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1. 发明申请

US20050031259A1 Optical performance monitor 失效
标题翻译：光学性能监视器
公开(公告)号：US20050031259A1
公开(公告)日：2005-02-10
申请号：US10896779
申请日：2004-07-22
申请人： Jinxi Shen , Robert McLeod , Douglas Crafts , Barthelemy Fondeur , Yong Ding , Pang-Chen Sun
发明人： Jinxi Shen , Robert McLeod , Douglas Crafts , Barthelemy Fondeur , Yong Ding , Pang-Chen Sun
IPC分类号： G02B6/26
CPC分类号： H04B10/0795 , G02B6/12019
摘要： An apparatus for monitoring an input optical signal at a plurality of distinct optical frequencies is disclosed wherein a demultiplexing arrayed waveguide grating (AWG) having a plurality of M>1 Vernier input ports is disposed between an optical switch and a photodiode array coupled to the output ports of the AWG. In operation, the optical switch sequentially provides the input optical signal into each of the Vernier ports, and signals detected by photodiodes are stored in a memory unit. The apparatus is capable of monitoring the input optical signal with a frequency step which is M times smaller than a frequency spacing between the AWG transmission bands, and obtain M frequency-resolved readings from each photodiode.
摘要翻译：公开了一种用于监控多个不同光频率的输入光信号的装置，其中具有多个M> 1游标输入端口的解复用阵列波导光栅（AWG）被布置在光开关和耦合到输出端的光电二极管阵列之间特设工作组的港口。在操作中，光开关顺序地将输入光信号提供给每个游标端口，并且由光电二极管检测的信号被存储在存储器单元中。该装置能够以比AWG传输频带之间的频率间隔小M倍的频率步长来监测输入光信号，并且从每个光电二极管获得M个频率分辨的读数。

2. 发明申请

US20050018965A1 Dynamic optical demultiplexer/multiplexer formed within a PLC 有权
标题翻译：在PLC内形成的动态光解复用器/多路复用器
公开(公告)号：US20050018965A1
公开(公告)日：2005-01-27
申请号：US10878935
申请日：2004-06-28
申请人： Jinxi Shen , Anca Sala , David Dougherty , David Funk , Douglas Crafts , Barthelemy Fondeur , Pang-Chen Sun
发明人： Jinxi Shen , Anca Sala , David Dougherty , David Funk , Douglas Crafts , Barthelemy Fondeur , Pang-Chen Sun
IPC分类号： G02B6/34 , H04J14/02 , G02B6/28
CPC分类号： G02B6/12019 , H04J14/02
摘要： A demultiplexer/multiplexer is disclosed wherein an arrayed waveguide grating having a reflector at an end includes selectable signal path blockers. The arrayed waveguide device has a common input/output port for launching radiation in the form of an input signal having n wavelengths therein and for receiving back via the reflector at the input/output port a selected channel of the input signal. In operation a multiplexed signal have n channels is launched therein and a selected channel is output for analysis or further processing.
摘要翻译：公开了一种解复用器/多路复用器，其中在一端具有反射器的阵列波导光栅包括可选择的信号路径阻挡器。阵列波导器件具有用于以其中具有n个波长的输入信号的形式发射辐射的公共输入/输出端口，并且用于经由反射器在输入/输出端口处接收输入信号的选定通道的反射。在操作中，多路复用信号在其中发射n个信道，并且输出所选择的信道用于分析或进一步处理。

