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    • 2. 发明申请
    • PHASE CHANGE MEMORY DEVICE
    • 相变存储器件
    • WO2004090984A1
    • 2004-10-21
    • PCT/JP2003/004275
    • 2003-04-03
    • KABUSHIKI KAISHA TOSHIBATODA, Haruki
    • TODA, Haruki
    • H01L27/10
    • G11C13/0004G11C5/02G11C7/18G11C13/0007G11C2211/4013G11C2213/31G11C2213/71G11C2213/72H01L27/2409H01L27/2481H01L45/06H01L45/1233
    • A phase change memory device has a semiconductor substrate; a plurality of cell arrays stacked above the semiconductor substrate, each cell array having memory cells arranged in a matrix manner for storing resistance values as data that are determined by phase change of the memory cells, bit lines each commonly connecting one ends of plural memory cells arranged along a first direction of the matrix and word lines each commonly connecting the other ends of plural memory cells arranged along a second direction of the matrix; a read/write circuit formed on the semiconductor substrate as underlying the cell arrays for reading and writing data of the cell arrays; first and second vertical wirings disposed outside of first and second boundaries that define a cell layout region of the cell arrays in the first direction to connect the bit lines of the respective cell arrays to the read/write circuit; and third vertical wirings disposed outside of one of third and fourth boundaries that define the cell layout region in the second direction to connect the word lines of the respective cell arrays to the read/write circuit.
    • 相变存储器件具有半导体衬底; 多个单元阵列,堆叠在半导体衬底之上,每个单元阵列具有以矩阵方式布置的存储单元,用于存储电阻值,作为通过存储器单元的相变确定的数据,各通常连接多个存储单元的一端的位线 沿着矩阵的第一方向布置,每个字线通常连接沿矩阵的第二方向布置的多个存储单元的另一端; 在半导体衬底上形成的用于读取和写入单元阵列数据的单元阵列的读/写电路; 布置在第一和第二边界之外的第一和第二垂直布线,其限定第一方向上的单元阵列的单元布局区域,以将各单元阵列的位线连接到读/写电路; 以及第三垂直布线,其布置在第三和第四边界之一之外,其限定第二方向上的单元布局区域,以将各单元阵列的字线连接到读/写电路。
    • 6. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • WO2012160863A1
    • 2012-11-29
    • PCT/JP2012/056788
    • 2012-03-09
    • KABUSHIKI KAISHA TOSHIBADEGUCHI, JunTODA, Haruki
    • DEGUCHI, JunTODA, Haruki
    • G11C13/00
    • G11C13/0069G11C13/0002G11C13/0007G11C2013/0073G11C2013/0085G11C2013/0088G11C2013/009G11C2213/71G11C2213/77
    • A semiconductor memory device comprises a memory cell array including plural memory cells provided at the intersections of plural first lines and plural second lines; and a write circuit. The write circuit, on execution of a write operation, executes a first step of applying a voltage across the first and second lines connected to a data-write-targeted, selected memory cell, and a different voltage across the first and second lines connected to a data-write-untargeted, unselected memory cell of the plural memory cells and, after execution of the first step, executes a second step of applying a voltage, required for data write, across the first and second lines connected to the selected memory cell, and bringing at least one of the first and second lines connected to the unselected memory cell into the floating state.
    • 半导体存储器件包括存储单元阵列,该存储单元阵列包括设置在多个第一线和多条第二线的交点处的多个存储单元; 和写电路。 写入电路在执行写入操作时执行第一步骤,跨连接到数据写入目标的选择的存储器单元的第一和第二线路施加电压,并跨越连接到第一和第二线路的不同电压 所述多个存储单元的数据写未指定的未选择的存储单元,并且在执行所述第一步骤之后,执行第二步骤,在连接到所选存储单元的第一和第二行上施加数据写入所需的电压 并且将连接到未选择的存储单元的第一和第二线中的至少一个引入浮动状态。
    • 10. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • WO2012128134A1
    • 2012-09-27
    • PCT/JP2012/056486
    • 2012-03-07
    • KABUSHIKI KAISHA TOSHIBATODA, Haruki
    • TODA, Haruki
    • G11C13/00H01L27/10H01L27/105H01L45/00
    • G11C13/003G11C13/0011G11C13/0023G11C13/004G11C2013/0073G11C2213/71G11C2213/72H01L27/115
    • A semiconductor memory device according to the embodiment comprises a memory cell array including a memory cell layer containing plural memory cells operative to store data in accordance with different resistance states; and an access circuit operative to make access to the memory cells, the memory cell changing the resistance state from a first resistance state to a second resistance state on application of a voltage of a first polarity, and changing the resistance state from the second resistance state to the first resistance state on application of a voltage of a second polarity, the access circuit applying voltages, required for access to the memory cell, to first and second lines connected to a selected memory cell, and bringing at least one of the first and second lines connected to non-selected memory cells into the floating state to make access to the selected memory cell.
    • 根据实施例的半导体存储器件包括存储单元阵列,其包括存储单元层,该存储单元层包含多个存储单元,用于根据不同的电阻状态存储数据; 以及访问电路,其操作以访问所述存储单元,所述存储单元在施加第一极性的电压时将所述电阻状态从第一电阻状态改变为第二电阻状态,并且从所述第二电阻状态改变所述电阻状态 在施加第二极性的电压的情况下,所述存取电路将访问所述存储单元所需的电压施加到连接到所选择的存储单元的第一和第二行,并且使所述第一和第 连接到未选择的存储器单元的第二行进入浮置状态以访问所选存储单元。