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    • 4. 发明授权
    • Method of detecting semiconductor defects
    • 检测半导体缺陷的方法
    • US06297503B1
    • 2001-10-02
    • US09328560
    • 1999-06-09
    • Jeffrey B. BindellFrederick A. Stevie
    • Jeffrey B. BindellFrederick A. Stevie
    • H01L2144
    • H01J37/3056G01N1/32G01R31/303H01J2237/2817
    • A method of detecting defects within a semiconductor device is disclosed. An ion beam is focused in predetermined directions onto an area of a semiconductor device that is believed to have a suspected defect. A portion of the semiconductor device is milled and forms a thin film specimen to be removed from the semiconductor device. The thin film specimen is removed from the semiconductor device and placed onto an insulated film mount. Electrical connection points are created on previously unexposed portions of the thin film specimen by depositing a line of conductive material using a focused ion beam. The surface of the thin film specimen is scanned with an electron beam in a scanning electron microscope and observed for contrast. Processing errors are determined and the lateral resolution is about the electron beam size.
    • 公开了一种在半导体器件内检测缺陷的方法。 将离子束以预定的方向聚焦到被认为具有疑似缺陷的半导体器件的区域上。 半导体器件的一部分被研磨并形成要从半导体器件移除的薄膜样本。 将薄膜样品从半导体器件中取出并放置在绝缘膜安装座上。 通过使用聚焦离子束沉积导电材料线,在薄膜试样的先前未曝光部分上产生电连接点。 在扫描电子显微镜中用电子束扫描薄膜样品的表面并观察其对比度。 确定处理误差,横向分辨率约为电子束大小。