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    • 1. 发明授权
    • Methods and apparatus for sealing a chamber
    • 用于密封腔室的方法和装置
    • US08206075B2
    • 2012-06-26
    • US11145018
    • 2005-06-02
    • John M. WhiteShinichi KuritaWilliam N. SterlingYoshiaki Tanase
    • John M. WhiteShinichi KuritaWilliam N. SterlingYoshiaki Tanase
    • H01L21/67C23C16/00
    • H01L21/67126H01L21/67201
    • In certain aspects, a load lock chamber is provided that includes a body having at least one sealing surface wall including a sealing surface. The sealing surface wall has an opening adjacent the sealing surface adapted to input or output a substrate. The body further includes a plurality of side walls. The load lock chamber also includes a top coupled to the body. The top includes one or more openings that divide the top into a first portion and a second portion. The load lock chamber further includes one or more top sealing members adapted to cover each opening of the top. Each top sealing member absorbs a movement of the first portion of the top relative to the second portion of the top. Numerous other aspects are provided.
    • 在某些方面,提供了一种装载锁定室,其包括具有包括密封表面的至少一个密封表面壁的主体。 密封表面壁具有邻近密封表面的开口,适于输入或输出基底。 身体还包括多个侧壁。 负载锁定室还包括联接到主体的顶部。 顶部包括将顶部分成第一部分和第二部分的一个或多个开口。 负载锁定室还包括适于覆盖顶部的每个开口的一个或多个顶部密封构件。 每个顶部密封构件吸收顶部相对于顶部的第二部分的第一部分的运动。 提供了许多其他方面。
    • 2. 发明申请
    • HEATED SUBSTRATE SUPPORT FOR CHEMICAL VAPOR DEPOSITION
    • 用于化学蒸气沉积的加热基板支撑
    • US20100282603A1
    • 2010-11-11
    • US12845563
    • 2010-07-28
    • William N. SterlingJohn M. White
    • William N. SterlingJohn M. White
    • C23C14/34C23F1/00C23C16/44B29C65/00
    • C23C16/4586
    • A method and apparatus for making a heated substrate support assembly used in a processing chamber is provided. The processing chamber includes a substrate support assembly, having a first plate and a second plate with grooves disposed therein for receiving one or more heating elements, and a power source for heating the substrate support assembly. A first surface of the first plate and a second surface of the second plate include one or more matching structures disposed thereon, such that both plates can be compressed together by isostatic compression and form into a plate-like structure for supporting a substrate during substrate processing. In another embodiment, the first and second plates are compressed by applying pressure all around. In still another embodiment, compressing the first and second plates is performed at elevated temperature.
    • 提供了一种用于制造在处理室中使用的加热的衬底支撑组件的方法和装置。 处理室包括基板支撑组件,其具有第一板和第二板,其中设置有用于接收一个或多个加热元件的槽,以及用于加热基板支撑组件的电源。 第一板的第一表面和第二板的第二表面包括设置在其上的一个或多个匹配结构,使得两个板可以通过等静压压缩在一起,并形成用于在衬底处理期间支撑衬底的板状结构 。 在另一个实施例中,通过施加全部压力来压缩第一和第二板。 在另一个实施例中,压缩第一和第二板在升高的温度下进行。
    • 7. 发明授权
    • Floating slit valve for transfer chamber interface
    • 用于传送室接口的浮动狭缝阀
    • US08877553B2
    • 2014-11-04
    • US13195592
    • 2011-08-01
    • John M. WhiteShinichi KuritaTakayuki Matsumoto
    • John M. WhiteShinichi KuritaTakayuki Matsumoto
    • H01L21/00F16K51/02
    • F16K51/02Y10S438/905Y10T29/49412
    • The present invention generally comprises a floating slit valve for interfacing with a chamber. A floating slit valve moves or “floats” relative to another object such as a chamber. The slit valve may be coupled between two chambers. When a chamber coupled with the slit valve is heated, the slit valve may also be heated by conduction. As the slit valve is heated, it may thermally expand. When a vacuum is drawn in a chamber, the slit valve may deform due to vacuum deflection. By disposing a low friction material spacer between the chamber and the slit valve, the slit valve may not rub against the chamber during thermal expansion/contraction and/or vacuum deflection and thus, may not generate undesirable particle contaminants. Additionally, slots drilled through the chamber for coupling the slit valve to the chamber may be sized to accommodate thermal expansion/contraction and vacuum deflection of the slit valve.
    • 本发明通常包括用于与室连接的浮动狭缝阀。 浮动狭缝阀相对于诸如室的另一物体移动或“浮动”。 狭缝阀可以联接在两个腔室之间。 当与狭缝阀联接的室被加热时,狭缝阀也可以通过传导加热。 当狭缝阀被加热时,它可以热膨胀。 当在室中抽真空时,狭缝阀可能由于真空偏转而变形。 通过在室和狭缝阀之间设置低摩擦材料间隔件,狭缝阀在热膨胀/收缩和/或真空偏转期间可能不会摩擦室,因此不会产生不期望的颗粒污染物。 此外,穿过腔室钻出的狭缝阀可以被定尺寸以适应狭缝阀的热膨胀/收缩和真空偏转。