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1. 发明授权

US06501031B1 Electrical circuit board and a method for making the same 失效
标题翻译：电路板及其制造方法
公开(公告)号：US06501031B1
公开(公告)日：2002-12-31
申请号：US09655809
申请日：2000-09-06
申请人： Andrew Z. Glovatsky , Jay D. Baker , Robert Edward Belke , Myron Lemecha , Richard Keith McMillan , Thomas B. Krautheim
发明人： Andrew Z. Glovatsky , Jay D. Baker , Robert Edward Belke , Myron Lemecha , Richard Keith McMillan , Thomas B. Krautheim
IPC分类号： H05K111
CPC分类号： H05K3/445 , H05K3/386 , H05K3/4038 , H05K3/4092 , H05K2201/0305 , H05K2201/0361 , H05K2201/0394 , H05K2201/0397 , H05K2201/09554 , H05K2201/09581 , H05K2203/1438 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T29/49172
摘要： A multi-layer electronic circuit board design 10 having a core member 12, a pair of dielectric layers 14, 16 disposed thereon, and a first circuit portion 20 which is coupled to the dielectric layer 14 and core member 12 using a layer of adhesive material 18. Circuit board design 10 further having selectively formed “blind” apertures, vias or cavities 22 formed through the first circuit portion 20, dielectric layer 14, and adhesive layer 18, thereby exposing core member 12.
摘要翻译：具有芯构件12，设置在其上的一对电介质层14,16的多层电子电路板设计10以及使用粘合材料层连接到电介质层14和芯构件12的第一电路部分20 电路板设计10还具有选择性地形成通过第一电路部分20形成的“盲”孔，通孔或空腔22，电介质层14和粘合层18，从而露出芯构件12。

2. 发明授权

US06412168B1 Method of making an electrical circuit board 失效
标题翻译：制作电路板的方法
公开(公告)号：US06412168B1
公开(公告)日：2002-07-02
申请号：US09655750
申请日：2000-09-06
申请人： Andrew Z. Glovatsky , Jay D. Baker
发明人： Andrew Z. Glovatsky , Jay D. Baker
IPC分类号： H01K310
CPC分类号： H05K3/4038 , H05K3/386 , H05K3/44 , H05K2201/0305 , H05K2201/0361 , H05K2201/0397 , H05K2201/09554 , Y10T29/49126 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165
摘要： A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26.
摘要翻译：具有选择性地形成的孔或腔26的多层电子电路板设计10

3. 发明授权

US5579573A Method for fabricating an undercoated chip electrically interconnected to a substrate 失效
标题翻译：制造与基片电连接的底涂芯片的方法
公开(公告)号：US5579573A
公开(公告)日：1996-12-03
申请号：US320812
申请日：1994-10-11
申请人： Jay D. Baker , Cuong V. Pham , Robert E. Belke, Jr.
发明人： Jay D. Baker , Cuong V. Pham , Robert E. Belke, Jr.
IPC分类号： H01L21/56 , H05K3/34 , H01L21/50 , H05K3/38
CPC分类号： H01L24/29 , H01L21/563 , H01L24/32 , H01L2224/1319 , H01L2224/16225 , H01L2224/274 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83191 , H01L2224/83856 , H01L2924/01005 , H01L2924/01006 , H01L2924/01047 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , Y10T29/49144 , Y10T29/49146
摘要： Method for fabricating an undercoated chip electrically interconnected to a substrate. The method includes the initial step of depositing a predetermined quantity of a liquid undercoat material onto the chip or the substrate. The method continues with the step of interconnecting the chip to the substrate so as to form an electrical interconnection bond therebetween. Finally, the method concludes with the step of heating, reflowing and curing the undercoat material during or after the step of electrically interconnecting the chip to the substrate.
摘要翻译： `制造与基片电连接的底涂芯片的方法。该方法包括将预定量的液体底涂层材料沉积到芯片或基底上的初始步骤。该方法继续将芯片与衬底互连以在其间形成电互连结的步骤。最后，该方法的结论是在将芯片与衬底电互连的步骤期间或之后加热，回流和固化底涂层材料的步骤。

