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1. 发明授权

US4635910A Fluid-filled damper device 失效
标题翻译：流体填充阻尼器
公开(公告)号：US4635910A
公开(公告)日：1987-01-13
申请号：US729177
申请日：1985-05-01
申请人： Isao Ozawa , Noboru Ito , Masaaki Takizawa , Yoshio Ohta , Kiyoteru Ijichi
发明人： Isao Ozawa , Noboru Ito , Masaaki Takizawa , Yoshio Ohta , Kiyoteru Ijichi
IPC分类号： B60K5/12 , F16F13/00 , F16F13/18 , F16F13/26 , F16M5/00
CPC分类号： F16F13/26
摘要： A damper device including first and second support members, one of which is fixed to a support element and the other of which is fixed to a suspended element, an elastic block made of a deformable, elastic material for elastically coupling the two support members and a sealed space formed therein filled with a liquid. One partition member has its periphery fixed to the first support member and divides the sealed space into two chambers. The partition member has therein a member movable along a short distance. Fluid passages are formed in a wall portion of the first support member so as to communicate between the two chambers and to impart flow resistance to the liquid flowing therethrough. The partition member can be suspended to the first support member by an elastic sheet and be movable along the axial direction of the first support member. A solenoid is mounted on the inner wall of the first support member. When the solenoid is energized, the partition member can be fixed to the first support member. When the damper device is used in an engine suspension of a vehicle with vibrations of high frequency and small magnitude of vibration, relative movement of the first and second support members is damped by displacement of the movable member of the partition member. With low-frequency vibrations, vibrations having a relatively large magnitude are damped by the flow resistance of the liquid flowing through the fluid passages. When the engine is in the idling mode, the solenoid is deenergized, and the partition member is kept movable.
摘要翻译：一种阻尼器装置，包括第一和第二支撑构件，其中一个支撑构件固定到支撑元件，另一个固定到悬挂元件，弹性块由可变形的弹性材料制成，用于弹性地联接两个支撑构件和其中填充有液体形成的密封空间。一个分隔构件的周缘固定在第一支撑构件上，并将密封空间分成两个腔室。分隔构件中具有可沿短距离移动的构件。流体通道形成在第一支撑构件的壁部分中，以便在两个室之间连通并赋予流过其中的液体的流动阻力。分隔构件可以通过弹性片悬挂到第一支撑构件并且可沿第一支撑构件的轴向移动。螺线管安装在第一支撑构件的内壁上。当螺线管通电时，分隔构件可固定到第一支撑构件。当阻尼装置用于具有高频振动振动的车辆的发动机悬架中时，第一和第二支撑构件的相对运动通过分隔构件的可动构件的位移而被阻尼。通过低频振动，具有相对较大幅度的振动被流过流体通道的液体的流动阻力阻尼。当发动机处于怠速模式时，螺线管断电，分隔构件保持动作。

2. 发明申请

US20050236698A1 Semiconductor device in which semiconductor chip is mounted on lead frame 有权
标题翻译：其中半导体芯片安装在引线框架上的半导体器件
公开(公告)号：US20050236698A1
公开(公告)日：2005-10-27
申请号：US11114151
申请日：2005-04-26
申请人： Isao Ozawa , Akihito Ishimura , Yasuo Takemoto , Tetsuya Sato
发明人： Isao Ozawa , Akihito Ishimura , Yasuo Takemoto , Tetsuya Sato
IPC分类号： H01L25/18 , H01L23/495 , H01L23/50 , H01L25/065 , H01L25/07
CPC分类号： H01L24/49 , H01L23/4951 , H01L23/49558 , H01L23/49575 , H01L24/32 , H01L24/48 , H01L2224/32014 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2224/73265 , H01L2225/06562 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01037 , H01L2924/01058 , H01L2924/01075 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A lead frame has a plurality of first inner leads having distal end portions and parallel to each other, and a plurality of second inner leads having distal end portions opposing the distal end portions of the first inner leads, longer than the first inner leads, and parallel to each other. The semiconductor chip has a plurality of bonding pads arranged along one side of an element formation surface, and is mounted on the surfaces of the plurality of second inner leads using an insulating adhesive. The plurality of bonding wires include first bonding wires which electrically connect the distal end portions of the plurality of first inner leads to some of the plurality of bonding pads, and a plurality of second bonding wires which electrically connect the distal end portions of the plurality of second inner leads to the rest of the plurality of bonding pads.
摘要翻译：引线框架具有多个具有前端部并且彼此平行的第一内引线，以及多个第二内引线，其具有与第一内引线的远端部相对的前端部，比第一内引线长; 彼此平行。半导体芯片具有沿元件形成表面的一侧布置的多个焊盘，并且使用绝缘粘合剂安装在多个第二内引线的表面上。多个接合线包括将多个第一内部引线的前端部电连接到多个接合焊盘中的一些的第一接合线，以及多个第二接合线，其将多个第一内部引线的前端部第二内部引线到多个接合焊盘的其余部分。

