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    • 1. 发明授权
    • Channel design to reduce impact ionization in heterostructure
field-effect transistors
    • 通道设计,以减少异质结场场效应晶体管的影响电离
    • US6133593A
    • 2000-10-17
    • US358649
    • 1999-07-23
    • J. Brad BoosMing-Jey YangBrian R. BennettDoewon ParkWalter Kruppa
    • J. Brad BoosMing-Jey YangBrian R. BennettDoewon ParkWalter Kruppa
    • H01L29/10H01L29/20H01L29/778
    • H01L29/1029H01L29/7783H01L29/2003
    • Heterostructure field-effect transistors (HFETs) and other electronic devs are fabricated from a series of semiconductor layers to have reduced impact ionization. On to a first barrier layer there is added a unique second subchannel layer having high quality transport properties for reducing impact ionization. A third barrier layer having a controlled thickness to permit electrons to tunnel through the layer to the subchannel layer is added as a spacer for the fourth main channel layer. A fifth multilayer composite barrier layer is added which has at least a barrier layer in contact with the fourth channel layer and on top a sixth cap layer is applied. The device is completed by adding two ohmic contacts in a spaced apart relationship on the sixth cap layer with a Schottky gate between them which is formed in contact with the fifth barrier layer. The second subchannel layer and the fourth main channel layers are made of materials which have the proper respective energy gaps and ground state energies such that during use the transfer of hot electrons from the main channel into the subchannel is made probable to reduce impact ionization in the main channel. In the preferred AlSb/InAs-based HFETs, the use of an Is InAs subchannel layer under the main InAs channel improves the performance of the HEMTs particularly for gate lengths in the deep-submicron regime. The devices exhibit higher transconductance, lower output conductance, reduced gate leakage current, higher operating drain voltage, and improved frequency performance.
    • 异质结构场效应晶体管(HFET)和其他电子器件由一系列半导体层制造以具有减小的冲击电离。 在第一阻挡层上添加了具有高质量传输性质的独特的第二子通道层,用于减少冲击电离。 作为第四主沟道层的间隔物,添加具有受控厚度以允许电子穿过层到子沟道层的第三阻挡层。 添加了第五多层复合阻挡层,其至少具有与第四沟道层接触的阻挡层,并且在第六层上施加第六层。 通过在第六盖层上以间隔开的关系添加两个欧姆接触,在它们之间形成与第五阻挡层接触形成的肖特基门来完成该器件。 第二子沟道层和第四主沟道层由具有适当的相应能隙和基态能量的材料制成,使得在使用期间,热电子从主通道转移到子通道中是有可能减少在 主渠道 在优选的基于AlSb / InAs的HFET中,主InAs通道下的In InAs子通道层的使用改善了HEMT的性能,特别是对于深亚微米体系中的栅极长度。 器件表现出更高的跨导,更低的输出电导,降低的栅极漏电流,更高的工作漏极电压和改进的频率性能。
    • 3. 发明授权
    • Electronic devices with InAlAsSb/AlSb barrier
    • 具有InAlAsSb / AlSb屏障的电子设备
    • US5798540A
    • 1998-08-25
    • US848203
    • 1997-04-29
    • John Bradley BoosWalter KruppaDoewon ParkBrian R. Bennett
    • John Bradley BoosWalter KruppaDoewon ParkBrian R. Bennett
    • H01L21/308H01L21/338H01L29/201H01L29/205H01L29/778H01L29/812H01L29/00
    • H01L29/205H01L29/201H01L29/7783
    • An electronic device characterized by a GaAs substrate and a base disposed n the substrate, the base comprising InAs channel layer, AlSb layer above the channel layer, In.sub.x Al.sub.1-x As.sub.y Sb.sub.1-y layer containing at least In, Al, and As disposed above the AlSb channel layer, InAs cap layer disposed above and in contact with the In.sub.x Al.sub.1-x As.sub.y Sb.sub.1-y layer disposed below the InAs channel layer and in contact with the substrate, p.sup.+ GaSb layer disposed within the AlSb layer, Schottky gate with a pad disposed on and in contact with the In.sub.x Al.sub.1-x As.sub.y Sb.sub.1-y layer, at least one ohmic contact disposed on the InAs cap layer, and a trench extending through the base to the substrate isolating the gate bonding pad from the device and providing a gate air bridge which prevents contact between the gate and the InAs layer. The gate air bridge fabrication is accomplished by a liquid etchant containing more than half, on volume basis, of concentrated lactic acid or acetic acid with remainder hydrogen peroxide and concentrated hydrofluoric acid. The etchant attacks InAs, In.sub.x Al.sub.1-x As.sub.y Sb.sub.1-y, AlSb, and GaSb but does not attack GaAs and Au-based alloys.
