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    • 2. 发明授权
    • SRAM memory cell having reduced surface area
    • 具有减小的表面积的SRAM存储单元
    • US6040991A
    • 2000-03-21
    • US225074
    • 1999-01-04
    • John J. Ellis-MonaghanWilbur D. Pricer
    • John J. Ellis-MonaghanWilbur D. Pricer
    • G11C11/412H01L21/8244H01L27/11G11C11/00
    • G11C11/412
    • A Static RAM cell having a reduced surface area. The Static RAM cell includes a pair of P channel transistors and a pair of N channel transistors connected as a bistable latch. A first common source connection of the latch is connected to a Write Bit terminal and the remaining source connections of the latch are connected to complementary bit lines. A word line addressing the latch is provided through the transistors connected to the Bit Lines having shared body contact which permits reading and writing to the latch. During a write mode, the word line is connected to a potential which renders transistors connected to the complementary bit lines conductive, while the write bit connected to a potential which renders the remaining transistors nonconducting. During a read operation, one of the remaining transistors are rendered conductive, and the word line renders the set of transistors connected to the Bit Lines conductive so that the bit Lines are charged from the respective nodes of the latch.
    • 具有减小的表面积的静态RAM单元。 静态RAM单元包括一对P沟道晶体管和作为双稳态锁存器连接的一对N沟道晶体管。 锁存器的第一个公共源极连接连接到写入位端,并且锁存器的其余源极连接连接到互补位线。 通过连接到具有共享体接触的位线的晶体管提供寻址锁存器的字线,其允许读取和写入锁存器。 在写入模式期间,字线连接到使连接到互补位线的晶体管导通的电位,而写入位连接到使剩余晶体管不导通的电位。 在读取操作期间,剩余晶体管中的一个导通,并且字线使连接到位线的晶体管组导通,使得位线从锁存器的相应节点充电。
    • 6. 发明授权
    • Integrated high-performance decoupling capacitor and heat sink
    • 集成高性能去耦电容和散热片
    • US06548338B2
    • 2003-04-15
    • US09764504
    • 2001-01-17
    • Kerry BernsteinRobert M. GeffkenWilbur D. PricerAnthony K. StamperSteven H. Voldman
    • Kerry BernsteinRobert M. GeffkenWilbur D. PricerAnthony K. StamperSteven H. Voldman
    • H01L218238
    • H01L28/40H01L23/3672H01L23/3735H01L27/0805H01L2924/0002H01L2924/10158H01L2924/00
    • A significant and very effective decoupling capacitor and heat sink combination that, in a single structure provides both a heat sink and a decoupling capacitor in close proximity to the active circuit on the chip requiring either heat sinking or decoupling capacitance or both. This is achieved by forming on a semiconductor chip, having a buried oxide layer therein, an integrated high-performance decoupling capacitor that uses a metallic deposit greater than 30 microns thick formed on the back surface of the chip and electrically connected to the active chip circuit to result in a significant and very effective decoupling capacitor and heat sink in close proximity to the active circuit on the chip requiring such decoupling capacitance and heat sinking capabilities. The decoupling capacitance can use the substrate of the chip itself as one of the capacitive plates and a formed metallic deposit as the second capacitive plate which also serves as a heat sink for the active circuit formed in the chip. The structure thus provides both a significant and effective decoupling capacitance in close proximity to the active circuit on the chip requiring such decoupling capacitance as well as providing improved heat sinking for the decoupled active circuit.
    • 一种显着且非常有效的去耦电容器和散热器组合,其在单个结构中提供散热器和去耦电容器,其紧邻芯片上的有源电路,需要散热或去耦电容或两者兼有。 这通过在其中具有掩埋氧化物层的半导体芯片上形成集成的高性能去耦电容器来实现,所述高性能去耦电容器使用形成在芯片的背面上并且电连接到有源芯片电路的大于30微米厚的金属沉积物 导致显着且非常有效的去耦电容器和散热器紧邻芯片上的有源电路,需要这种去耦电容和散热能力。 去耦电容可以使用芯片本身的衬底作为电容板之一,并且形成金属沉积物作为第二电容板,其也用作形成在芯片中的有源电路的散热器。 因此,该结构提供了重要且有效的去耦电容,其紧邻芯片上的有源电路,需要这种去耦电容,并为解耦的有源电路提供改进的散热。
    • 7. 发明授权
    • Method and apparatus for allocating data and instructions within a shared cache
    • 用于在共享缓存内分配数据和指令的方法和装置
    • US06532520B1
    • 2003-03-11
    • US09394965
    • 1999-09-10
    • Alvar A. DeanMarc R. FaucherJohn W. GoetzKenneth J. GoodnowPaul T. GutwinStephen W. MahinWilbur D. Pricer
    • Alvar A. DeanMarc R. FaucherJohn W. GoetzKenneth J. GoodnowPaul T. GutwinStephen W. MahinWilbur D. Pricer
    • G06F1200
    • G06F12/121G06F12/127G06F2212/1021G06F2212/6042
    • A method and apparatus are provided for managing cache allocation for a plurality of data types in a unified cache having dynamically allocable lines for first type data and for second type data. Cache allocation is managed by counting misses to first type data and misses to second type data in the unified cache, and by determining when a difference between a number of first type data misses and a number of second type data misses crosses a preselected threshold. A replacement algorithm of the unified cache then is adjusted in response to the detected crossing of the preselected threshold, the adjusting step including increasing a replacement priority of the first type data lines in the cache. The replacement algorithm preferably is an LRU algorithm wherein the adjusting step includes incrementing an age indication of the first type data lines. Hardware for implementing the inventive cache allocation management method comprises a miss counter configured to increment its count in response to a miss to first type data signal on a first counter input and to output a first logic state on a first counter output when the counter's count exceeds a first predetermined count. A priority adjustment circuit coupled to the first counter output increases the replacement priority of the first type data relative to the replacement priority of the second type data in response to the first logic state output by the miss counter.
