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1. 发明申请

US20130328055A1 SEMICONDUCTOR LIGHT EMITTING DEVICE 审中-公开
标题翻译：半导体发光器件
公开(公告)号：US20130328055A1
公开(公告)日：2013-12-12
申请号：US13724007
申请日：2012-12-21
申请人： Jumpei TAJIMA , Kotaro Zaima , Shigeya Kimura , Hiroshi Ono , Shinji Yamada , Satoshi Mitsugi , Naoharu Sugiyama , Shinya Nunoue
发明人： Jumpei TAJIMA , Kotaro Zaima , Shigeya Kimura , Hiroshi Ono , Shinji Yamada , Satoshi Mitsugi , Naoharu Sugiyama , Shinya Nunoue
IPC分类号： H01L33/40
CPC分类号： H01L33/40 , H01L33/14 , H01L33/22 , H01L33/38
摘要： According to one embodiment, a semiconductor light emitting device includes first and second electrodes, first, second and third semiconductor layers, and a light emitting layer. The first semiconductor layer of a first conductivity type is provided on the first electrode. The light emitting layer is provided on the first semiconductor layer. The second semiconductor layer of a second conductivity type is provided on the light emitting layer. The third semiconductor layer with low impurity concentration is provided on a part of the second semiconductor layer. The second electrode includes a pad section and a narrow wire section. The pad section is provided on the third semiconductor layer. The narrow wire section extends out from the pad section and includes an extending portion extending along a plane perpendicular to a stacking direction. The narrow wire section is in contact with the second semiconductor layer.
摘要翻译：根据一个实施例，半导体发光器件包括第一和第二电极，第一，第二和第三半导体层以及发光层。第一导电类型的第一半导体层设置在第一电极上。发光层设置在第一半导体层上。第二导电类型的第二半导体层设置在发光层上。具有低杂质浓度的第三半导体层设置在第二半导体层的一部分上。第二电极包括焊盘部分和窄线部分。焊盘部设置在第三半导体层上。窄线部分从焊盘部分延伸出并且包括沿垂直于堆叠方向的平面延伸的延伸部分。窄线部分与第二半导体层接触。

2. 发明授权

US08816367B2 Semiconductor light emitting device and method for manufacturing same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US08816367B2
公开(公告)日：2014-08-26
申请号：US13727147
申请日：2012-12-26
申请人： Jumpei Tajima , Kotaro Zaima , Hiroshi Ono , Shinji Yamada , Shigeya Kimura , Naoharu Sugiyama , Shinya Nunoue
发明人： Jumpei Tajima , Kotaro Zaima , Hiroshi Ono , Shinji Yamada , Shigeya Kimura , Naoharu Sugiyama , Shinya Nunoue
IPC分类号： H01L33/22
CPC分类号： H01L33/22 , H01L33/0079 , H01L33/382 , H01L33/385 , H01L33/405
摘要： According to one embodiment, a semiconductor light emitting device includes first and second electrodes, first and second semiconductor layers and a light emitting layer. The first electrode includes a first region, a second region, and a third region provided between them. The first semiconductor layer includes a first portion on the first region and a second portion on the second region. The light emitting layer includes a third portion on the first portion and a fourth portion on the second portion. The second semiconductor layer includes a fifth portion on the third portion and a sixth portion on the fourth portion. The insulating layer is provided between the first and second portions on the third region and between the third and fourth portions. The second electrode includes a seventh portion provided on the insulating layer, eighth and ninth portions contacting side surfaces of the fifth and sixth portions.
摘要翻译：根据一个实施例，半导体发光器件包括第一和第二电极，第一和第二半导体层以及发光层。第一电极包括第一区域，第二区域和设置在它们之间的第三区域。第一半导体层包括第一区域上的第一部分和第二区域上的第二部分。发光层包括第一部分上的第三部分和第二部分上的第四部分。第二半导体层包括第三部分上的第五部分和第四部分上的第六部分。绝缘层设置在第三区域上的第一和第二部分之间以及第三和第四部分之间。第二电极包括设置在绝缘层上的第七部分，与第五和第六部分的侧表面接触的第八和第九部分。

