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1. 发明申请

WO2009050969A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE 审中-公开
标题翻译：非易失性半导体存储器件
公开(公告)号：WO2009050969A1
公开(公告)日：2009-04-23
申请号：PCT/JP2008/066613
申请日：2008-09-09
申请人： KABUSHIKI KAISHA TOSHIBA , NAGASHIMA, Hiroyuki , INOUE, Hirofumi , TODA, Haruki
发明人： NAGASHIMA, Hiroyuki , INOUE, Hirofumi , TODA, Haruki
IPC分类号： G11C13/00 , H01L27/10 , H01L27/105 , H01L45/00 , H01L49/00
CPC分类号： H01L27/101 , G11C11/5685 , G11C13/0004 , G11C13/0009 , G11C13/004 , G11C13/0064 , G11C2013/0054 , G11C2013/0073 , G11C2213/56 , G11C2213/71 , G11C2213/72
摘要： A nonvolatile semiconductor memory device comprises a memory cell array of electrically erasable programmable nonvolatile memory cells arranged in matrix, each memory cell using a variable resistor. A pulse generator is operative to generate plural types of write pulses for varying the resistance of the variable resistor in three or more stages based on ternary or higher write data. A selection circuit is operative to select a write target memory cell from the memory cell array based on a write address and supply the write pulse generated from the pulse generator to the selected memory cell.
摘要翻译：非易失性半导体存储器件包括以矩阵形式布置的电可擦除可编程非易失性存储单元的存储单元阵列，每个存储单元使用可变电阻器。脉冲发生器用于产生多种类型的写入脉冲，用于基于三进制或更高写入数据在三个或更多个阶段中改变可变电阻器的电阻。选择电路可操作以基于写地址从存储单元阵列中选择写入目标存储单元，并将从脉冲发生器产生的写入脉冲提供给所选存储单元。

2. 发明申请

WO2010018715A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE 审中-公开
标题翻译：非易失性半导体存储器件
公开(公告)号：WO2010018715A1
公开(公告)日：2010-02-18
申请号：PCT/JP2009/062019
申请日：2009-06-24
申请人： KABUSHIKI KAISHA TOSHIBA , NAGASHIMA, Hiroyuki , INOUE, Hirofumi
发明人： NAGASHIMA, Hiroyuki , INOUE, Hirofumi
IPC分类号： G11C13/00
CPC分类号： G11C13/003 , G11C13/0004 , G11C13/0007 , G11C13/0011 , G11C13/0023 , G11C13/004 , G11C13/0069 , G11C2213/31 , G11C2213/72
摘要： A nonvolatile semiconductor memory device comprises a cell array including a plurality of first lines, a plurality of second lines intersecting the plurality of first lines, and a plurality of memory cells arranged in matrix and connected at intersections of the first and second lines between both lines, each memory cell containing a serial circuit of an electrically erasable programmable variable resistive element of which resistance is nonvolatilely stored as data and a non-ohmic element; and a plurality of access circuits operative to simultaneously access the memory cells physically separated from each other in the cell array.
摘要翻译：一种非易失性半导体存储器件，包括一个单元阵列，该单元阵列包括多个第一线，与该多条第一线相交的多个第二线，以及多个存储单元，被布置成矩阵并连接在两条线之间的第一和第二线的交点处每个存储单元包含其中电阻被非易失性地存储为数据的电可擦除可编程可变电阻元件和非欧姆元件的串行电路; 以及多个访问电路，其操作以同时访问在单元阵列中彼此物理分离的存储单元。

