专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070145438A1 PIXEL SENSOR CELL HAVING REDUCED PINNING LAYER BARRIER POTENTIAL AND METHOD THEREOF 有权
标题翻译：具有减少的钉扎层障碍物的像素传感器电池及其方法
公开(公告)号：US20070145438A1
公开(公告)日：2007-06-28
申请号：US11681454
申请日：2007-03-02
申请人： James Adkisson , Andres Bryant , John Ellis-Monaghan , Jeffrey Gambino , Mark Jaffe , Jerome Lasky , Richard Phelps
发明人： James Adkisson , Andres Bryant , John Ellis-Monaghan , Jeffrey Gambino , Mark Jaffe , Jerome Lasky , Richard Phelps
IPC分类号： H01L31/113
CPC分类号： H01L27/14689 , H01L27/14603 , H01L27/14609 , H01L31/0352
摘要： A pixel sensor cell structure and method of manufacture. The pixel cell comprises a doped layer formed adjacent to a first side of a transfer gate structure for coupling a collection well region and a channel region. Potential barrier interference to charge transfer caused by a pinning layer is reduced.
摘要翻译：像素传感器单元结构及其制造方法。像素单元包括与传输栅极结构的第一侧相邻形成的用于耦合收集阱区和沟道区的掺杂层。减少了由钉扎层引起的对电荷转移的电势障碍干扰。

2. 发明申请

US20070102738A1 LIGHT SHIELD FOR CMOS IMAGER 有权
标题翻译： CMOS成像器的光栅
公开(公告)号：US20070102738A1
公开(公告)日：2007-05-10
申请号：US11164072
申请日：2005-11-09
申请人： James Adkisson , Jeffrey Gambino , Mark Jaffe
发明人： James Adkisson , Jeffrey Gambino , Mark Jaffe
IPC分类号： H01L31/113 , H01L31/062
CPC分类号： H01L27/14623 , H01L27/14685
摘要： The present invention provides a light shield for shielding the floating diffusion of a complementary metal-oxide semiconductor (CMOS) imager. In accordance with an embodiment of the present invention, there is provided a pixel sensor cell including: a device region formed on a substrate; and a first layer of material forming a sidewall adjacent to a side of the device region for blocking electromagnetic radiation from the device region.
摘要翻译：本发明提供一种用于屏蔽互补金属氧化物半导体（CMOS）成像器的浮动扩散的遮光罩。根据本发明的实施例，提供了一种像素传感器单元，包括：形成在基板上的器件区域; 以及形成与所述器件区域的一侧相邻的侧壁的第一材料层，用于阻挡来自所述器件区域的电磁辐射。

3. 发明申请

US20060113622A1 A DAMASCENE COPPER WIRING IMAGE SENSOR 有权
标题翻译： DAMASCENE铜接线图像传感器
公开(公告)号：US20060113622A1
公开(公告)日：2006-06-01
申请号：US10904807
申请日：2004-11-30
申请人： James Adkisson , Jeffrey Gambino , Mark Jaffe , Robert Leidy , Anthony Stamper
发明人： James Adkisson , Jeffrey Gambino , Mark Jaffe , Robert Leidy , Anthony Stamper
IPC分类号： H01L31/00
CPC分类号： H01L27/14685 , H01L21/76819 , H01L21/76834 , H01L21/76838 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/14687
摘要： An image sensor array and method of fabrication wherein the sensor includes Copper (Cu) metallization levels allowing for incorporation of a thinner interlevel dielectric stack with improved thickness uniformity to result in a pixel array exhibiting increased light sensitivity. In the sensor array, each Cu metallization level includes a Cu metal wire structure formed at locations between each array pixel and, a barrier material layer is formed on top each Cu metal wire structure that traverses the pixel optical path. By implementing a single mask or self-aligned mask methodology, a single etch is conducted to completely remove the interlevel dielectric and barrier layers that traverse the optical path. The etched opening is then refilled with dielectric material. Prior to depositing the refill dielectric, a layer of either reflective or absorptive material is formed along the sidewalls of the etched opening to improve sensitivity of the pixels by either reflecting light to the underlying photodiode or by eliminating light reflections.
摘要翻译：一种图像传感器阵列和制造方法，其中传感器包括铜（Cu）金属化水平，允许结合更薄的层间电介质叠层，改进的厚度均匀性，以产生呈现增加的光敏度的像素阵列。在传感器阵列中，每个Cu金属化层包括在每个阵列像素之间的位置处形成的Cu金属线结构，并且阻挡材料层形成在穿过像素光路的每个Cu金属线结构上。通过实现单掩模或自对准掩模方法，进行单次蚀刻以完全去除穿过光路的层间电介质层和阻挡层。然后将蚀刻的开口用电介质材料重新填充。在沉积再充填电介质之前，沿蚀刻开口的侧壁形成反射或吸收材料层，以通过将光反射到下面的光电二极管或通过消除光反射来提高像素的灵敏度。