3. 发明申请

US20050117853A1 OPTICAL SUBASSEMBLY 有权
标题翻译：光学分层
公开(公告)号：US20050117853A1
公开(公告)日：2005-06-02
申请号：US09752881
申请日：2000-12-28
申请人： Venkatesan Murali , Douglas Crafts , Suresh Ramalingam , Brett Zaborsky , Siegfried Fleischer
发明人： Venkatesan Murali , Douglas Crafts , Suresh Ramalingam , Brett Zaborsky , Siegfried Fleischer
IPC分类号： G02B6/42 , G02B6/36
CPC分类号： G02B6/4246 , G02B6/4214 , G02B6/4292
摘要： An apparatus including a base having a first opening of a dimension suitable to pass a light emission therethrough, a first side wall coupled to the base and having a second opening of a dimension suitable to pass a light emission therethrough, a second side wall coupled to the base and having a reflective component thereon, and the base, the first side wall, and the second side wall define an interior chamber with the reflective component disposed in the interior chamber; and a fiber connector extending from an exterior of the first side wall adjacent the second opening. A method including powering a laser disposed in a substrate coupling a fiber optic cable to an optical subassembly; and aligning the optical assembly over the transceiver board to capture the emitted light from the laser in the fiber optic cable.
摘要翻译：一种装置，包括具有第一开口的基座，该第一开口的尺寸适于通过其中的光发射;第一侧壁，其耦合到所述基座并且具有适于使光发射通过的尺寸的第二开口;第二侧壁，所述底座并且在其上具有反射部件，并且所述基座，所述第一侧壁和所述第二侧壁限定内部腔室，所述反射部件设置在所述内部腔室中; 以及从邻近第二开口的第一侧壁的外部延伸的光纤连接器。一种方法，包括为将光纤电缆耦合到光学子组件的基板中的激光器供电; 并且将光学组件对准在收发器板上以捕获来自光纤电缆中的激光器的发射光。

4. 发明申请

US20130042913A1 SHIELDED ELECTRICAL CONTACT AND DOPING THROUGH A PASSIVATING DIELECTRIC LAYER IN A HIGH-EFFICIENCY CRYSTALLINE SOLAR CELL, INCLUDING STRUCTURE AND METHODS OF MANUFACTURE 有权
标题翻译：通过在高效晶体太阳能电池中的钝化电介质层进行屏蔽电接触和掺杂，包括结构和制造方法
公开(公告)号：US20130042913A1
公开(公告)日：2013-02-21
申请号：US13637176
申请日：2011-03-25
申请人： Douglas Crafts , Oliver Schultz-Wittman
发明人： Douglas Crafts , Oliver Schultz-Wittman
IPC分类号： H01L31/0224 , H01L31/18
CPC分类号： H01L31/022425 , H01L31/02167 , H01L31/02363 , H01L31/02366 , H01L31/03529 , H01L31/1804 , H01L31/186 , H01L31/1868 , Y02E10/52 , Y02E10/547 , Y02P70/521
摘要： Solar cell structures and formation methods which utilize the surface texture in conjunction with a passivating dielectric layer to provide a practical and controllable technique of forming an electrical contact between a conducting layer and underlying substrate through the passivating dielectric layer, achieving both good surface passivation and electrical contact with low recombination losses, as required for high efficiency solar cells. The passivating dielectric layer is intentionally modified to allow direct contact, or tunnel barrier contact, with the substrate. Additional P-N junctions, and dopant gradients, are disclosed to further limit losses and increase efficiency.
摘要翻译：太阳能电池结构和形成方法利用表面纹理与钝化电介质层结合，提供通过钝化电介质层在导电层和下层衬底之间形成电接触的实用和可控技术，实现良好的表面钝化和电接触低复合损耗，如高效太阳能电池所需。钝化介电层被有意地修改为允许与衬底直接接触或隧道势垒接触。公开了附加的P-N结和掺杂剂梯度以进一步限制损耗并提高效率。