3. 发明申请

WO2009075130A1 SEMICONDUCTOR MEMORY DEVICE AND MEMORY CELL VOLTAGE APPLICATION METHOD 审中-公开
标题翻译：半导体存储器件和存储器电池电压应用方法
公开(公告)号：WO2009075130A1
公开(公告)日：2009-06-18
申请号：PCT/JP2008/066795
申请日：2008-09-09
申请人： KABUSHIKI KAISHA TOSHIBA , INOUE, Hirofumi
发明人： INOUE, Hirofumi
IPC分类号： G11C13/00
CPC分类号： G11C7/12 , G11C13/0004 , G11C13/0011 , G11C13/004 , G11C13/0069 , G11C2013/0076 , G11C2213/11 , G11C2213/12 , G11C2213/72
摘要： A semiconductor memory device comprises a plurality of parallel word lines, a plurality of parallel bit lines formed crossing the plurality of word lines, and a plurality of memory cells arranged at intersections of the word lines and the bit lines. Each memory cell has one end connected to the word line and the other end connected to the bit line. The device also comprises a drive circuit operative to selectively apply a voltage for data read/write across the word line and the bit line. It further comprises a sense amplifier circuit connected to the plurality of bit lines and operative to read/write data stored in the memory cell. The device also comprises a bit-line drive auxiliary circuit operative to selectively adjust the potentials on the plurality of bit lines based on data read out of the memory cell by the sense amplifier circuit.
摘要翻译：半导体存储器件包括多个并行字线，与多个字线交叉的多条并行位线，以及布置在字线和位线的交点处的多个存储单元。每个存储单元的一端连接到字线，另一端连接到位线。该装置还包括驱动电路，其操作以选择性地施加跨越字线和位线的数据读/写电压。它还包括连接到多个位线的读出放大器电路，并用于读/写存储在存储单元中的数据。该装置还包括位线驱动辅助电路，其可操作以基于由读出放大器电路从存储单元读出的数据选择性地调整多个位线上的电位。

4. 发明申请

WO2006011632A2 SEMICONDUCTOR DEVICE INCLUDING A CONDUCTIVE LAYER BURIED IN AN OPENING AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：包括打开的导电层的半导体器件及其制造方法
公开(公告)号：WO2006011632A2
公开(公告)日：2006-02-02
申请号：PCT/JP2005/014138
申请日：2005-07-27
申请人： KABUSHIKI KAISHA TOSHIBA , INOUE, Hirofumi , SHINOHE, Masahito
发明人： INOUE, Hirofumi , SHINOHE, Masahito
IPC分类号： H01L21/8242 , H01L21/768
CPC分类号： H01L21/76877 , H01L21/76849 , H01L27/10867
摘要： A trench capacitor is formed in a semiconductor substrate via a capacitor insulating film. The trench has a conductive layer for storage node electrode buried in a trench. The conductive layer includes a first, a second, and third conductive layers. The first conductive layer is buried in a lower portion of the trench. The second conductive layer is buried in a recess on the upper surface of the first conductive layer. The third conductive layer is buried to contact with the first and second conductive layers.
摘要翻译：通过电容绝缘膜在半导体衬底中形成沟槽电容器。沟槽具有用于存储在沟槽中的存储节点电极的导电层。导电层包括第一，第二和第三导电层。第一导电层被埋在沟槽的下部。第二导电层被埋在第一导电层的上表面上的凹部中。掩埋第三导电层以与第一和第二导电层接触。

5. 发明申请

WO2006123804A1 CARBOXYL GROUP-CONTAINING POLYURETHANE, HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF 审中-公开
标题翻译：含羧基的聚氨酯，可固化树脂组合物及其用途
公开(公告)号：WO2006123804A1
公开(公告)日：2006-11-23
申请号：PCT/JP2006/310084
申请日：2006-05-16
申请人： SHOWA DENKO K.K. , UCHIDA, Hiroshi , HIRAKAWA, Ritsuko , MIYAJIMA, Yoshio , INOUE, Hirofumi , KIMURA, Kazuya , AZUMA, Yukihiko
发明人： UCHIDA, Hiroshi , HIRAKAWA, Ritsuko , MIYAJIMA, Yoshio , INOUE, Hirofumi , KIMURA, Kazuya , AZUMA, Yukihiko
IPC分类号： C08G18/65 , C08G18/34 , C08G18/62 , C08G18/08
CPC分类号： H05K3/285 , C08G18/0823 , C08G18/348 , C08G18/44 , C08G18/6576 , C08G18/6659 , C08G18/69 , C08G18/698 , C09D11/106 , C09D175/04 , H05K1/0393
摘要： Disclosed is a carboxyl group-containing polyurethane (A) produced from a polyol (b) containing at least 10 mol% (relative to the total (100 mol%) of the polyol (b)) of a polyol (b1) which: (i) has a number-average molecular weight of 500 to 50,000; (ii) has 1 to 10 hydroxyl groups per molecule; and (iii) is one or a combination of two or more polyols selected from the group consisting of polybutadiene polyol, polyisoprene polyol, hydrogenated polybutadiene polyol and hydrogenated polyisoprene polyol. The carboxyl group-containing polyurethane (A) is suitable as materials of cured products, for example cured films, that are excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability.
摘要翻译：公开了由多元醇（b）生成的含有羧基的聚氨酯（A），该多元醇（b）含有多元醇（b1）的至少10摩尔％（相对于多元醇（b）的总量（100摩尔％））为：（ i）数均分子量为500〜50,000; （ii）每分子具有1至10个羟基; 和（iii）是选自聚丁二烯多元醇，聚异戊二烯多元醇，氢化聚丁二烯多元醇和氢化聚异戊二烯多元醇的一种或两种以上的多元醇的组合。含羧基的聚氨酯（A）适合作为与基材的粘合性优异，翘曲翘曲，柔韧性，耐电镀性，焊接耐热性，长期可靠性等固化物例如固化膜的材料。

