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    • 1. 发明申请
    • OPTICAL SUBASSEMBLY
    • 光学分层
    • US20050117853A1
    • 2005-06-02
    • US09752881
    • 2000-12-28
    • Venkatesan MuraliDouglas CraftsSuresh RamalingamBrett ZaborskySiegfried Fleischer
    • Venkatesan MuraliDouglas CraftsSuresh RamalingamBrett ZaborskySiegfried Fleischer
    • G02B6/42G02B6/36
    • G02B6/4246G02B6/4214G02B6/4292
    • An apparatus including a base having a first opening of a dimension suitable to pass a light emission therethrough, a first side wall coupled to the base and having a second opening of a dimension suitable to pass a light emission therethrough, a second side wall coupled to the base and having a reflective component thereon, and the base, the first side wall, and the second side wall define an interior chamber with the reflective component disposed in the interior chamber; and a fiber connector extending from an exterior of the first side wall adjacent the second opening. A method including powering a laser disposed in a substrate coupling a fiber optic cable to an optical subassembly; and aligning the optical assembly over the transceiver board to capture the emitted light from the laser in the fiber optic cable.
    • 一种装置,包括具有第一开口的基座,该第一开口的尺寸适于通过其中的光发射;第一侧壁,其耦合到所述基座并且具有适于使光发射通过的尺寸的第二开口;第二侧壁, 所述底座并且在其上具有反射部件,并且所述基座,所述第一侧壁和所述第二侧壁限定内部腔室,所述反射部件设置在所述内部腔室中; 以及从邻近第二开口的第一侧壁的外部延伸的光纤连接器。 一种方法,包括为将光纤电缆耦合到光学子组件的基板中的激光器供电; 并且将光学组件对准在收发器板上以捕获来自光纤电缆中的激光器的发射光。
    • 3. 发明授权
    • High frequency emmitter and detector packaging scheme for 10GB/S transceiver
    • 10GB / S收发器的高频发射器和检测器封装方案
    • US07008120B2
    • 2006-03-07
    • US10638005
    • 2003-08-08
    • Brett ZaborskyRao PeddadaAndrew AlduinoDouglas CraftsSiegfried Fleischer
    • Brett ZaborskyRao PeddadaAndrew AlduinoDouglas CraftsSiegfried Fleischer
    • G02B6/43
    • G02B6/4201G02B6/4214G02B6/4225G02B6/4226G02B6/423G02B6/4246G02B6/4277G02B6/4279
    • An apparatus and packaging scheme that ensures that alignments between signal sending and detecting components in transceivers are optimized and maintained over the lifetime of the apparatus. This is accomplished through use of a pair of polymer optical modules, which are used to couple light sent to and received from respective fiber optic cables. During a pre-alignment process, head portions of the polymer optical modules are inserted into respective slots defined in a standoff that is mounted on an optical sub-assembly to which an emitter and detector are mounted, whereby these slots are configured so that the head portions slide along the sidewalls of the slots during assembly. During a subsequent active alignment process, each polymer optical module is positioned relative to its respective emitter or detector until a maximum signal is detected, whereupon the position of the components is quick-set using a UV-sensitive adhesive.