5. 发明授权

US08236604B2 Fine line metallization of photovoltaic devices by partial lift-off of optical coatings 有权
标题翻译：通过光学涂层的部分剥离对光伏器件进行细线金属化
公开(公告)号：US08236604B2
公开(公告)日：2012-08-07
申请号：US13027576
申请日：2011-02-15
申请人： Oliver Schultz-Wittmann , Douglas Crafts , Denis DeCeuster , Adrian Turner
发明人： Oliver Schultz-Wittmann , Douglas Crafts , Denis DeCeuster , Adrian Turner
IPC分类号： H01L21/28
CPC分类号： H01L31/022425 , H01L31/02168 , Y02E10/50
摘要： A metal grid contact and dielectric pattern on a layer requiring conductive contact in a photovoltaic device. The invention includes, in one aspect, forming a metal film; forming an etch resist over the metal film by, e.g., directly writing and in-situ curing the etch resist using, e.g., ink-jetting or screen-printing; etching the metal film leaving the resist pattern and a metal grid contact pattern under the etch resist intact; forming a dielectric layer over the etch resist; and removing the resist pattern and the dielectric over the etch resist, leaving a substantially co-planar metal grid contact and dielectric pattern. The metal grid contact pattern may form the front and/or back contact electrode of a solar cell; and the dielectric layer may be an optical reflection or antireflection layer. The layer requiring contact may be multifunctional providing its own passivation, such that passivation is substantially not required in the dielectric layer.
摘要翻译：在光伏器件中需要导电接触的层上的金属栅极接触和电介质图案。本发明在一个方面包括形成金属膜; 通过例如使用例如喷墨或丝网印刷直接写入和原位固化蚀刻抗蚀剂，在金属膜上形成蚀刻抗蚀剂; 蚀刻离开抗蚀剂图案的金属膜和蚀刻抗蚀剂下方的金属栅格接触图案完整; 在所述抗蚀剂上形成介电层; 并且在抗蚀剂上去除抗蚀剂图案和电介质，留下基本上共平面的金属栅极接触和电介质图案。金属栅格接触图案可以形成太阳能电池的前和/或后接触电极; 并且电介质层可以是光学反射或抗反射层。需要接触的层可以是多功能的，提供其自身的钝化，使得在介电层中基本上不需要钝化。

6. 发明申请

US20060034561A1 Planar lightwave circuit package 有权
标题翻译：平面光波电路封装
公开(公告)号：US20060034561A1
公开(公告)日：2006-02-16
申请号：US11200696
申请日：2005-08-10
申请人： Douglas Crafts , James Farrell , Mark Farrelly , Duane Cook , Satyanarayana Peddada
发明人： Douglas Crafts , James Farrell , Mark Farrelly , Duane Cook , Satyanarayana Peddada
IPC分类号： G02B6/12
CPC分类号： G02B6/12019 , G02B6/12004 , G02B6/4206 , G02B6/4214 , G02B6/4249
摘要： An optical packaging arrangement combines a planar lightwave circuit (PLC) having an array of waveguides thereon, an array of photodetectors on a substrate to receive light beams coupled out of the PLC by the output ports, and a collimating faceplate, having a plurality of glass cores, extending between the PLC and the photodetector array for coupling the output light beams to respective photodetectors. The faceplate forms a cover for a hermetic cavity encompassing the photodetectors. The PLC is disposed either co-planarly with the faceplate or transversely to it. Light from the PLC is tapped via a plurality of taps formed on the PLC for coupling to the photodetectors.
摘要翻译：光学封装装置将具有波导阵列的平面光波电路（PLC），基板上的阵列的光电检测器组合，以接收由输出端口耦合到PLC外的光束;以及准直面板，具有多个玻璃芯，在PLC和光电检测器阵列之间延伸，用于将输出光束耦合到相应的光电检测器。面板形成用于包围光电检测器的密封腔的盖。 PLC与面板共面或横向地布置。来自PLC的光通过形成在PLC上的多个抽头被分接，以耦合到光电检测器。

7. 发明申请

US20060070883A1 Fixtureless vertical paddle electroplating cell 审中-公开
标题翻译：无夹钳垂直电镀电镀槽
公开(公告)号：US20060070883A1
公开(公告)日：2006-04-06
申请号：US10958161
申请日：2004-10-04
申请人： Lincoln Bejan , Douglas Crafts , Steve Swain , Duy Trang
发明人： Lincoln Bejan , Douglas Crafts , Steve Swain , Duy Trang
IPC分类号： C25D5/02 , C25D17/00
CPC分类号： C25D17/001 , C25D17/00 , C25D17/004 , C25D17/007 , C25D17/06
摘要： A submersible assembly for exposing respective front surfaces of different work-pieces to an electroplating bath as a partial respective electrodes thereof, while protecting opposing, rear surfaces of the work-pieces from the bath. The assembly includes a wall, having a front surface also partially forming a first electrode of the bath, and having an opening smaller in size than the perimeter of a work-piece while substantially corresponding in size to the portion of the front surface of the work-piece to be exposed to the bath. The assembly also includes a chuck mechanism for applying pressure against the rear surface of the work-piece to thereby hold the work-piece against a rear surface of the wall and create a fluid-tight seal between the rear surface of the wall and the perimeter of the front surface of the work-piece, thereby exposing the front surface of the work-piece to the bath while protecting the rear surface of the work-piece from exposure to the bath.
摘要翻译：一种用于将不同工件的各个前表面暴露于电镀浴作为其部分相应电极的潜水组件，同时保护工件的相对的后表面与熔池相对。该组件包括壁，其前表面也部分地形成浴槽的第一电极，并且具有比工件的周边更小的开口，同时基本上对应于工件前表面部分的尺寸衣服要暴露在浴缸里。组件还包括用于向工件的后表面施加压力的卡盘机构，从而将工件保持在壁的后表面上，并在壁的后表面与周边之间产生流体密封的工件的前表面，从而将工件的前表面暴露于浴中，同时保护工件的后表面免于暴露于浴中。