6. 发明申请

WO2007108550A1 RESIN COMPOSITION 审中-公开
标题翻译：树脂组合物
公开(公告)号：WO2007108550A1
公开(公告)日：2007-09-27
申请号：PCT/JP2007/056131
申请日：2007-03-16
申请人： SHOWA DENKO K.K. , UCHIDA, Hiroshi , INOUE, Hirofumi
发明人： UCHIDA, Hiroshi , INOUE, Hirofumi
IPC分类号： C09D7/12 , C09D7/06
CPC分类号： H05K3/285 , C08L71/03 , C09D7/47 , C09D7/65 , C09D11/52 , H05K2201/015 , H05K2201/0209 , H05K2201/0212
摘要： The invention relates to a thermosetting resin composition comprising (A) 20 to 90 mass% of thermosetting resin, (B)IO to 80 mass% of inorganic and/or organic fine particles and (C) 0.1 to 5 mass% of fluorine-containing polyether, wherein (C) is polymer having fluorinated alkyl polyoxetane structure of formula (1) or (2) (m is an integer of 1 to 100, n is an integer of 1 to 6, R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, R 2 and R 3 each represent a straight or branched chain alkyl group having 1 to 20 carbon atoms, with a proviso that at least 50% of hydrogen atoms present in the alkyl group is substituted by fluorine and the other hydrogen atoms are substituted by hydrogen, iodine, chlorine or bromine atoms) or a composition containing copolymer which consists of monomer having fluorinated alkyl polyoxetane structure and oxygen-containing monomer having 2 to 6 carbon atoms .
摘要翻译：本发明涉及一种热固性树脂组合物，其包含（A）20-90质量％的热固性树脂，（B）10至80质量％的无机和/或有机细颗粒和（C）0.1至5质量％的含氟聚醚，其中（C）为具有式（1）或（2）的氟化烷基聚氧杂环丁烷结构的聚合物（m为1〜100的整数，n为1〜6的整数，R 1〜表示氢原子或碳原子数1〜6的烷基，R 2和R 3各自表示碳原子数1〜20的直链或支链烷基，条件是存在于烷基中的至少50％的氢原子被氟取代，其他氢原子被氢，碘，氯或溴原子取代）或含有共聚物的组合物，其由具有氟化烷基聚氧杂环丁烷的单体组成结构和含2-6个碳原子的含氧单体。