3. 外观设计

USD256557S Packaging container 失效
公开(公告)号：USD256557S
公开(公告)日：1980-08-26
申请号：US870522
申请日：1978-01-18
申请人： Yoshitaka Ikushima , Isao Ozawa
设计人： Yoshitaka Ikushima , Isao Ozawa

4. 发明授权

US09173293B2 Memory module and video camera 有权
标题翻译：内存模块和摄像机
公开(公告)号：US09173293B2
公开(公告)日：2015-10-27
申请号：US13406892
申请日：2012-02-28
申请人： Yasuyuki Nagahara , Isao Ozawa
发明人： Yasuyuki Nagahara , Isao Ozawa
IPC分类号： G06F12/00 , H05K1/18 , G06F17/50 , G06F12/02 , G11C29/48 , G11C5/04 , G11C16/00 , G11C29/56 , H05K1/02
CPC分类号： G11C5/025 , G06F12/0246 , G06F17/5045 , G06F17/5068 , G06F17/5072 , G06F17/5077 , G06F17/5081 , G11C5/04 , G11C16/00 , G11C29/48 , G11C2029/5602 , H05K1/0268 , H05K1/181 , H05K2201/10159 , H05K2201/10189 , H05K2201/10545 , H05K2203/162 , Y02P70/611
摘要： According to the embodiments, there are provided semiconductor memories that are mounted individually on two sides of a mounting board; a controller that is mounted either on an obverse side or a reverse side of the mounting board, and performs read and write control of the semiconductor memories; and a connector that is deviated in a lateral direction from the controller so as not to overlap the controller, is mounted either on the obverse side or the reverse side of the mounting board, and transfers a signal exchanged between the controller and outside.
摘要翻译：根据实施例，提供了分别安装在安装板的两侧上的半导体存储器; 控制器，其安装在安装板的正面或反面上，并且执行对半导体存储器的读取和写入控制; 并且在控制器的横向上偏离控制器而不与控制器重叠的连接器安装在安装板的正面或反面上，并且传送在控制器和外部之间交换的信号。

5. 发明授权

US06791193B2 Chip mounting substrate, first level assembly, and second level assembly 失效
标题翻译：芯片安装基板，一级组件和二级组件
公开(公告)号：US06791193B2
公开(公告)日：2004-09-14
申请号：US10382020
申请日：2003-03-05
申请人： Shinya Watanabe , Isao Ozawa
发明人： Shinya Watanabe , Isao Ozawa
IPC分类号： H01L2348
CPC分类号： H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L25/105 , H01L2224/32225 , H01L2225/1023 , H01L2225/1058 , H01L2924/15173 , H01L2924/15311
摘要： A chip mounting substrate comprising: a mounting base defined by a first surface and a second surface opposite to the first surface; a plurality of first lands disposed on the first surface, being classified into first and second groups of the first lands; and a plurality of second lands disposed on the second surface so as to face to the first lands, being classified into first and second groups of the second lands.
摘要翻译：一种芯片安装基板，包括：由第一表面和与第一表面相对的第二表面限定的安装基座; 设置在所述第一表面上的多个第一平台，分为第一和第二组第一平台; 以及设置在所述第二表面上以面对所述第一平台的多个第二平台，被分为第一和第二组第二平台。

