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    • 2. 发明申请
    • High pressure processing apparatus and high pressure processing method
    • 高压加工设备及高压加工方法
    • US20040194842A1
    • 2004-10-07
    • US10826309
    • 2004-04-19
    • Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd)DAINIPPON SCREEN MFG. CO., LTD.
    • Yoshihiko SakashitaKatsumi WatanabeHisanori OshibaShogo SarumaruYusuke MuraokaKimitsugu SaitoIkuo MizobataRyuji Kitakado
    • B65B001/04
    • H01L21/67017B08B7/0021H01L21/67126Y10S134/902
    • A high-pressure processing apparatus includes a processing vessel including a processing chamber formed therein to perform a certain process onto an object in the processing chamber; fluid feeding means which feeds a high-pressure fluid into the processing chamber; fluid discharging means which discharges the high-pressure fluid from the processing chamber; an agitating unit which is arranged in the processing chamber and is operative to flow the high-pressure fluid over the object by relative rotation to the processing vessel; a communicating channel which is formed in the processing vessel to communicate inside and outside of the processing chamber; a rotary driving member which is coupled to the agitating unit via a shaft portion provided in the communicating channel; and a sealing portion which is provided between the shaft portion: and the processing vessel to disconnect the processing chamber from the rotary driving member. The fluid discharging means includes a fluid discharging port formed in a certain position of the communicating channel closer to the processing chamber than the sealing portion to discharge the high-pressure fluid.
    • 高压处理装置包括:处理容器,其包括形成在其中的处理室,以对处理室中的物体执行一定的处理; 流体供给装置,其将高压流体供给到处理室中; 从处理室排出高压流体的流体排出装置; 搅拌单元,其布置在处理室中并且可操作以通过相对于处理容器的旋转将高压流体流过物体; 形成在所述处理容器中以在所述处理室内部和外部连通的连通通道; 旋转驱动构件,其经由设置在所述连通通道中的轴部联接到所述搅拌单元; 以及密封部,其设置在所述轴部与所述处理容器之间,以将所述处理室与所述旋转驱动构件断开。 流体排出装置包括形成在与密封部分相比更靠近处理室的连通通道的特定位置中以排出高压流体的流体排放口。
    • 3. 发明申请
    • High-pressure processing apparatus
    • 高压加工设备
    • US20020148492A1
    • 2002-10-17
    • US10123252
    • 2002-04-17
    • Kabushiki Kaisha Kobe Seiko Sho
    • Masahiro YamagataHisanori OshibaYoshihiko SakashitaYoichi InoueYusuke MuraokaKimitsugu SaitoIkuo MizobataRyuji Kitakado
    • B08B003/00
    • B08B7/0021B08B3/02Y10S134/902
    • A high-pressure processing apparatus for removing unnecessary matters on objects to be processed by bringing a high-pressure fluid and a chemical liquid other than the high-pressure fluid into contact with the objects to be processed in a pressurized state is provided with a plurality of high-pressure processing chambers, a common high-pressure fluid supply unit for supplying the high-pressure fluid to each one of the high-pressure processing chambers, a common chemical liquid supply unit for supplying the chemical liquid to the each high-pressure processing chambers, and a separating unit for separating gaseous components from a mixture of the high-pressure fluid and the chemical liquid discharged from the high-pressure processing chambers after the objects are processed. Thus, a high-pressure processing apparatus which has such a compact construction as to be partly installable in a clean room and can stably perform a high-pressure processing can be provided.