4. 发明授权

US5545073A Silicon micromachined CO.sub.2 cleaning nozzle and method 失效
标题翻译：硅微加工二氧化碳清洗喷嘴及方法
公开(公告)号：US5545073A
公开(公告)日：1996-08-13
申请号：US43943
申请日：1993-04-05
申请人： Lawrence L. Kneisel , Jay D. Baker , Lakhi N. Goenka
发明人： Lawrence L. Kneisel , Jay D. Baker , Lakhi N. Goenka
IPC分类号： B08B7/02 , B05B1/00 , B05B7/14 , B24C1/00 , B24C5/04 , B24C11/00
CPC分类号： B05B1/005 , B24C1/003 , B24C5/04 , B05B7/14
摘要： An apparatus and method for cleaning a workpiece with abrasive CO.sub.2 snow operates with a nozzle for creating and expelling the snow. The nozzle includes an upstream section for receiving CO.sub.2 in a gaseous form, and having a first contour shaped for subsonic flow of the CO.sub.2. The nozzle also includes a downstream section for directing the flow of the CO.sub.2 and the snow toward the workpiece, with the downstream section having a second contour shaped for supersonic flow of the CO.sub.2. The nozzle includes a throat section, interposed between the upstream and downstream sections, for changing the CO.sub.2 from the gaseous phase along a constant entropy line to a gas and snow mixture within the downstream section at a speed of at least Mach 1.0. In this manner, additional kinetic energy is imparted to the snow by delaying the conversion into the solid phase until the gaseous CO.sub.2 reaches supersonic speeds.
摘要翻译：用研磨二氧化碳雪清洁工件的设备和方法与用于产生和排出雪的喷嘴一起工作。喷嘴包括用于接收气体形式的CO 2的上游部分，并且具有成形为CO 2的亚音速流的第一轮廓。喷嘴还包括用于将CO 2和雪的流动引向工件的下游部分，其中下游部分具有成形为用于CO 2的超音速流动的第二轮廓。喷嘴包括插入在上游部分和下游部分之间的喉部，用于将CO 2从气相沿着恒定的熵线以至少马赫数为1.0的速度在下游部分内改变为气体和混合物。以这种方式，通过延迟转化为固相直到气态CO 2达到超音速速度，赋予雪额外的动能。

5. 发明授权

US5469329A Printed circuit board with bi-metallic heat spreader 失效
标题翻译：带双金属散热器的印刷电路板
公开(公告)号：US5469329A
公开(公告)日：1995-11-21
申请号：US287033
申请日：1994-08-08
申请人： Prathap A. Reddy , Jay D. Baker , Larry L. Kneisel
发明人： Prathap A. Reddy , Jay D. Baker , Larry L. Kneisel
IPC分类号： H01L23/36 , H05K7/20
CPC分类号： H05K7/20509 , H01L2924/0002
摘要： A printed wiring board adapted to mount electronic devices including one or more heat spreaders secured to the wiring board, the heat spreaders being formed of a material having high thermal conductivity, each heat spreader being adapted to support an electronic device which is bonded to the heat spreader, the portion of the heat spreader adjacent the electronic device having a metallic layer of low coefficient of thermal expansion that provides a localized area having a coefficient of thermal expansion that is approximately the same as that of the electronic device thereby tending to eliminate thermal stresses in the bond material used to attach the electronic device to the heat spreader, the relatively high thermally conductive material allowing thermal energy to be transferred effectively from the electronic device through the heat spreader to an adjacent heat sink.
摘要翻译：一种适于安装电子装置的印刷电路板，其包括固定到所述布线板的一个或多个散热器，所述散热器由具有高导热性的材料形成，每个散热器适于支撑结合到所述热的电子装置散热器，靠近电子设备的散热器的部分具有低热膨胀系数的金属层，其提供具有与电子设备大致相同的热膨胀系数的局部区域，从而有助于消除热应力在用于将电子设备连接到散热器的粘合材料中，相对高的导热材料允许热能从电子设备通过散热器有效地传递到相邻的散热器。

