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USRE37637E1 Smart cards having thin die 有权
标题翻译：智能卡具有薄模
公开(公告)号：USRE37637E1
公开(公告)日：2002-04-09
申请号：US09433094
申请日：1999-11-03
申请人： Mark Bradford Clifton , Richard Michael Flynn , Fred William Verdi
发明人： Mark Bradford Clifton , Richard Michael Flynn , Fred William Verdi
IPC分类号： H01C2302
CPC分类号： G06K19/07728 , G06K19/07745 , H01L2924/0002 , H01L2924/00
摘要： Thin semiconductor die, approximately 0.004 to 0.007 inches thick, are positioned substantially on the neutral plane of a smart card, the neutral plane defined as the plane of substantially no mechanical strain during flexure of the smart card, thereby providing smart cards having improved resistance to mechanical flexure, and/or smart cards having improved RF performance.
摘要翻译：大约0.004至0.007英寸厚的薄半导体管芯基本位于智能卡的中性平面上，该中性面被定义为在智能卡弯曲期间基本上没有机械应变的平面，从而提供具有改进的抵抗力的智能卡机械挠曲和/或具有改进的RF性能的智能卡。

2. 发明授权

US5719437A Smart cards having thin die 失效
公开(公告)号：US5719437A
公开(公告)日：1998-02-17
申请号：US635072
申请日：1996-04-19
申请人： Mark Bradford Clifton , Richard Michael Flynn , Fred William Verdi
发明人： Mark Bradford Clifton , Richard Michael Flynn , Fred William Verdi
IPC分类号： H01L23/04 , G06K19/077 , H01L23/08 , H01C23/02 , H01C23/34 , H01C23/495
CPC分类号： G06K19/07728 , G06K19/07745 , H01L2924/0002
摘要： Thin semiconductor die, approximately 0.004 to 0.007 inches thick, are positioned substantially on the neutral plane of a smart card, the neutral plane defined as the plane of substantially no mechanical strain during flexure of the smart card, thereby providing smart cards having improved resistance to mechanical flexure, and/or smart cards having improved RF performance.

3. 发明授权

US06239359B1 Circuit board RF shielding 有权
标题翻译：电路板RF屏蔽
公开(公告)号：US06239359B1
公开(公告)日：2001-05-29
申请号：US09309943
申请日：1999-05-11
申请人： Peter Frederick Lilienthal, II , Fred William Verdi
发明人： Peter Frederick Lilienthal, II , Fred William Verdi
IPC分类号： H05K900
CPC分类号： H05K9/0028
摘要： An EMI shield for use on a printed wiring board (PWB) of a circuit pack includes an open-ended box-like structure having a laterally extending flange completely encircling the opening into the box-like structure. The box is of an EMI impervious material, preferably stainless steel. An electrically conductive O-ring gasket is disposed in a groove in the flange. Both the groove and the flange completely encircle the box opening. The shield is secured to a PWB by pegs secured to the flange at positions radially outwardly of the gasket and extending entirely through openings through the PWB. Preferred pegs comprises pairs of side-by-side prongs integral with the shield flange but extending downwardly therefrom. Each prong terminates in an oppositely directed, return-bent detent with the detent pairs functioning as a spring-biased latch for removably mounting the shield to the PWB.
摘要翻译：用于电路板的印刷电路板（PWB）的EMI屏蔽件包括开口的盒状结构，其具有完全环绕开口的横向延伸的凸缘进入盒状结构。该盒子是EMI不透水材料，优选不锈钢。导电O型圈垫片设置在凸缘的凹槽中。凹槽和凸缘都完全包围盒子开口。屏蔽件通过固定到凸缘的钉子固定到PWB，该垫片位于衬垫的径向外侧的位置处，并通过开口穿过PWB完全延伸。优选的销钉包括与屏蔽凸缘成一体但从其向下延伸的并排侧插脚对。每个插脚终止于相反导向的回弯定位器，止动对用作弹簧偏置闩锁，用于可拆卸地将屏蔽件安装到PWB上。

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