    • 通过使高压流体和高压流体以外的化学液体与加压状态下的被处理物体接触来除去被加工物上的不必要物质的高压处理装置,具有多个 的高压处理室,用于将高压流体供给到每个高压处理室的普通高压流体供给单元,用于向每个高压处理室供给化学液体的公共化学液体供给单元 处理室,以及分离单元,用于在物体被处理之后从高压流体和从高压处理室排出的化学液体的混合物中分离出气体成分。 因此,可以提供一种具有这种紧凑结构的高压处理装置,其可以部分地安装在洁净室中并且可以稳定地执行高压处理。
    • 4. 发明申请
    • High pressure processing apparatus and high pressure processing method
    • 高压加工设备及高压加工方法
    • US20020179114A1
    • 2002-12-05
    • US10131193
    • 2002-04-25
    • Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd)
    • Yoshihiko SakashitaKatsumi WatanabeMasahiro YamagataHisanori OshibaShogo SarumaruYusuke MuraokaKimitsugu SaitoIkuo MizobataRyuji Kitakado
    • B08B003/00
    • H01L21/67017B08B7/0021H01L21/67126Y10S134/902
    • A high-pressure processing apparatus includes a processing vessel including a processing chamber formed therein to perform a certain process onto an object in the processing chamber; fluid feeding means which feeds a high-pressure fluid into the processing chamber; fluid discharging means which discharges the high-pressure fluid from the processing chamber; an agitating unit which is arranged in the processing chamber and is operative to flow the high-pressure fluid over the object by relative rotation to the processing vessel; a communicating channel which is formed in the processing vessel to communicate inside and outside of the processing chamber; a rotary driving member which is coupled to the agitating unit via a shaft portion provided in the communicating channel; and a sealing portion which is provided between the shaft portion and the processing vessel to disconnect the processing chamber from the rotary driving member. The fluid discharging means includes a fluid discharging port formed in a certain position of the communicating channel closer to the processing chamber than the sealing portion to discharge the high-pressure fluid.
    • 高压处理装置包括:处理容器,其包括形成在其中的处理室,以对处理室中的物体执行一定的处理; 流体供给装置,其将高压流体供给到处理室中; 从处理室排出高压流体的流体排出装置; 搅拌单元,其布置在处理室中并且可操作以通过相对于处理容器的旋转将高压流体流过物体; 形成在所述处理容器中以在所述处理室内部和外部连通的连通通道; 旋转驱动构件,其经由设置在所述连通通道中的轴部联接到所述搅拌单元; 以及密封部,其设置在所述轴部和所述处理容器之间,以将所述处理室与所述旋转驱动构件断开。 流体排出装置包括形成在与密封部分相比更靠近处理室的连通通道的特定位置中以排出高压流体的流体排放口。
    • 9. 发明申请
    • High pressure processing apparatus and method
    • 高压加工设备及方法
    • US20020170577A1
    • 2002-11-21
    • US10147742
    • 2002-05-16
    • Dainippon Screen Mfg. Co., Ltd.
    • Ikuo MizobataYusuke MuraokaKimitsugu SaitoRyuji KitakadoYoichi InoueYoshihiko SakashitaKatsumi WatanabeMasahiro YamagataHisanori Oshiba
    • B08B003/04
    • B08B9/0321B08B7/0021Y10S134/902
    • When the hatch of a substrate washing chamber 5 is opened to place a substrate therein, valves V1, V2, V3, V4 and V6 are closed, only a valve V5 being opened. Thus, gaseous CO2 is supplied into the substrate washing chamber 5 to perform a chamber purge for preventing surrounding air components from straying in. As the hatch of the substrate washing chamber 5 is closed, the valve V6 is further closed to form a vent line for the substrate washing chamber 5. Thus, the gas residing within the substrate washing chamber 5 and the conduits is expelled by CO2 gas, into the surrounding air, thereby performing a chamber purge to prevent any unwanted surrounding air components from being left. Thereafter, super critical CO2 is used to wash the substrate. When cleaning the circulation line, super critical CO2 is supplied into the circulation line. The flow of super critical CO2 is sent to the substrate washing chamber 5. After having flown all through the circulation line, including a circulation channel 11, it is passed through a bypass channel 12 to a decompressor 7. Any chemicals or organic substances left in the circulation line are continuously sent to the decompressor 8 together with the flow.
    • 当基板洗涤室​​5的开口打开以将基板放置在其中时,阀V1,V2,V3,V4和V6关闭,只有阀V5打开。 因此,气体CO 2被供应到基板清洗室5中以执行室吹扫以防止周围的空气部件偏离。当基板清洗室5的舱口关闭时,阀V6进一步关闭以形成排气管线 衬底洗涤室5.因此,驻留在衬底洗涤室5内的气体和导管被CO 2气体排出到周围空气中,从而进行室吹扫,以防止留下任何不需要的周围空气组分。 此后,使用超临界CO 2来洗涤底物。 当清洁循环管线时,超临界CO2被供应到循环管线中。 超临界CO 2的流动被送到衬底洗涤室5.在全部通过包括循环通道11的循环管线全部通过循环通道11之后,其通过旁路通道12进入减压器7.留下的任何化学物质或有机物质 循环管线与流动一起连续送到减压器8。