4. 发明申请

US20080073742A1 STACKED IMAGE PACKAGE 有权
标题翻译：堆叠图像包
公开(公告)号：US20080073742A1
公开(公告)日：2008-03-27
申请号：US11943277
申请日：2007-11-20
申请人： James Adkisson , Jeffrey Gambino , Mark Jaffe , Robert Leidy , Stephen Luce , Richard Rassell , Edmund Sprogis
发明人： James Adkisson , Jeffrey Gambino , Mark Jaffe , Robert Leidy , Stephen Luce , Richard Rassell , Edmund Sprogis
IPC分类号： H01L31/00 , H01L21/98
CPC分类号： H01L27/14618 , H01L25/0657 , H01L2224/13025 , H01L2224/16145 , H01L2224/16146 , H01L2224/16227 , H01L2224/17181 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/13091 , H01L2924/15151 , H01L2924/00014 , H01L2924/00
摘要： An imaging system for use in a digital camera or cell phone utilizes one chip for logic and one chip for image processing. The chips are interconnected using around-the-edge or through via conductors extending from bond pads on the active surface of the imaging chip to backside metallurgy on the imaging chip. The backside metallurgy of the imaging chip is connected to metallurgy on the active surface of the logic chip using an array of solder bumps in BGA fashion. The interconnection arrangement provides a CSP which matches the space constraints of a cell phone, for example. The arrangement also utilizes minimal wire lengths for reduced noise. Connection of the CSP to a carrier package may be either by conductive through vias or wire bonding. The CSP is such that the imaging chip may readily be mounted across an aperture in the wall of a cell phone, for example, so as to expose the light sensitive pixels on the active surface of said imaging chip to light.
摘要翻译：用于数码相机或手机的成像系统利用一个芯片用于逻辑和一个芯片用于图像处理。这些芯片使用围绕成像芯片的有源表面上的接合焊盘的边缘或通孔导体互连，从而在成像芯片上进行背面冶金。成像芯片的背面冶金采用BGA焊料凸块阵列与逻辑芯片的有源表面上的冶金连接。互连装置提供例如与手机的空间限制相匹配的CSP。该布置还利用最小的线长度来降低噪声。将CSP连接到载体封装可以通过通孔或引线键合导电。 CSP使得成像芯片可以容易地安装在例如手机的壁中的孔之间，以便将所述成像芯片的有效表面上的光敏像素曝光到光。