    • 一种电子器件,其特征在于具有GaAs衬底和设置在衬底上的基极,所述基底包括InAs沟道层,在沟道层上方的AlSb层,InxAl1-xAsySb1-y层至少包含位于AlSb沟道上方的In,Al和As 层InAs覆盖层设置在InAs1沟道层下方并与衬底接触的In x Al 1-x As y Sb 1-y层上方并与之接触,设置在AlSb层内的p + GaSb层,具有布置在并且接触的焊盘的肖特基栅极 与InxAl1-xAsySb1-y层,设置在InAs覆盖层上的至少一个欧姆接触,以及延伸穿过基底到衬底的沟槽,将栅极焊盘与器件隔离,并提供栅极空气桥, 门和InAs层。 门空气桥的制造是通过液体蚀刻剂来实现的,该液体蚀刻剂含有一半以上的体积基础上的浓缩乳酸或乙酸,剩余的是过氧化氢和浓缩的氢氟酸。 蚀刻剂攻击InAs,InxAl1-xAsySb1-y,AlSb和GaSb,但不会侵蚀GaAs和Au基合金。
    • 5. 发明授权
    • Signaling protocol for concurrent bus access in a multiprocessor system
    • 用于多处理器系统中并发总线访问的信令协议
    • US5426740A
    • 1995-06-20
    • US181900
    • 1994-01-14
    • Brian R. Bennett
    • Brian R. Bennett
    • G06F13/20G06F13/36G06F13/00
    • G06F13/20G06F13/36
    • An improved signaling protocol for use in a multiprocessor system enables concurrent access to a common system bus during an I/O bus access. This reduces the system bus idling time without introducing complexities into the system bus architecture which might otherwise reduce the overall bus bandwidth increase. The improved bus architecture uses a system generated I/O bus busy (IOBUS.sub.-- BSY-) signal to indicate to all of the processors that the I/O bus is in use and that all other I/O requests must be held until the current transaction is completed. By preventing the other processors from executing an I/O request, the system bus does not have to be remain idle and can be used for memory-to-processor and for processor-to-processor transactions while the I/O bus is in use. By reducing the amount of time that the system bus is idle, the overall system bus performance is greatly increased.