7. 发明申请

WO2013035891A3 RADICALLY POLYMERIZABLE COMPOUND AND RADICALLY CURABLE COMPOSITION 审中-公开
公开(公告)号：WO2013035891A3
公开(公告)日：2013-03-14
申请号：PCT/JP2012/073554
申请日：2012-09-07
申请人： SHOWA DENKO K.K. , OYAMA, Yasuyuki , INOUE, Hirofumi
发明人： OYAMA, Yasuyuki , INOUE, Hirofumi
IPC分类号： C08G63/64 , C08L67/07 , G02B1/00 , C08F290/06
摘要： The present invention provides a radically curable composition comprising a radically polymerizable compound (polyallyl ester compound) containing terminal groups represented by formulae (1) and (2) (in formula (1), X 1 represents a cycloalkylene group having 5 to 10 carbon atoms which may have a substituent group or an alkylene group having 2 to 10 carbon atoms which may have a substituent group) and having a structure represented by formula (3) (in the formula, R 1 and R 2 independently represent an alkylene group having 2 to 20 carbon atoms which may have an alkyl branch; X 2 represents a cycloalkylene group having 5 to 10 carbon atoms which may have a substituent group or an alkylene group having 2 to 10 carbon atoms which may have a substituent group; and n and m represent an arbitrary positive integer); and having a number average molecular weight of 500 to 50,000. The cured product obtained by curing the radically curable composition of the present invention possesses flexibility and handleability while maintaining high transparency and heat resistance.

8. 发明申请

WO2009139451A1 SUSPENSION SYSTEM FOR VEHICLE 审中-公开
标题翻译：车辆悬挂系统
公开(公告)号：WO2009139451A1
公开(公告)日：2009-11-19
申请号：PCT/JP2009/059027
申请日：2009-05-08
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA , KAYABA INDUSTRY CO., LTD. , INOUE, Hirofumi , KONDO, Takuhiro
发明人： INOUE, Hirofumi , KONDO, Takuhiro
IPC分类号： B60G17/015 , B60G17/06
CPC分类号： B60G17/0157 , B60G17/06 , B60G2202/42 , B60G2400/102 , B60G2400/206 , B60G2400/252
摘要： A suspension system for a vehicle, including: an electromagnetic actuator including: (A) a sprung-side unit connected to a sprung portion; (B) an unsprung-side unitcommat;which is connected to an unsprung portion and which moves relative to the sprung-side unit in association with a relative movement of the sprung portion and the unsprung portion toward and away from each other; (C) a screw mechanism; (D) an electromagnetic motor, the actuator being configured to generate an actuator force; a connecting mechanism which includes a support spring for permitting one of the sprung-side unit and the unsprung-side unit to be supported by one of the sprung portion and the unsprung portion to which the one of the sprung-side unit and the unsprung-side unit is connected; and a controller configured to control the actuator force of the actuator, wherein the controller includes: a sprung-vibration-damping control portion configured to execute a sprung-vibration damping control for generating, as one component of the actuator force, a force having a magnitude in accordance with a moving speed of the sprung portion, so as to damp a vibration of the sprung portion; and a relative-vibration-damping control portion configured to execute a relative-vibration damping control for generating, as one component of the actuator force, a force having a magnitude in accordance with one of: (a) a relative moving speed of the sprung-side unit and the unsprung-side unit; and (b) a relative moving speed of the one of the sptung-side unit and the unsprung-side unit and the one of the sprung portion and the unsprung portion, so as to damp a vibration of the one of the sprung-side unit and the unsprung-side unit that is caused by the support spring.
摘要翻译：一种用于车辆的悬挂系统，包括：电磁致动器，包括：（A）连接到弹簧部分的弹簧侧单元; （B）簧簧侧单元指令，其与簧上部分连接，并且相对于簧上部分和簧下部分相对于彼此相对运动而相对于簧上侧单元移动; （C）螺杆机构; （D）电磁马达，所述致动器构造成产生致动器力; 一种连接机构，其包括用于使所述弹簧侧单元和簧下侧单元中的一个由所述簧上侧单元和所述簧下侧单元中的一个的簧上部和簧下部中的一个支撑的支撑弹簧，侧单元连接; 以及控制器，被配置为控制所述致动器的致动器力，其中所述控制器包括：弹簧减振控制部分，其构造成执行弹簧减振控制，用于产生作为所述致动器力的一个分量的弹簧减振控制部分，根据弹簧部分的移动速度进行大小，以便抑制簧上部分的振动; 以及相对振动阻尼控制部，其被配置为执行相对振动阻尼控制，用于产生作为所述致动器力的一个分量的力，所述力具有根据以下之一的大小：（a）所述弹簧的相对移动速度单位和非繁殖侧单位; 以及（b）所述顶端单元和簧下侧单元以及簧上部和簧下部之一的相对移动速度，以便抑制所述弹簧侧单元中的所述一个的振动和由支撑弹簧引起的簧下侧单元。