5. 发明申请

US20070158711A1 CMOS SENSORS HAVING CHARGE PUSHING REGIONS 失效
标题翻译：具有充电推动区域的CMOS传感器
公开(公告)号：US20070158711A1
公开(公告)日：2007-07-12
申请号：US11275497
申请日：2006-01-10
申请人： James Adkisson , Jeffrey Gambino , Mark Jaffe , Jeffrey Johnson , Jerome Lasky , Richard Rassel
发明人： James Adkisson , Jeffrey Gambino , Mark Jaffe , Jeffrey Johnson , Jerome Lasky , Richard Rassel
IPC分类号： H01L31/113 , H01L27/148 , H01L29/768
CPC分类号： H01L27/1462 , H01L27/14603 , H01L27/1463
摘要： Structures and method for forming the same. The semiconductor structure comprises a photo diode that includes a first semiconductor region and a second semiconductor region. The first and second semiconductor regions are doped with a first and second doping polarities, respectively, and the first and second doping polarities are opposite. The semiconductor structure also comprises a transfer gate that comprises (i) a first extension region, (ii) a second extension region, and (iii) a floating diffusion region. The first and second extension regions are in direct physical contact with the photo diode and the floating diffusion region, respectively. The semiconductor structure further comprises a charge pushing region. The charge pushing region overlaps the first semiconductor region and does not overlap the floating diffusion region. The charge pushing region comprises a transparent and electrically conducting material.
摘要翻译：结构及其形成方法。该半导体结构包括包含第一半导体区域和第二半导体区域的光电二极管。第一和第二半导体区域分别掺杂有第一和第二掺杂极性，并且第一和第二掺杂极性相反。半导体结构还包括传输门，其包括（i）第一延伸区，（ii）第二延伸区和（iii）浮动扩散区。第一和第二延伸区分别与光电二极管和浮动扩散区直接物理接触。半导体结构还包括电荷推送区域。电荷推送区域与第一半导体区域重叠，并且不与浮动扩散区域重叠。电荷推送区域包括透明且导电的材料。

6. 发明申请

US20070194397A1 PHOTO-SENSOR AND PIXEL ARRAY WITH BACKSIDE ILLUMINATION AND METHOD OF FORMING THE PHOTO-SENSOR 有权
标题翻译：具有背光照明的照相传感器和像素阵列以及形成照相传感器的方法
公开(公告)号：US20070194397A1
公开(公告)日：2007-08-23
申请号：US11276218
申请日：2006-02-17
申请人： James Adkisson , Jeffrey Gambino , Mark Jaffe , Alan Loiseau , Richard Rassel
发明人： James Adkisson , Jeffrey Gambino , Mark Jaffe , Alan Loiseau , Richard Rassel
IPC分类号： H01L31/0232 , H01L31/00
CPC分类号： H01L27/14643 , H01L27/14621 , H01L27/1463 , H01L27/1464 , H01L27/14689
摘要： An imaging sensor with an array of FET pixels and method of forming the imaging sensor. Each pixel is a semiconductor island, e.g., N-type silicon on a Silicon on insulator (SOI) wafer. FETs are formed in one photodiode electrode, e.g., a P-well cathode. A color filter may be attached to an opposite surface of island. A protective layer (e.g., glass or quartz) or window is fixed to the pixel array at the color filters. The image sensor may be illuminated from the backside with cell wiring above the cell. So, an optical signal passes through the protective layer is filtered by the color filters and selectively sensed by a corresponding photo-sensor.
摘要翻译：具有FET像素阵列的成像传感器和形成成像传感器的方法。每个像素是半导体岛，例如绝缘体上硅（SOI）晶片上的N型硅。 FET形成在一个光电二极管电极中，例如P阱阴极。滤色器可以附接到岛的相对表面。保护层（例如，玻璃或石英）或窗口在滤色器处固定到像素阵列。图像传感器可以从背面照亮，电池布线在电池单元上方。因此，通过保护层的光学信号被滤色器过滤并被相应的光电传感器选择性地感测。