8. 发明申请

US20060001310A1 Multi-leaded lug bolt for accelerated wheel removal and attachment 审中-公开
标题翻译：多引脚凸耳螺栓用于加速车轮拆卸和附接
公开(公告)号：US20060001310A1
公开(公告)日：2006-01-05
申请号：US11171930
申请日：2005-06-30
申请人： Douglas Crafts , Steve Swain , Duane Cook , Gilbert Rothweiler
发明人： Douglas Crafts , Steve Swain , Duane Cook , Gilbert Rothweiler
IPC分类号： B60B1/00
CPC分类号： B60B3/16
摘要： A lug bolt adapted for use on an automobile having at least a double lead to decrease the number turns a lug nut requires to screw the lug nut onto the lug bolt. The lug bolt may comprise a triple or quadruple lead, or even more leads. A racing automobile may be provided having the lug bolt for the mounting of a wheel thereon using a correspondingly-leaded lug nut. The racing automobile may be a NASCAR automobile, in one embodiment.
摘要翻译：适用于具有至少双引线以减少数量的汽车上的凸耳螺栓需要将凸耳螺母拧到凸耳螺栓上。凸耳螺栓可以包括三重或四重引线，或甚至更多引线。可以提供具有用于使用相应引线的凸耳螺母来安装车轮的凸耳螺栓的赛车。在一个实施例中，赛车可能是NASCAR汽车。

9. 发明申请

US20050180716A1 Alignment of fiber optic bundle to array waveguide using pins 审中-公开
公开(公告)号：US20050180716A1
公开(公告)日：2005-08-18
申请号：US11102495
申请日：2005-04-08
申请人： Douglas Crafts
发明人： Douglas Crafts
IPC分类号： G02B6/30 , G02B6/36 , G02B6/38 , G02B6/00
CPC分类号： G02B6/30 , G02B6/3636 , G02B6/3652 , G02B6/3692 , G02B6/3885
摘要： A device and method for aligning a fiber optic bundle with an array waveguide uses pins that partially extend into both the fiber optic bundle and the array waveguide to achieve course alignment. In one embodiment, the pins are inserted into holes formed by V-grooves in the fiber optic bundle. Finely aligning the fiber optic bundle and the array waveguide may be done by manual adjustment.

10. 发明授权

US5257162A Bellows lid for c4 flip-chip package 失效
标题翻译：波纹管盖用于c4倒装芯片封装
公开(公告)号：US5257162A
公开(公告)日：1993-10-26
申请号：US979636
申请日：1992-11-20
申请人： Douglas Crafts
发明人： Douglas Crafts
IPC分类号： H01L23/04 , H01L23/367 , H05K7/20
CPC分类号： H01L23/3675 , H01L23/04 , H01L2924/01079 , H01L2924/16152
摘要： An electronic package that has a lid that is in direct contact with an integrated circuit that is mounted to a substrate. The lid includes a plate portion that is in contact with the integrated circuit, an outer frame portion that is attached to the substrate, and a bellows portion that couples the plate portion to the outer frame portion.
摘要翻译：具有与安装到基板的集成电路直接接触的盖的电子封装。盖包括与集成电路接触的板部分，附接到基板的外框部分和将板部分连接到外框部分的波纹部分。

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