    • 在多处理器系统中使用的改进的信令协议使得在I / O总线访问期间能够同时访问公共系统总线。 这减少了系统总线空闲时间,而不会将复杂性引入到系统总线架构中,否则可能会降低总线带宽增加。 改进的总线架构使用系统生成的I / O总线忙(IOBUS-BSY-)信号来向所有处理器指示I / O总线正在使用,并且所有其他I / O请求必须保持,直到当前 交易完成。 通过防止其他处理器执行I / O请求,系统总线不必保持空闲,并且可以在使用I / O总线时用于存储器到处理器和处理器到处理器事务 。 通过减少系统总线空闲的时间量,总体系统总线性能大大提高。
    • 9. 发明授权
    • External means of overriding and controlling cacheability attribute of
selected CPU accesses to monitor instruction and data streams
    • 覆盖和控制所选CPU访问的高速缓存属性的外部手段来监视指令和数据流
    • US5900014A
    • 1999-05-04
    • US769321
    • 1996-12-19
    • Brian R. Bennett
    • Brian R. Bennett
    • G06F11/25G06F11/34G06F11/36G06F12/08G06F11/30
    • G06F11/3656G06F11/348G06F12/0888G06F11/25G06F2201/885
    • A system for facilitating debugging of software running within an information processing unit includes an external trigger state machine which selectively overrides the cacheability attribute of a cache line. An in-circuit emulator (ICE), which is used for debugging purposes, monitors addresses read by and written to a CPU. If an address which is of interest for debugging purposes is detected by the ICE, then the ICE issues a trigger signal. The trigger signal causes the external trigger state machine to designate the cache line associated with the detected address as a non-cacheable operation (i.e., to override the cacheability attribute) . Thus, the data associated with the cache line is written out to the main memory module where the data can be observed by an ICE, rather than to an internal cache memory location where the data would be invisible to an ICE. In a preferred embodiment of the invention, the external trigger state machine is configured to operate in a pipelining environment wherein multiple requests may be outstanding at one time.
    • 用于促进在信息处理单元内运行的软件的调试的系统包括选择性地覆盖高速缓存行的高速缓存性属性的外部触发状态机。 用于调试目的的在线仿真器(ICE)监控由CPU读取和写入的地址。 如果由ICE检测到用于调试目的感兴趣的地址,则ICE发出触发信号。 触发信号使得外部触发状态机将与检测到的地址相关联的高速缓存行指定为非高速缓存操作(即,覆盖高速缓存属性)。 因此,与高速缓存线相关联的数据被写出到主存储器模块,其中可以由ICE观察数据,而不是内部高速缓冲存储器位置,其中数据将不可见于ICE。 在本发明的优选实施例中,外部触发状态机被配置为在流水线环境中操作,其中多个请求可能一次可能是未完成的。
    • 10. 发明授权
    • Bus control system and method that selectively generate an early address
strobe
    • 选择性地产生早期地址选通的总线控制系统和方法
    • US5404464A
    • 1995-04-04
    • US16726
    • 1993-02-11
    • Brian R. Bennett
    • Brian R. Bennett
    • G06F12/08G06F13/16G06F12/00G06F13/14
    • G06F12/0833G06F13/1663
    • An improved bus architecture system for use in a multi-processor computer system has a shared address bus and a shared data bus, and has at least two separate memory modules. The system reduces the bus latency time by allowing sequential address requests to different memory modules to begin before previous cycles are terminated. Preferably, the physical memory is mapped onto several separate memory modules which will increase the probability that concurrent address requests from different processors on the common bus are for different memory modules. The processor address determines which memory module contains the data for a new request. If the memory module addressed by the new request differs from the memory module addressed by the current request, the bus controller may issue an early address request for the new data. While the early address request for the new request is being processed, the current bus cycle for the data located in the first memory module is completed on the shared data bus. Thus, the bus latency in a tightly-coupled multi-processor system can be significantly reduced using the improved bus architecture.
    • 用于多处理器计算机系统的改进的总线架构系统具有共享地址总线和共享数据总线,并且具有至少两个单独的存储器模块。 该系统通过在先前的周期结束之前允许对不同存储器模块的顺序地址请求开始来减少总线等待时间。 优选地,物理存储器映射到几个单独的存储器模块上,这将增加公共总线上来自不同处理器的并发地址请求对于不同存储器模块的概率。 处理器地址确定哪个内存模块包含新请求的数据。 如果由新请求寻址的存储器模块与当前请求所寻址的存储器模块不同,则总线控制器可以对新数据发出早期地址请求。 当正在处理对新请求的早期地址请求时,位于第一存储器模块中的数据的当前总线周期在共享数据总线上完成。 因此,使用改进的总线架构可以显着减少紧耦合多处理器系统中的总线延迟。