6. 发明授权

US4739917A Dual solder process for connecting electrically conducting terminals of electrical components to printed circuit conductors 失效
标题翻译：用于将电气元件的导电端子连接到印刷电路导体的双重焊接工艺
公开(公告)号：US4739917A
公开(公告)日：1988-04-26
申请号：US2486
申请日：1987-01-12
申请人： Jay D. Baker
发明人： Jay D. Baker
IPC分类号： B23K1/00 , B23K1/20 , B23K35/26 , H01R43/02 , H01R43/20 , H05K3/34 , B23K1/02 , B23K31/02
CPC分类号： B23K35/262 , B23K1/203 , B23K35/268 , H01R43/205 , H05K3/3421 , H05K3/3442 , H05K3/3484 , B23K2201/40 , B23K2201/42 , H01L2924/00013 , H01R43/02 , H05K2201/10636 , H05K2201/10689 , H05K2201/10727 , H05K2201/10992 , H05K2203/048 , H05K3/3463 , Y02P70/611 , Y02P70/613
摘要： A method of providing improved electrical and physical connections between the electrically conducting terminals of an electronic component and the conductors of a printed circuit board by utilizing a high temperature solder material formed in mounds on defined areas of the conductors, coating the mounds with low temperature solder paste and mating the terminals of the component to the mounds by forcing them through the low temperature solder coatings prior to reflowing and cooling the low temperature solder.

7. 发明授权

US07024067B2 Communication system with a signal conduction matrix and surface signal router 失效
公开(公告)号：US07024067B2
公开(公告)日：2006-04-04
申请号：US10268407
申请日：2002-10-10
申请人： Jay D. Baker , Zhong-You Shi , Lawrence L. Kneisel
发明人： Jay D. Baker , Zhong-You Shi , Lawrence L. Kneisel
IPC分类号： G02B6/26
CPC分类号： F02D41/28 , F02B75/22 , F02B77/085 , F02B77/089 , F02D2400/18 , F02M51/005 , F05C2225/08 , G01F23/2925 , G01L11/02 , G01L23/16 , G02B6/12004 , G02B6/12007 , G02B6/122 , G02B6/1221 , G02B6/4298 , G02B6/43 , G02B2006/12104 , G02B2006/12109 , G08C23/02 , G08C2201/31 , G08C2201/41
摘要： A signal transmission system comprising a signal conduction matrix formed into a shape that allows transmission of a signal through the matrix using at least one surface signal router, at least one signal source operatively connected to a surface of the matrix and that generates a signal that propagates through matrix, and at least one signal receiver operatively connected to a surface of the matrix and that receives the signal from the signal source. The signal may be coded, modulated, frequency-converted, or amplified. The surface signal router can be a reflective coating, an indentation, a pressure fit structure, or at least one inclined cut on the surface of the matrix. A frequency-selective filter can be used to allow selective detection by a target signal receiver. The invention is also directed to various method of transmitting a signal using a signal conduction matrix.

8. 发明授权

US06583385B1 Method for soldering surface mount components to a substrate using a laser 有权
标题翻译：使用激光将表面安装部件焊接到基板的方法
公开(公告)号：US06583385B1
公开(公告)日：2003-06-24
申请号：US10028417
申请日：2001-12-19
申请人： Peter Joseph Sinkunas , Zhong-You (Joe) Shi , Jay D. Baker
发明人： Peter Joseph Sinkunas , Zhong-You (Joe) Shi , Jay D. Baker
IPC分类号： B23K1005
CPC分类号： H05K3/3494 , B23K1/0016 , B23K1/0056 , B23K26/0838 , B23K26/10 , B23K2101/42 , H01R43/0221 , H01R43/0256
摘要： A method for reflowing a solder dispersed between a plurality electrical circuit conductor pads attached to a flexible substrate and at least one electronic component using a laser is disclosed. The method includes aligning the plurality of electric circuit conductor pads along a common axis, placing the at least one electronic component having a light colored surface side on a pair of the electrical circuit conductor pads wherein the light colored surface faces the laser, and sweeping the laser across a plurality of electronic components and conductor pads to reflow the solder without damaging the substrate.
摘要翻译：公开了一种用于回流分散在连接到柔性基板的多个电路导体焊盘和使用激光的至少一个电子部件之间的焊料的方法。该方法包括沿公共轴对准多个电路导体焊盘，将至少一个具有浅色表面侧的电子部件放置在一对电路导体焊盘上，其中浅色表面面对激光，并且扫掠激光穿过多个电子部件和导体焊盘以回流焊料而不损坏衬底。

