专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06410850B1 Cable enclosure assembly 失效
标题翻译：电缆外壳组件
公开(公告)号：US06410850B1
公开(公告)日：2002-06-25
申请号：US09500102
申请日：2000-02-08
申请人： John N. Abel , Richard Michael Flynn
发明人： John N. Abel , Richard Michael Flynn
IPC分类号： H02G318
CPC分类号： H02G3/14 , G02B6/3897 , G02B6/4466 , H02G3/32
摘要： The cable enclosure assembly of the present invention includes a cable enclosure base, a faceplate mount, a removable full-width bezel and a cover. The cable enclosure base attaches to a wall at a location where an optical fiber cable protrudes through the wall. The cable fiber passes through a cable enclosure base cutout formed in the cable enclosure base. Next, a faceplate is attached to the faceplate mount. The faceplate mount is then attached to the cable enclosure base via a pivot-and-mount configuration. The removable full-width bezel can be connected with the cable enclosure base at two positions, thereby enabling the positioning of the bezel within the cable enclosure base to be adjusted. Lastly, the cover is removably secured to the cable enclosure base.
摘要翻译：本发明的电缆外壳组件包括电缆外壳底座，面板安装座，可拆卸的全宽边框和盖。电缆外壳基座在光纤电缆穿过墙壁突出的位置处连接到墙壁。电缆光纤通过形成在电缆外壳基座中的电缆外壳基座切口。接下来，面板安装在面板安装座上。然后，面板安装座通过枢轴和安装配置连接到电缆外壳底座。可拆卸的全宽挡板可以在两个位置与电缆外壳底座连接，从而可以调整电缆外壳底座中的挡板的定位。最后，盖可拆卸地固定到电缆外壳基座。

2. 发明授权

US5930425A High density coupling module 失效
标题翻译：高密度耦合模块
公开(公告)号：US5930425A
公开(公告)日：1999-07-27
申请号：US63505
申请日：1998-04-21
申请人： John N. Abel , Richard Michael Flynn
发明人： John N. Abel , Richard Michael Flynn
IPC分类号： G02B6/38 , G02B6/36
CPC分类号： G02B6/3825
摘要： A high density optical fiber coupling strip has two buildout members, each of which has a mating surface. Each mating surface has formed thereon a footprint that is identical for each member, so that the mating surface, when abutted together mesh with each other in proper alignment, thereby aligning the members, and can then be joined by welding or similar means. Regardless of the connector type to be received by each member, the footprints insures that the members will be properly mated, thus making possible hybrid coupling strips as well as unitary strips.
摘要翻译：高密度光纤耦合条具有两个堆积部件，每个部件具有配合表面。每个配合表面在其上形成了对于每个构件相同的占地面积，使得配合表面在抵靠在一起时彼此正确对准地啮合，从而对准构件，然后可以通过焊接或类似方式连接。不管每个构件接收的连接器类型如何，足迹确保了构件将被适当配合，从而形成可能的混合耦合带以及整体条。

3. 发明授权

US5719437A Smart cards having thin die 失效
公开(公告)号：US5719437A
公开(公告)日：1998-02-17
申请号：US635072
申请日：1996-04-19
申请人： Mark Bradford Clifton , Richard Michael Flynn , Fred William Verdi
发明人： Mark Bradford Clifton , Richard Michael Flynn , Fred William Verdi
IPC分类号： H01L23/04 , G06K19/077 , H01L23/08 , H01C23/02 , H01C23/34 , H01C23/495
CPC分类号： G06K19/07728 , G06K19/07745 , H01L2924/0002
摘要： Thin semiconductor die, approximately 0.004 to 0.007 inches thick, are positioned substantially on the neutral plane of a smart card, the neutral plane defined as the plane of substantially no mechanical strain during flexure of the smart card, thereby providing smart cards having improved resistance to mechanical flexure, and/or smart cards having improved RF performance.

4. 再颁专利

USRE37637E1 Smart cards having thin die 有权
标题翻译：智能卡具有薄模
公开(公告)号：USRE37637E1
公开(公告)日：2002-04-09
申请号：US09433094
申请日：1999-11-03
申请人： Mark Bradford Clifton , Richard Michael Flynn , Fred William Verdi
发明人： Mark Bradford Clifton , Richard Michael Flynn , Fred William Verdi
IPC分类号： H01C2302
CPC分类号： G06K19/07728 , G06K19/07745 , H01L2924/0002 , H01L2924/00
摘要： Thin semiconductor die, approximately 0.004 to 0.007 inches thick, are positioned substantially on the neutral plane of a smart card, the neutral plane defined as the plane of substantially no mechanical strain during flexure of the smart card, thereby providing smart cards having improved resistance to mechanical flexure, and/or smart cards having improved RF performance.
摘要翻译：大约0.004至0.007英寸厚的薄半导体管芯基本位于智能卡的中性平面上，该中性面被定义为在智能卡弯曲期间基本上没有机械应变的平面，从而提供具有改进的抵抗力的智能卡机械挠曲和/或具有改进的RF性能的智能卡。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式