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    • 1. 发明授权
    • Process chamber, inline coating installation and method for treating a substrate
    • 处理室,在线涂布装置和处理基材的方法
    • US07837796B2
    • 2010-11-23
    • US11680361
    • 2007-02-28
    • Juergen HenrichMichael SchaeferEdgar Haberkorn
    • Juergen HenrichMichael SchaeferEdgar Haberkorn
    • C23C16/00
    • C23C16/54
    • A process chamber 1 for PECVD (Plasma Enhanced Chemical Vapor Deposition) coating of a substrate includes an electrode, which is integrated in a contact frame, which is firmly connected to the recipient. A movable carrier in the process chamber carries at least one substrate. The carrier is transported by means of a driven roller positioner into the process chamber or out of the process chamber along a transport route defined by the movement. As soon as the carrier inside the recipient has reached a certain position, the lower roller positioner is uncoupled from carrier by lowering by means of a lifting device. In this regard, the carrier detaches itself from the upper roller positioner. Then, the carrier is accepted by a transfer device (not shown) and brought from the transport position laterally into a treatment position in contact with the contact frame. In this way, reliable contact is produced between the electrode and a counter-electrode provided in carrier. At the same time, other carriers, in so far as the contact frame is removed laterally far enough from the transport route, during the coating of the carrier, can be moved past this.
    • 用于基板的PECVD(等离子体增强化学气相沉积)涂层的处理室1包括集成在接触框架中的电极,其牢固地连接到接收器。 处理室中的可移动载体承载至少一个基板。 载体通过从动辊定位器沿着由运动限定的运输路线输送到处理室中或从处理室中输送。 一旦收件人内的承运人已经达到一定的位置,则下辊定位器通过借助于提升装置的下降而脱离载体。 在这方面,载体将自身从上辊定位器分离。 然后,托架被转移装置(未示出)接受,并从运输位置横向地进入与接触框架接触的处理位置。 以这种方式,在电极和设置在载体中的对电极之间产生可靠的接触。 同时,在载体的涂覆期间,其他载体,只要在接触框架从输送路线横向移开足够远的位置即可移动过去。
    • 2. 发明申请
    • PROCESS CHAMBER, INLINE COATING INSTALLATION AND METHOD FOR TREATING A SUBSTRATE
    • 过程室,在线涂装安装和处理基板的方法
    • US20080184933A1
    • 2008-08-07
    • US11680361
    • 2007-02-28
    • Juergen HenrichMichael SchaeferEdgar Haberkorn
    • Juergen HenrichMichael SchaeferEdgar Haberkorn
    • C23C16/455
    • C23C16/54
    • A process chamber 1 for PECVD (Plasma Enhanced Chemical Vapor Deposition) coating of a substrate includes an electrode, which is integrated in a contact frame, which is firmly connected to the recipient. A movable carrier in the process chamber carries at least one substrate. The carrier is transported by means of a driven roller positioner into the process chamber or out of the process chamber along a transport route defined by the movement. As soon as the carrier inside the recipient has reached a certain position, the lower roller positioner is uncoupled from carrier by lowering by means of a lifting device. In this regard, the carrier detaches itself from the upper roller positioner. Then, the carrier is accepted by a transfer device (not shown) and brought from the transport position laterally into a treatment position in contact with the contact frame. In this way, reliable contact is produced between the electrode and a counter-electrode provided in carrier. At the same time, other carriers, in so far as the contact frame is removed laterally far enough from the transport route, during the coating of the carrier, can be moved past this.
    • 用于基板的PECVD(等离子体增强化学气相沉积)涂层的处理室1包括集成在接触框架中的电极,其牢固地连接到接收器。 处理室中的可移动载体承载至少一个基板。 载体通过从动辊定位器沿着由运动限定的运输路线输送到处理室中或从处理室中输送。 一旦收件人内的承运人已经达到一定的位置,则下辊定位器通过借助于提升装置的下降而脱离载体。 在这方面,载体将自身从上辊定位器分离。 然后,托架被转移装置(未示出)接受,并从运输位置横向地进入与接触框架接触的处理位置。 以这种方式,在电极和设置在载体中的对电极之间产生可靠的接触。 同时,在载体的涂覆期间,其他载体,只要在接触框架从输送路线横向移开足够远的位置即可移动过去。