9. 发明授权

US5116641A Method for laser scribing substrates 失效
标题翻译：激光切割基板的方法
公开(公告)号：US5116641A
公开(公告)日：1992-05-26
申请号：US570063
申请日：1990-08-20
申请人： Daxesh K. Patel , Jay D. Baker
发明人： Daxesh K. Patel , Jay D. Baker
IPC分类号： H01L27/01 , H01C17/00 , H01L21/70 , H05K1/03 , H05K1/09 , H05K1/16 , H05K3/00 , H05K3/28
CPC分类号： H01C17/00 , H01L21/705 , H05K3/0029 , H05K1/0306 , H05K1/092 , H05K1/16 , H05K1/167 , H05K2203/0769 , H05K2203/0783 , H05K2203/1383 , H05K3/0052 , H05K3/0097 , H05K3/28
摘要： A method is provided for forming a thick-film circuit having at least one thick-film resistor element upon a substrate and laser scribing the substrate to remove the circuit from the remaining portion of the substrate. A thick-film circuit comprising conductor lines and at least one resistor element is first printed upon a substrate. Thereafter, the resistor element may be laser trimmed to increase the resistance value thereof. After laser trimming, a protective material such as ethyl cellulose is coated onto the outer surface of the resistor element to protect it from hot-slag ceramic material generated during a laser scribing operation. The substrate is then topside laser scribed to separate the thick-film circuit from the remaining portion of the substrate. Following laser scribing, the protective material is removed by washing the resistor element with a solvent.

10. 发明授权

US07030977B2 Non-contact optical system for production testing of electronic assemblies 有权
标题翻译：用于电子组件生产测试的非接触式光学系统
公开(公告)号：US07030977B2
公开(公告)日：2006-04-18
申请号：US10430669
申请日：2003-05-06
申请人： Jay D. Baker , Charles F. Schweitzer , Zhong-You (Joe) Shi , William Zhang
发明人： Jay D. Baker , Charles F. Schweitzer , Zhong-You (Joe) Shi , William Zhang
IPC分类号： G01N21/00
CPC分类号： H05K13/08
摘要： The present invention provides a system for the contactless testing and configuring of electronic assemblies during the manufacturing process. The system includes an onboard optical transceiver, a system controller, and a controller optical transceiver. The onboard optical transceiver is located on the electronic assembly. The onboard optical transceiver is connected to an integrated circuit which is capable of performing functional tests or storing programs on the assembly. The controller optical transceiver is connected to the system controller and located adjacent to the electronic assembly. The onboard transceiver and the controller optical transceiver are used to establish a contactless communication link between the system controller and the electronic assembly. The contactless nature of the communication link allows the assembly to be transported past the controller optical transceiver by a simple conveyor while the system controller is communicating with the electronic assembly.
摘要翻译：本发明提供了一种用于在制造过程中非接触式测试和配置电子组件的系统。该系统包括板载光收发器，系统控制器和控制器光收发器。车载光收发器位于电子组件上。板载光收发器连接到能够对组件进行功能测试或存储程序的集成电路。控制器光收发器连接到系统控制器并位于电子组件附近。板载收发器和控制器光收发器用于在系统控制器和电子组件之间建立非接触式通信链路。通信链路的非接触性质允许组件通过简单的传送带传输通过控制器光收发器，同时系统控制器与电子组件通信。

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