    • 一种确保收发器中的信号发送和检测部件之间的对准的设备和封装方案在设备的寿命期内被优化和维护。 这通过使用一对聚合物光学模块来实现,所述聚合物光学模块用于将发送到相应光纤电缆并从其接收的光耦合。 在预对准过程中,聚合物光学模块的头部被插入限定在安装在安装有发射器和检测器的光学子组件的支座上的相应狭槽中,由此这些狭槽被构造成使得头部 在组装期间,部分沿槽的侧壁滑动。 在随后的主动对准过程中,每个聚合物光学模块相对于其相应的发射器或检测器定位,直到检测到最大信号为止,于是组件的位置使用UV敏感粘合剂快速设定。
    • 6. 发明授权
    • High frequency emitter and detector packaging scheme for 10GB/S transceiver
    • 用于10GB / S收发器的高频发射器和检测器封装方案
    • US06692161B2
    • 2004-02-17
    • US09823294
    • 2001-03-29
    • Brett ZaborskyRao PeddadaAndrew AlduinoDouglas CraftsSiegfried Fleischer
    • Brett ZaborskyRao PeddadaAndrew AlduinoDouglas CraftsSiegfried Fleischer
    • G02B643
    • G02B6/4201G02B6/4214G02B6/4225G02B6/4226G02B6/423G02B6/4246G02B6/4277G02B6/4279
    • An apparatus and packaging scheme that ensures that alignments between signal sending and detecting components in transceivers are optimized and maintained over the lifetime of the apparatus. This is accomplished through use of a pair of polymer optical modules, which are used to couple light sent to and received from respective fiber optic cables. During a pre-alignment process, head portions of the polymer optical modules are inserted into respective slots defined in a standoff that is mounted on an optical sub-assembly to which an emitter and detector are mounted, whereby these slots are configured so that the head portions slide along the sidewalls of the slots during assembly. During a subsequent active alignment process, each polymer optical module is positioned relative to its respective emitter or detector until a maximum signal is detected, whereupon the position of the components is quick-set using a UV-sensitive adhesive. Additional adhesive may then be added to further secure the components.
    • 一种确保收发器中的信号发送和检测部件之间的对准的设备和封装方案在设备的寿命期内被优化和维护。 这通过使用一对聚合物光学模块来实现,所述聚合物光学模块用于将发送到相应光纤电缆并从其接收的光耦合。 在预对准过程中,聚合物光学模块的头部被插入限定在安装在安装有发射器和检测器的光学子组件的支座上的相应狭槽中,由此这些狭槽被构造成使得头部 在组装期间,部分沿槽的侧壁滑动。 在随后的主动对准过程中,每个聚合物光学模块相对于其相应的发射器或检测器定位,直到检测到最大信号为止,于是组件的位置使用UV敏感粘合剂快速设定。 然后可以加入另外的粘合剂以进一步固定部件。
    • 10. 发明授权
    • Fine line metallization of photovoltaic devices by partial lift-off of optical coatings
    • 通过光学涂层的部分剥离对光伏器件进行细线金属化
    • US08236604B2
    • 2012-08-07
    • US13027576
    • 2011-02-15
    • Oliver Schultz-WittmannDouglas CraftsDenis DeCeusterAdrian Turner
    • Oliver Schultz-WittmannDouglas CraftsDenis DeCeusterAdrian Turner
    • H01L21/28
    • H01L31/022425H01L31/02168Y02E10/50
    • A metal grid contact and dielectric pattern on a layer requiring conductive contact in a photovoltaic device. The invention includes, in one aspect, forming a metal film; forming an etch resist over the metal film by, e.g., directly writing and in-situ curing the etch resist using, e.g., ink-jetting or screen-printing; etching the metal film leaving the resist pattern and a metal grid contact pattern under the etch resist intact; forming a dielectric layer over the etch resist; and removing the resist pattern and the dielectric over the etch resist, leaving a substantially co-planar metal grid contact and dielectric pattern. The metal grid contact pattern may form the front and/or back contact electrode of a solar cell; and the dielectric layer may be an optical reflection or antireflection layer. The layer requiring contact may be multifunctional providing its own passivation, such that passivation is substantially not required in the dielectric layer.
    • 在光伏器件中需要导电接触的层上的金属栅极接触和电介质图案。 本发明在一个方面包括形成金属膜; 通过例如使用例如喷墨或丝网印刷直接写入和原位固化蚀刻抗蚀剂,在金属膜上形成蚀刻抗蚀剂; 蚀刻离开抗蚀剂图案的金属膜和蚀刻抗蚀剂下方的金属栅格接触图案完整; 在所述抗蚀剂上形成介电层; 并且在抗蚀剂上去除抗蚀剂图案和电介质,留下基本上共平面的金属栅极接触和电介质图案。 金属栅格接触图案可以形成太阳能电池的前和/或后接触电极; 并且电介质层可以是光学反射或抗反射层。 需要接触的层可以是多功能的,提供其自身的钝化,使得在介电层中基本上不需要钝化。