1.0)的方法,其中半导体材料的半导体本体(1)在其表面处设置有源区(2)和 具有第一导电类型的漏极区域(3)和在源极区域(2)和漏极区域(3)之间具有与第一导电类型相反的第二导电类型的沟道区域(4)和第一栅极区域 (5)通过沟道区域(4)上方的第一栅极电介质(6)和与第一栅极区域(5)相对的第二栅极区域(7)与半导体本体的表面分离并形成在凹槽内 (20)在半导体本体(1)的相对表面上,以便通过第二栅极电介质(8)与沟道区(4)分离,其中凹部(20)通过 通道区域(4)的掺杂(9),并且通过执行从f开始的蚀刻步骤 离开半导体本体(1)的相对表面。
    • 9. 发明申请
    • HETEROJUNCTION SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SUCH DEVICE
    • 异质半导体器件及其制造方法
    • WO2003044861A1
    • 2003-05-30
    • PCT/IB2002/004852
    • 2002-11-21
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.HUETING, Raymond, J., E.SLOTBOOM, Jan, W.VAN DEN OEVER, Leon, C., M.
    • HUETING, Raymond, J., E.SLOTBOOM, Jan, W.VAN DEN OEVER, Leon, C., M.
    • H01L27/07
    • H01L29/47H01L29/41708H01L29/42304H01L29/7378
    • The invention relates to a semiconductor device with a heterojunction bipolar, in particular npn, transistor with an emitter region (1), a base region (2), and a collector region (3), which are provided with respectively a first, a second, and a third connection conductor (4, 5, 6), while the bandgap of the base region (2) is lower than that of the collector region (3) or of the emitter region (1), for example owing to the use of a silicon-germanium alloy instead of pure silicon. Such a device is very fast, but its transistor shows a relatively low BVceo. In a device according to the invention, the emitter region (1) or the base region (2) comprises a sub-region (1B, 2B) with a reduced doping concentration, which sub-region (1B, 2B) is provided with a further connection conductor (4B, 5B) which forms a Schottky junction with the sub-region (1B, 2B). Such a device results in a transistor with a particularly high cut-off frequency fT but with no or hardly any reduction of the BVceo. In a preferred embodiment, the emitter region (1) and its sub-region (1B), or the base region (2) and its sub-region (2B) both border the surface of the semiconductor body (10) and the further connection conductor (4B, 5B) forms part of the first or the second connection conductor (4, 5), as applicable. The invention also comprises a method of manufacturing a device according to the invention.
    • 本发明涉及具有异质结双极的半导体器件,特别是具有发射极区域(1),基极区域(2)和集电极区域(3)的npn晶体管,它们分别设置有第一,第二 和第三连接导体(4,5,6),而基极区域(2)的带隙比集电极区域(3)或发射极区域(1)的带隙低,例如由于使用 的硅 - 锗合金代替纯硅。 这样的器件非常快,但其晶体管显示出相对较低的BVceo。 在根据本发明的装置中,发射极区域(1)或基极区域(2)包括具有降低的掺杂浓度的子区域(1B,2B),该子区域(1B,2B)设置有 与所述子区域(1B,2B)形成肖特基结的另外的连接导体(4B,5B)。 这种器件导致具有特别高的截止频率fT的晶体管,但是没有或几乎不减少BVceo。 在优选实施例中,发射极区域(1)及其子区域(1B)或基极区域(2)及其子区域(2B)都与半导体本体(10)的表面相接触,并且另外的连接 导体(4B,5B)形成第一或第二连接导体(4,5)的一部分。 本发明还包括一种制造根据本发明的装置的方法。