7. 发明申请

US20070187787A1 PIXEL SENSOR STRUCTURE INCLUDING LIGHT PIPE AND METHOD FOR FABRICATION THEREOF 审中-公开
标题翻译：像素传感器结构包括光管及其制造方法
公开(公告)号：US20070187787A1
公开(公告)日：2007-08-16
申请号：US11276160
申请日：2006-02-16
申请人： Kristin Ackerson , James Adkisson , John Ellis-Monaghan , Jeffrey Gambino , Timothy Hoague , Mark Jaffe , Robert Leidy , Matthew Moon , Richard Passel
发明人： Kristin Ackerson , James Adkisson , John Ellis-Monaghan , Jeffrey Gambino , Timothy Hoague , Mark Jaffe , Robert Leidy , Matthew Moon , Richard Passel
IPC分类号： H01L27/14
CPC分类号： H01L27/14643 , H01L27/14625 , H01L27/14632 , H01L27/14636 , H01L27/14685 , H01L27/14687 , H01L27/14689
摘要： A pixel for an image sensor includes a photosensor located within a substrate. A patterned dielectric layer having an aperture registered with the photosensor is located over the substrate. A lens structure is located over the dielectric layer and also registered with the photosensor. A liner layer is located contiguously upon a top surface of the dielectric layer, and the sidewalls and bottom of the aperture. The liner layer provides for enhanced reflection for off-axis incoming light and enhanced capture thereof by the photosensor. When the aperture does not provide a dielectric layer border for a metallization layer embedded within the dielectric layer, an exposed edge of the metallization layer may be chamfered.
摘要翻译：用于图像传感器的像素包括位于衬底内的光电传感器。具有与光电传感器对准的孔径的图案化电介质层位于衬底上。透镜结构位于电介质层上方并且还与光电传感器配准。衬垫层连续地定位在电介质层的顶表面上，孔的侧壁和底部。衬垫层为离轴入射光提供增强的反射，并且通过光电传感器增强其捕获。当孔径不为嵌入在电介质层内的金属化层提供介电层边界时，金属化层的暴露边缘可以被倒角。

8. 发明申请

US20060186505A1 IMAGE SENSOR CELLS 有权
标题翻译：图像传感器细胞
公开(公告)号：US20060186505A1
公开(公告)日：2006-08-24
申请号：US10906510
申请日：2005-02-23
申请人： James Adkisson , John Ellis-Monaghan , Jeffrey Gambino , Mark Jaffe , Richard Rassel
发明人： James Adkisson , John Ellis-Monaghan , Jeffrey Gambino , Mark Jaffe , Richard Rassel
IPC分类号： H01L31/06
CPC分类号： H01L27/14609 , H01L27/1463 , H01L27/14641 , H01L27/14643 , H01L31/035281
摘要： A structure (and method for forming the same) for an image sensor cell. The structure includes (a) a semiconductor substrate; (b) a charge collection well on the substrate, the charge collection well comprising a semiconductor material doped with a first doping polarity; (c) a surface pinning layer on and in direct physical contact with the charge collection well, the surface pinning layer comprising a semiconductor material doped with a second doping polarity opposite to the first doping polarity; and (d) an electrically conducting push electrode being in direct physical contact with the surface pinning layer but not being in direct physical contact with the charge collection well.
摘要翻译：用于图像传感器单元的结构（及其形成方法）。该结构包括（a）半导体衬底; （b）在所述衬底上的电荷收集阱，所述电荷收集阱包括掺杂有第一掺杂极性的半导体材料; （c）与电荷收集阱直接物理接触的表面钉扎层，所述表面钉扎层包括掺杂有与第一掺杂极性相反的第二掺杂极性的半导体材料; 和（d）与表面钉扎层直接物理接触但不与电荷收集阱直接物理接触的导电推动电极。