3. 发明申请

US20130328075A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20130328075A1
公开(公告)日：2013-12-12
申请号：US13727147
申请日：2012-12-26
申请人： Jumpei Tajima , Kotaro Zaima , Hiroshi Ono , Shinji Yamada , Shigeya Kimura , Naoharu Sugiyama , Shinya Nunoue
发明人： Jumpei Tajima , Kotaro Zaima , Hiroshi Ono , Shinji Yamada , Shigeya Kimura , Naoharu Sugiyama , Shinya Nunoue
IPC分类号： H01L33/22
CPC分类号： H01L33/22 , H01L33/0079 , H01L33/382 , H01L33/385 , H01L33/405
摘要： According to one embodiment, a semiconductor light emitting device includes first and second electrodes, first and second semiconductor layers and a light emitting layer. The first electrode includes a first region, a second region, and a third region provided between them. The first semiconductor layer includes a first portion on the first region and a second portion on the second region. The light emitting layer includes a third portion on the first portion and a fourth portion on the second portion. The second semiconductor layer includes a fifth portion on the third portion and a sixth portion on the fourth portion. The insulating layer is provided between the first and second portions on the third region and between the third and fourth portions. The second electrode includes a seventh portion provided on the insulating layer, eighth and ninth portions contacting side surfaces of the fifth and sixth portions.
摘要翻译：根据一个实施例，半导体发光器件包括第一和第二电极，第一和第二半导体层以及发光层。第一电极包括第一区域，第二区域和设置在它们之间的第三区域。第一半导体层包括第一区域上的第一部分和第二区域上的第二部分。发光层包括第一部分上的第三部分和第二部分上的第四部分。第二半导体层包括第三部分上的第五部分和第四部分上的第六部分。绝缘层设置在第三区域上的第一和第二部分之间以及第三和第四部分之间。第二电极包括设置在绝缘层上的第七部分，与第五和第六部分的侧表面接触的第八和第九部分。

4. 发明申请

US20120217524A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS 失效
标题翻译：半导体发光装置和发光装置
公开(公告)号：US20120217524A1
公开(公告)日：2012-08-30
申请号：US13206649
申请日：2011-08-10
申请人： Taisuke Sato , Shigeya Kimura , Kotaro Zaima , Koichi Tachibana , Shinya Nunoue
发明人： Taisuke Sato , Shigeya Kimura , Kotaro Zaima , Koichi Tachibana , Shinya Nunoue
IPC分类号： H01L33/50 , H01L33/40
CPC分类号： H01L33/02 , H01L33/0079 , H01L33/20 , H01L33/38 , H01L33/40 , H01L33/405 , H01L33/44 , H01L33/50 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
摘要： According to one embodiment, a semiconductor light emitting device includes a p-type semiconductor layer, an n-type semiconductor layer, a light emitting layer, a p-side electrode and an n-side electrode. The p-type semiconductor layer includes a nitride semiconductor and has a first major surface. The n-type semiconductor layer includes a nitride semiconductor and has a second major surface. The light emitting layer is provided between the n-type semiconductor layer and the p-type semiconductor layer. The p-side electrode contacts a part of the p-type semiconductor layer on the first major surface. The n-side electrode contacts a part of the n-type semiconductor layer on the second major surface. The n-side electrode is provided outside and around the p-side electrode in a plan view along a direction from the p-type semiconductor layer to the n-type semiconductor layer.
摘要翻译：根据一个实施例，半导体发光器件包括p型半导体层，n型半导体层，发光层，p侧电极和n侧电极。 p型半导体层包括氮化物半导体，并且具有第一主表面。 n型半导体层包括氮化物半导体，并具有第二主表面。发光层设置在n型半导体层和p型半导体层之间。 p侧电极与第一主表面上的p型半导体层的一部分接触。 n侧电极与第二主表面上的n型半导体层的一部分接触。 n侧电极沿着从p型半导体层到n型半导体层的方向的平面图设置在p侧电极的外侧和周围。

5. 发明授权

US08766311B2 Semiconductor light emitting device and light emitting apparatus 失效
标题翻译：半导体发光器件和发光装置
公开(公告)号：US08766311B2
公开(公告)日：2014-07-01
申请号：US13206649
申请日：2011-08-10
申请人： Taisuke Sato , Shigeya Kimura , Kotaro Zaima , Koichi Tachibana , Shinya Nunoue
发明人： Taisuke Sato , Shigeya Kimura , Kotaro Zaima , Koichi Tachibana , Shinya Nunoue
IPC分类号： H01L33/00 , H01L33/20 , H01L33/38 , H01L33/44 , H01L33/40
CPC分类号： H01L33/02 , H01L33/0079 , H01L33/20 , H01L33/38 , H01L33/40 , H01L33/405 , H01L33/44 , H01L33/50 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
摘要： According to one embodiment, a semiconductor light emitting device includes a p-type semiconductor layer, an n-type semiconductor layer, a light emitting layer, a p-side electrode and an n-side electrode. The p-type semiconductor layer includes a nitride semiconductor and has a first major surface. The n-type semiconductor layer includes a nitride semiconductor and has a second major surface. The light emitting layer is provided between the n-type semiconductor layer and the p-type semiconductor layer. The p-side electrode contacts a part of the p-type semiconductor layer on the first major surface. The n-side electrode contacts a part of the n-type semiconductor layer on the second major surface. The n-side electrode is provided outside and around the p-side electrode in a plan view along a direction from the p-type semiconductor layer to the n-type semiconductor layer.
摘要翻译：根据一个实施例，半导体发光器件包括p型半导体层，n型半导体层，发光层，p侧电极和n侧电极。 p型半导体层包括氮化物半导体，并且具有第一主表面。 n型半导体层包括氮化物半导体，并具有第二主表面。发光层设置在n型半导体层和p型半导体层之间。 p侧电极与第一主表面上的p型半导体层的一部分接触。 n侧电极与第二主表面上的n型半导体层的一部分接触。 n侧电极沿着从p型半导体层到n型半导体层的方向的平面图设置在p侧电极的外侧和周围。

