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    • 8. 发明授权
    • Anti-bridging solder ball collection zones
    • 抗桥接焊球收集区
    • US06316736B1
    • 2001-11-13
    • US09092821
    • 1998-06-08
    • Vivek Amir JairazbhoyRichard Keith McMillan
    • Vivek Amir JairazbhoyRichard Keith McMillan
    • H01R909
    • H05K3/3442H01L2224/10175H01L2924/384H01L2924/3841H05K1/111H05K3/3452H05K2201/0939H05K2201/0989H05K2201/10636H05K2201/10689Y02P70/611Y02P70/613
    • There is disclosed herein a printed circuit board (PCB) having improved resistance against solder bridging and component decentering/tombstoning. The printed circuit board (PCB) includes a substrate 10 having a top surface 12; at least two mounting pads 14 disposed on the top surface in matched relation with terminations 26 of an electronic component 24; and a solder mask 16 disposed on the top surface and having at least two apertures 18 therethrough, wherein each aperture generally conforms in shape with and is arranged about a respective one of the mounting pads 14. Each aperture 18 has at least one inner aperture edge 22i generally within a projected footprint F of the electronic component and at least one outer aperture edge 22o generally outside the footprint F. Each aperture 18 includes a notch 20 in one or more of the at least one outer aperture edge 22o, wherein each notch 20 extends generally outward from its respective mounting pad 14. The notch 20 provides a reservoir in the solder mask aperture 18 about each pad 14, into which flux, other solder paste effluents, and solder balls may be channeled and remain contained.
    • 这里公开了具有改进的抗焊料桥接和元件偏心/墓碑的电阻的印刷电路板(PCB)。 印刷电路板(PCB)包括具有顶面12的基板10; 至少两个安装焊盘14,其配置在与电子部件24的端子26相匹配的顶表面上; 以及设置在顶表面上并且具有穿过其中的至少两个孔18的焊接掩模16,其中每个孔基本上与形状相配合并围绕相应的一个安装焊盘14布置。每个孔18具有至少一个内孔边缘 22i通常在电子部件的投影占地面积F内和通常在封面F外部的至少一个外部孔边缘22o中。每个孔口18包括位于至少一个外部孔口边缘22o中的一个或多个中的凹口20,其中每个凹口20 凹槽20围绕每个焊盘14在焊料掩模孔18中提供储存器,焊剂,其它焊膏流出物和焊球可以被引导并保持在其中。