9. 发明申请

US20060138480A1 A CMOS IMAGER WITH CU WIRING AND METHOD OF ELIMINATING HIGH REFLECTIVITY INTERFACES THEREFROM 有权
标题翻译：具有CU接线的CMOS成像器和消除其高反射性接口的方法
公开(公告)号：US20060138480A1
公开(公告)日：2006-06-29
申请号：US10905277
申请日：2004-12-23
申请人： James Adkisson , Jeffrey Gambino , Mark Jaffe , Robert Leidy , Richard Rassel , Anthony Stamper
发明人： James Adkisson , Jeffrey Gambino , Mark Jaffe , Robert Leidy , Richard Rassel , Anthony Stamper
IPC分类号： H01L31/113 , H01L31/0232 , H01L31/00
CPC分类号： H01L27/14636 , H01L21/76819 , H01L21/76834 , H01L27/14621 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/14645 , H01L27/14683
摘要： An image sensor and method of fabrication wherein the sensor includes Copper (Cu) metallization levels allowing for incorporation of a thinner interlevel dielectric stack to result in a pixel array exhibiting increased light sensitivity. The image sensor includes structures having a minimum thickness of barrier layer metal that traverses the optical path of each pixel in the sensor array or, that have portions of barrier layer metal selectively removed from the optical paths of each pixel, thereby minimizing reflectance. That is, by implementing various block or single mask methodologies, portions of the barrier layer metal are completely removed at locations of the optical path for each pixel in the array. In a further embodiment, the barrier metal layer may be formed atop the Cu metallization by a self-aligned deposition.
摘要翻译：一种图像传感器和制造方法，其中传感器包括铜（Cu）金属化水平，允许结合较薄的层间电介质堆叠以产生呈现增加的光敏度的像素阵列。图像传感器包括具有穿过传感器阵列中的每个像素的光路的阻挡层金属的最小厚度的结构，或者具有从每个像素的光路中选择性地去除的阻挡层金属的部分，从而使反射率最小化。也就是说，通过实现各种块或单掩模方法，在阵列中的每个像素的光路的位置处完全去除了阻挡层金属的部分。在另一个实施例中，阻挡金属层可以通过自对准沉积形成在Cu金属化之上。

10. 发明申请

US20080108170A1 CMOS IMAGER WITH CU WIRING AND METHOD OF ELIMINATING HIGH REFLECTIVITY INTERFACES THEREFROM 失效
标题翻译：具有CU布线的CMOS成像器和消除其高反射性接口的方法
公开(公告)号：US20080108170A1
公开(公告)日：2008-05-08
申请号：US11959841
申请日：2007-12-19
申请人： James Adkisson , Jeffrey Gambino , Mark Jaffe , Robert Leidy , Richard Rassel , Anthony Stamper
发明人： James Adkisson , Jeffrey Gambino , Mark Jaffe , Robert Leidy , Richard Rassel , Anthony Stamper
IPC分类号： H01L21/04
CPC分类号： H01L27/14636 , H01L21/76819 , H01L21/76834 , H01L27/14621 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/14645 , H01L27/14683
摘要： A CMOS image sensor and method of fabrication wherein the sensor includes Copper (Cu) metallization levels allowing for incorporation of a thinner interlevel dielectric stack to result in a pixel array exhibiting increased light sensitivity. The CMOS image sensor includes structures having a minimum thickness of barrier layer metal that traverses the optical path of each pixel in the sensor array or, that have portions of barrier layer metal selectively removed from the optical paths of each pixel, thereby minimizing reflectance. That is, by implementing various block or single mask methodologies, portions of the barrier layer metal are completely removed at locations of the optical path for each pixel in the array. In a further embodiment, the barrier metal layer may be formed atop the Cu metallization by a self-aligned deposition.
摘要翻译： CMOS图像传感器和制造方法，其中传感器包括铜（Cu）金属化水平，允许结合较薄的层间电介质堆叠以产生呈现增加的光灵敏度的像素阵列。 CMOS图像传感器包括具有穿过传感器阵列中的每个像素的光路的阻挡层金属的最小厚度的结构，或者具有从每个像素的光路中选择性地去除的阻挡层金属的部分，从而使反射率最小化的结构。也就是说，通过实现各种块或单掩模方法，在阵列中的每个像素的光路的位置处完全去除了阻挡层金属的部分。在另一个实施例中，阻挡金属层可以通过自对准沉积形成在Cu金属化之上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式