6. 发明申请

US20120292650A1 SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
标题翻译：半导体发光器件
公开(公告)号：US20120292650A1
公开(公告)日：2012-11-22
申请号：US13220072
申请日：2011-08-29
申请人： Naoharu SUGIYAMA , Tomonari Shioda , Shigeya Kimura , Koichi Tachibana , Shinya Nunoue
发明人： Naoharu SUGIYAMA , Tomonari Shioda , Shigeya Kimura , Koichi Tachibana , Shinya Nunoue
IPC分类号： H01L33/24 , H01L33/26 , H01L33/00
CPC分类号： H01L33/007 , H01L33/08 , H01L33/22 , H01L33/42 , H01L2933/0016 , H01L2933/0058
摘要： According to one embodiment, a semiconductor light emitting device includes an n-type layer, a light emitting layer, a p-type layer, and a transparent electrode. The n-type layer includes a nitride semiconductor and has a thickness not more than 500 nm. The light emitting layer is provided on the n-type layer. The p-type layer is provided on the light emitting layer and includes a nitride semiconductor. The transparent electrode contacts the n-type layer. The n-type layer is disposed between the transparent electrode and the light emitting layer.
摘要翻译：根据一个实施例，半导体发光器件包括n型层，发光层，p型层和透明电极。 n型层包括氮化物半导体，其厚度不大于500nm。发光层设置在n型层上。 p型层设置在发光层上，并且包括氮化物半导体。透明电极与n型层接触。 n型层设置在透明电极和发光层之间。

7. 发明授权

US08878213B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US08878213B2
公开(公告)日：2014-11-04
申请号：US13220072
申请日：2011-08-29
申请人： Naoharu Sugiyama , Tomonari Shioda , Shigeya Kimura , Koichi Tachibana , Shinya Nunoue
发明人： Naoharu Sugiyama , Tomonari Shioda , Shigeya Kimura , Koichi Tachibana , Shinya Nunoue
IPC分类号： H01L33/00 , H01L33/42 , H01L33/22 , H01L33/08
CPC分类号： H01L33/007 , H01L33/08 , H01L33/22 , H01L33/42 , H01L2933/0016 , H01L2933/0058
摘要： According to one embodiment, a semiconductor light emitting device includes an n-type layer, a light emitting layer, a p-type layer, and a transparent electrode. The n-type layer includes a nitride semiconductor and has a thickness not more than 500 nm. The light emitting layer is provided on the n-type layer. The p-type layer is provided on the light emitting layer and includes a nitride semiconductor. The transparent electrode contacts the n-type layer. The n-type layer is disposed between the transparent electrode and the light emitting layer.
摘要翻译：根据一个实施例，半导体发光器件包括n型层，发光层，p型层和透明电极。 n型层包括氮化物半导体，其厚度不大于500nm。发光层设置在n型层上。 p型层设置在发光层上，并且包括氮化物半导体。透明电极与n型层接触。 n型层设置在透明电极和发光层之间。

8. 发明授权

US08525195B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US08525195B2
公开(公告)日：2013-09-03
申请号：US12873662
申请日：2010-09-01
申请人： Hajime Nago , Koichi Tachibana , Toshiki Hikosaka , Shigeya Kimura , Shinya Nunoue
发明人： Hajime Nago , Koichi Tachibana , Toshiki Hikosaka , Shigeya Kimura , Shinya Nunoue
IPC分类号： H01L33/02
CPC分类号： H01L33/12 , B82Y20/00 , H01L33/04 , H01L33/32 , H01S5/34333
摘要： According to one embodiment, a semiconductor light emitting device includes n-type and p-type semiconductor layers, a light emitting portion, a multilayered structural body, and an n-side intermediate layer. The light emitting portion is provided between the semiconductor layers. The light emitting portion includes barrier layers containing GaN, and a well layer provided between the barrier layers. The well layer contains Inx1Ga1-x1N. The body is provided between the n-type semiconductor layer and the light emitting portion. The body includes: first layers containing GaN, and a second layer provided between the first layers. The second layer contains Inx2Ga1-x2N. Second In composition ratio x2 is not less than 0.6 times of first In composition ratio x1 and is lower than the first In composition x1. The intermediate layer is provided between the body and the light emitting portion and includes a third layer containing Aly1Ga1-y1N (0
摘要翻译：根据一个实施例，半导体发光器件包括n型和p型半导体层，发光部分，多层结构体和n侧中间层。发光部分设置在半导体层之间。发光部分包括含有GaN的阻挡层，以及设置在阻挡层之间的阱层。阱层包含Inx1Ga1-x1N。本体设置在n型半导体层和发光部之间。主体包括：包含GaN的第一层，以及设置在第一层之间的第二层。第二层包含Inx2Ga1-x2N。第二组成比x2不小于第一In组成比x1的0.6倍，并且低于第一In组成x1。中间层设置在主体和发光部分之间，并且包括含有Aly1Ga1-y1N（0