9. 发明申请

WO2006054791A1 RESIN CURED FILM FOR FLEXIBLE PRINTED WIRING BOARD AND PRODUCTION PROCESS THEREOF 审中-公开
标题翻译：柔性印刷电路板用树脂固化膜及其生产工艺
公开(公告)号：WO2006054791A1
公开(公告)日：2006-05-26
申请号：PCT/JP2005/021628
申请日：2005-11-18
申请人： SHOWA DENKO K.K. , INOUE, Hirofumi
发明人： INOUE, Hirofumi
IPC分类号： C09D163/00 , G03C5/00 , H05K1/00
CPC分类号： G03C5/00 , H05K1/0393 , H05K3/244 , H05K3/287 , Y10T428/265
摘要： A insulating resin cured film provided after the formation of tin plating, substantially containing no copper, on a flexible printed wiring board for electronic component, wherein the glass transition temperature of the film after being cured is 80 (C or less, and a process for producing the same. There is provided a flexible printed wiring board with tin plating substantially containing no copper for an electronic component, having coated thereon a resin cured film of photocurable and thermosetting resin, in which fewer copper is diffused in a pure tin plating layer, in comparison with that provided by a prior method.
摘要翻译：在电子部件用柔性印刷电路板上形成基本不含铜的镀锡后设置的绝缘树脂固化膜，其中，固化后的膜的玻璃化转变温度为80℃以下，提供了一种柔性印刷线路板，其具有基本上不含铜的电镀部件的镀锡，其上涂覆有可光固化和热固性树脂的树脂固化膜，其中较少的铜在纯锡镀层中扩散，与通过现有方法提供的相比较。

10. 发明申请

WO2005116760A2 PHOTOSENSITIVE RESIN COMPOSITION, AND CURED PRODUCT AND USE THEREOF 审中-公开
标题翻译：感光树脂组合物，固化产品及其用途
公开(公告)号：WO2005116760A2
公开(公告)日：2005-12-08
申请号：PCT/JP2005/009999
申请日：2005-05-25
申请人： SHOWA DENKO K.K. , INOUE, Hirofumi
发明人： INOUE, Hirofumi
IPC分类号： G03F7/00
CPC分类号： G03F7/0388 , G03F7/027 , G03F7/038 , H05K3/287
摘要： The invention relates to a photosensitive resin composition comprising (A) an epoxy(meth)acrylate resin synthesized from components containing (a) epoxy prepolymer, (b) an unsaturated group-containing monocarboxylic acid and (c) an acid anhydride, (B) a urethane (meth)acrylate resin synthesized from components containing (d) a dihydroxyl compound having a carboxyl group, (e) a polyol compound having an number average molecular weight of 200 to 20,000, (f) a hydroxyl compound having a (meth)acryloyl group and (g) diisocyanate compound, (C) an epoxy resin, (D) a diluent, (E) a photopolymerization initiator and if appropriate (F) inorganic ion exchanger, and cured product and use thereof. The photosensitive resin composition of the invention having good photosensitivity, developability, flexibility and property exhibiting excellent HHBT performance can be suitably used in printed circuit boards.
摘要翻译：本发明涉及一种感光性树脂组合物，其包含（A）由（a）环氧预聚物，（b）不饱和基团的一元羧酸和（c）酸酐组分的组分合成的环氧（甲基）丙烯酸酯树脂，（B）由（d）具有羧基的二羟基化合物，（e）数均分子量为200〜20,000的多元醇化合物的组分合成的聚氨酯（甲基）丙烯酸酯树脂，（f）具有（甲基）丙烯酰基和（g）二异氰酸酯化合物，（C）环氧树脂，（D）稀释剂，（E）光聚合引发剂和（如果合适的话）无机离子交换剂，以及固化产物及其用途。具有良好的感光性，显影性，柔软性和显示出优异的HHBT性能的本发明的感光性树脂组合物可以适用于印刷电路板。

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