6. 发明授权

US4925058A Cup dispenser 失效
标题翻译：杯子分配器
公开(公告)号：US4925058A
公开(公告)日：1990-05-15
申请号：US261902
申请日：1988-10-25
申请人： Isao Ozawa
发明人： Isao Ozawa
IPC分类号： B65D83/00
CPC分类号： B65D83/00 , Y10T428/24628
摘要： The cup dispenser is disposed of an opening or openings 1b formed on one side face of the casing 1 of the dispenser and a receiving container 4 attached to each opening 1b provided with a cup pusher 41 connected to a coil spring 42. The opening 1b is attached with a delivery opening 3 which incorporates a membrane or membranes 32 each having a circular opening 32a. The set of cups 7 received in the receiving container 4 can be pulled out one by one through the delivery opening 3.
摘要翻译：杯分配器设置有形成在分配器的壳体1的一个侧面上的开口或开口1b，以及附接到每个开口1b的接收容器4，该容器4设置有连接到螺旋弹簧42的杯推动器41。附着有输送开口3，该输送开口3包括每个具有圆形开口32a的膜或膜32。容纳在接收容器4中的一组杯7可以通过输送口3一个一个地拉出。

7. 发明授权

US4360549A Molding 失效
标题翻译：成型
公开(公告)号：US4360549A
公开(公告)日：1982-11-23
申请号：US242983
申请日：1981-03-12
申请人： Isao Ozawa , Yutaka Nagai , Yoshihiro Menjo
发明人： Isao Ozawa , Yutaka Nagai , Yoshihiro Menjo
IPC分类号： B60R13/04 , B32B3/30
CPC分类号： B32B3/30 , B32B1/00 , B32B27/065 , B32B27/304 , B60R13/04 , Y10T428/233
摘要： In a molding composed of a molding body comprising a front surface, a bottom, a side portion and a hollow portion, and of an adhesive layer constituted at the bottom, the thin molding side portion extends along the front surface, and the bottom is provided with a projection which projects on one side or both sides of the bottom separate from the front surface and the molding side portion. When the front surface is pushed, the pushing force applied to the front surface produces the fulcrum of the bending moment at the molding side portion and the plane pressure from the fulcrum to the front surface in the direction towards the inside of the bottom, and at the same time the contact pressure applied to the point of action of force is distributed in the plane pressure distribution towards the front surface which attenuates from the peak value below the point of action of force to both sides gradually.
摘要翻译：在由包括前表面，底部，侧部和中空部分的成型体和由底部构成的粘合剂层构成的模制件中，薄模制侧部分沿着前表面延伸，并且底部设置其突出部在底部的一侧或两侧突出，与前表面和模制侧部分隔开。当前表面被推动时，施加到前表面的推力产生在模制侧部分处的弯矩的支点和从支点到前表面在朝向底部内侧的方向上的平面压力，并且在施加到力作用点的接触压力同时分布在朝向前表面的平面压力分布中，其逐渐从低于作用力点的峰值衰减到两侧。

8. 发明申请

US20130319953A1 BALLAST WATER TREATMENT APPARATUS AND BALLAST WATER TREATMENT METHOD 审中-公开
标题翻译：压载水处理设备和压汞处理方法
公开(公告)号：US20130319953A1
公开(公告)日：2013-12-05
申请号：US14000456
申请日：2012-07-23
申请人： Isao Ozawa , Munetsugu Ueyama , Ryusuke Nakai
发明人： Isao Ozawa , Munetsugu Ueyama , Ryusuke Nakai
IPC分类号： C02F1/00
CPC分类号： C02F1/00 , B01D29/21 , B01D29/54 , B01D29/6446 , B01D2201/583 , B63J4/002 , C02F1/004 , C02F2103/008
摘要： A ballast water treatment apparatus includes a filter that is cylindrically formed so as to surround an axis, a case that includes an outer cylindrical portion that is disposed so as to surround the filter, a rotation mechanism that rotates the filter around the axis, an untreated water nozzle that ejects untreated water to a filter-surrounding region that is defined by an outer peripheral surface of the filter and the outer cylindrical portion, a cleaning water nozzle that ejects cleaning water toward the outer peripheral surface of the filter, a filtered water channel through which filtered water that has passed through the filter flows from a region inside the filter to outside of the case, and a discharge channel through which discharged water that has not passed through the filter is discharged from the filter-surrounding region to outside of the case.
摘要翻译：一种压载水处理装置，包括以围绕轴线为圆筒状的过滤器，包括设置为围绕过滤器的外筒部的壳体，使过滤器绕轴线旋转的旋转机构，未处理水喷嘴，其将未处理的水喷射到由过滤器的外周面和外筒部限定的过滤器周围区域;清洗水喷嘴，其向清洗器的外周面排出清洗水;过滤水通道已通过过滤器的过滤水通过该过滤器从过滤器内部的区域流到壳体外部，并且未通过过滤器的排出水通过该排出通道从过滤器周围区域排出到外部案件。