9. 发明申请

US20120286284A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND WAFER 有权
标题翻译：半导体发光器件和散热器
公开(公告)号：US20120286284A1
公开(公告)日：2012-11-15
申请号：US13206700
申请日：2011-08-10
申请人： Koichi TACHIBANA , Shigeya Kimura , Hajime Nago , Shinya Nunoue
发明人： Koichi TACHIBANA , Shigeya Kimura , Hajime Nago , Shinya Nunoue
IPC分类号： H01L33/32
CPC分类号： H01L33/12 , B82Y20/00 , H01L33/007 , H01L33/025 , H01L33/06 , H01L33/08 , H01L33/20 , H01L33/22 , H01L33/32 , H01S5/3407 , H01S5/34333 , H01S2301/173 , H01S2304/04 , H01S2304/12
摘要： According to one embodiment, a semiconductor light emitting device includes: a foundation layer, a first semiconductor layer, a light emitting part, and a second semiconductor layer. The foundation layer includes a nitride semiconductor. The foundation layer has a dislocation density not more than 5×108 cm−2. The first semiconductor layer of a first conductivity type is provided on the foundation layer and includes a nitride semiconductor. The light emitting part is provided on the first semiconductor layer. The light emitting part includes: a plurality of barrier layers; and a well layer provided between the barrier layers. The well layer has a bandgap energy smaller than a bandgap energy of the barrier layers and has a thickness larger than a thickness of the barrier layers. The second semiconductor layer of a second conductivity type different from the first conductivity type, is provided on the light emitting part and includes a nitride semiconductor.
摘要翻译：根据一个实施例，半导体发光器件包括：基底层，第一半导体层，发光部分和第二半导体层。基础层包括氮化物半导体。基础层的位错密度不大于5×108cm-2。第一导电类型的第一半导体层设置在基底层上并且包括氮化物半导体。发光部分设置在第一半导体层上。发光部包括：多个阻挡层; 以及设置在阻挡层之间的阱层。阱层具有小于阻挡层的带隙能量的带隙能量，并且具有比阻挡层的厚度大的厚度。具有不同于第一导电类型的第二导电类型的第二半导体层设置在发光部分上并且包括氮化物半导体。

10. 发明授权

US09048362B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US09048362B2
公开(公告)日：2015-06-02
申请号：US13405565
申请日：2012-02-27
申请人： Shigeya Kimura , Yoshiyuki Harada , Hajime Nago , Koichi Tachibana , Shinya Nunoue
发明人： Shigeya Kimura , Yoshiyuki Harada , Hajime Nago , Koichi Tachibana , Shinya Nunoue
IPC分类号： H01L33/00 , H01L33/06 , H01L33/32 , B82Y20/00 , H01S5/343 , H01S5/34
CPC分类号： H01L33/06 , B82Y20/00 , H01L33/12 , H01L33/32 , H01S5/3408 , H01S5/34333
摘要： According to one embodiment, a semiconductor light emitting device includes n-type and p-type semiconductor layers containing a nitride semiconductor and a light emitting layer. The emitting layer includes a barrier layer containing III group elements, and a well layer stacked with the barrier layer and containing III group elements. The barrier layer is divided into a first portion on an n-type semiconductor layer side and a second portion on a p-type semiconductor layer side, an In composition ratio in the III group elements of the second portion is lower than that of the first portion. The well layer is divided into a third portion on an n-type semiconductor layer side and a fourth portion on a p-type semiconductor layer side, an In composition ratio in the III group elements of the fourth portion is higher than that of the third portion.
摘要翻译：根据一个实施例，半导体发光器件包括含有氮化物半导体和发光层的n型和p型半导体层。发光层包括含有III族元素的阻挡层，以及与阻挡层堆叠并含有III族元素的阱层。阻挡层被分为n型半导体层侧的第一部分和p型半导体层侧的第二部分，第二部分的III族元素中的In组成比低于第一部分一部分。阱层被分为n型半导体层侧的第三部分和p型半导体层侧的第四部分，第四部分的III族元素中的In组成比高于第三部分的第三部分一部分。

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