    • 提供了一种方法和装置,用于管理具有用于第一类型数据和第二类型数据的动态可分配行的统一高速缓存中的多个数据类型的高速缓存分配。 高速缓存分配通过对统一高速缓存中的第一类型数据和第二类型数据的丢失进行计数,并且通过确定多个第一类型数据丢失与多个第二类型数据丢失之间的差异何时穿过预选阈值来管理高速缓存分配。 然后,响应于检测到的预选阈值的交叉,调整统一高速缓存的替换算法,该调整步骤包括增加高速缓存中的第一类型数据线的替换优先级。 替换算法优选地是LRU算法,其中调整步骤包括递增第一类型数据线的年龄指示。 用于实现本发明的高速缓存分配管理方法的硬件包括错误计数器,其配置为响应于第一计数器输入上的第一类型数据信号的未命中而增加其计数,并且当计数器的计数超过时,在第一计数器输出上输出第一逻辑状态 第一预定计数。 耦合到第一计数器输出的优先级调整电路响应于未命中计数器输出的第一逻辑状态,增加第一类型数据相对于第二类型数据的替换优先级的替换优先级。
    • 9. 发明授权
    • Integrated high-performance decoupling capacitor and heat sink
    • 集成高性能去耦电容和散热片
    • US06236103B1
    • 2001-05-22
    • US09283828
    • 1999-03-31
    • Kerry BernsteinRobert M. GeffkenWilbur D. PricerAnthony K. StamperSteven H. Voldman
    • Kerry BernsteinRobert M. GeffkenWilbur D. PricerAnthony K. StamperSteven H. Voldman
    • H01L2900
    • H01L28/40H01L23/3672H01L23/3735H01L27/0805H01L2924/0002H01L2924/10158H01L2924/00
    • A significant and very effective decoupling capacitor and heat sink combination that, in a single structure provides both a heat sink and a decoupling capacitor in close proximity to the active circuit on the chip requiring either heat sinking or decoupling capacitance or both. This is achieved by forming on a semiconductor chip, having a buried oxide layer therein, an integrated high-performance decoupling capacitor that uses a metallic deposit greater than 30 microns thick formed on the back surface of the chip and electrically connected to the active chip circuit to result in a significant and very effective decoupling capacitor and heat sink in close proximity to the active circuit on the chip requiring such decoupling capacitance and heat sinking capabilities. The decoupling capacitance can use the substrate of the chip itself as one of the capacitive plates and a formed metallic deposit as the second capacitive plate which also serves as a heat sink for the active circuit formed in the chip. The structure thus provides both a significant and effective decoupling capacitance in close proximity to the active circuit on the chip requiring such decoupling capacitance as well as providing improved heat sinking for the decoupled active circuit.
    • 一种显着且非常有效的去耦电容器和散热器组合,其在单个结构中提供散热器和去耦电容器,其紧邻芯片上的有源电路,需要散热或去耦电容或两者兼有。 这通过在其中具有掩埋氧化物层的半导体芯片上形成集成的高性能去耦电容器来实现,所述高性能去耦电容器使用形成在芯片的背面上并且电连接到有源芯片电路的大于30微米厚的金属沉积物 导致显着且非常有效的去耦电容器和散热器紧邻芯片上的有源电路,需要这种去耦电容和散热能力。 去耦电容可以使用芯片本身的衬底作为电容板之一,并且形成金属沉积物作为第二电容板,其也用作形成在芯片中的有源电路的散热器。 因此,该结构提供了重要且有效的去耦电容,其紧邻芯片上的有源电路,需要这种去耦电容,并为解耦的有源电路提供改进的散热。