9. 发明申请

US20100007014A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20100007014A1
公开(公告)日：2010-01-14
申请号：US12497045
申请日：2009-07-02
申请人： Hidetoshi Suzuki , Isao Ozawa , Atsushi Kaneko , Yuka Matsunaga
发明人： Hidetoshi Suzuki , Isao Ozawa , Atsushi Kaneko , Yuka Matsunaga
IPC分类号： H01L25/065
CPC分类号： H01L25/18 , H01L24/73 , H01L25/0657 , H01L27/11526 , H01L2224/04042 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45147 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2225/06558 , H01L2924/00011 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： According to an aspect of the invention, a semiconductor device includes: a semiconductor substrate; a memory chip disposed on the semiconductor substrate, the memory chip including: a first face that is not opposed to the semiconductor substrate; and a plurality of first pads disposed on the first face so that the first pads are aligned along a virtual line passing at a central portion on the first face; a controller chip disposed on the first face not to cover the first pads, the controller chip including: a second face that is not opposed to the first face; and a plurality of second pads disposed on the second face so that the second pads are aligned along at least one side of the second face; and a plurality of metal wires electrically connecting the first pads and the second pads.
摘要翻译：根据本发明的一个方面，半导体器件包括：半导体衬底; 设置在所述半导体基板上的存储芯片，所述存储芯片包括：不与所述半导体衬底相对的第一面; 以及设置在所述第一面上的多个第一焊盘，使得所述第一焊盘沿着通过所述第一面的中心部分的虚拟线对准; 控制器芯片，设置在所述第一面上，不覆盖所述第一焊盘，所述控制器芯片包括：第二面，其不与所述第一面相对; 以及设置在第二面上的多个第二垫，使得第二垫沿着第二面的至少一侧排列; 以及电连接第一焊盘和第二焊盘的多个金属线。

10. 发明授权

US07339257B2 Semiconductor device in which semiconductor chip is mounted on lead frame 有权
标题翻译：其中半导体芯片安装在引线框架上的半导体器件
公开(公告)号：US07339257B2
公开(公告)日：2008-03-04
申请号：US11114151
申请日：2005-04-26
申请人： Isao Ozawa , Akihito Ishimura , Yasuo Takemoto , Tetsuya Sato
发明人： Isao Ozawa , Akihito Ishimura , Yasuo Takemoto , Tetsuya Sato
IPC分类号： H01L23/495
CPC分类号： H01L24/49 , H01L23/4951 , H01L23/49558 , H01L23/49575 , H01L24/32 , H01L24/48 , H01L2224/32014 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2224/73265 , H01L2225/06562 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01037 , H01L2924/01058 , H01L2924/01075 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A lead frame has a plurality of first inner leads having distal end portions and parallel to each other, and a plurality of second inner leads having distal end portions opposing the distal end portions of the first inner leads, longer than the first inner leads, and parallel to each other. The semiconductor chip has a plurality of bonding pads arranged along one side of an element formation surface, and is mounted on the surfaces of the plurality of second inner leads using an insulating adhesive. The plurality of bonding wires include first bonding wires which electrically connect the distal end portions of the plurality of first inner leads to some of the plurality of bonding pads, and a plurality of second bonding wires which electrically connect the distal end portions of the plurality of second inner leads to the rest of the plurality of bonding pads.
摘要翻译：引线框架具有多个具有前端部并且彼此平行的第一内引线，以及多个第二内引线，其具有与第一内引线的远端部相对的前端部，比第一内引线长; 彼此平行。半导体芯片具有沿元件形成表面的一侧布置的多个焊盘，并且使用绝缘粘合剂安装在多个第二内引线的表面上。多个接合线包括将多个第一内部引线的前端部电连接到多个接合焊盘中的一些的第一接合线，以及多个第二接合线，其将多个第一内部引线的前端部第二内部引线到多个接合焊盘的其余部分。

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