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1. 发明公开

EP0544076A2 Reworkable module and method of fabricating the module 失效
标题翻译： UmarbeitungsfähigerModul und Verfahren zu seiner Herstellung。
公开(公告)号：EP0544076A2
公开(公告)日：1993-06-02
申请号：EP92116514.8
申请日：1992-09-26
申请人： International Business Machines Corporation
发明人： Grebe, Kurt Rudolph , McCreary, Jack Marlyn , Suryanarayana, Darbha , Tong, Ho-Ming
IPC分类号： H01L21/58 , H01L21/60 , H05K3/30
CPC分类号： H01L24/81 , H01L21/563 , H01L23/3135 , H01L2224/73203 , H01L2224/81801 , H01L2224/8192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K3/284 , Y10T29/49144 , Y10T29/49146 , H01L2924/00
摘要： Disclosed is a reworkable circuit package (1) formed by controlled collapse chip connection ("C4") bonding of integrated circuit chips (21) to circuit cards and boards (11), and direct chip attachment ("DCA") where an encapsulant (61) is disposed under the chip (21). The encapsulant (61) offers protection of the C4 connections and a thermal expansion matched to that of the C4 joints. The disclosed circuit package (1) overcomes the problem of non-reworkability by the provision of a passivating layer (51) of Parylene which is reworkable, dry processable, uniformly depositable by vapor phase deposition. Thin films on facing surfaces are formed with the 3-5 micron film thickness corresponding to the C4 lift-off distance.
摘要翻译：公开了一种通过将集成电路芯片（21）与电路卡和电路板的控制崩溃芯片连接（“C4”）接合形成的可再加工电路封装（1），以及直接芯片附接（“DCA”），其中密封剂芯片。密封剂提供C4连接的保护和与C4接头相匹配的热膨胀。所公开的电路封装通过提供可再加工的，可干法处理的，通过气相沉积均匀沉积的Parylene钝化层来克服不可再加工性的问题。形成相对于C4剥离距离的3-5微米薄膜厚度的面对表面的薄膜。

2. 发明公开

EP0446666A3 Solder interconnection structure on organic substrates and process for making 失效
标题翻译：有机基板上的焊接互连结构及其制造工艺
公开(公告)号：EP0446666A3
公开(公告)日：1992-01-08
申请号：EP91102393.5
申请日：1991-02-20
申请人： International Business Machines Corporation
发明人： Hsiao, Richard , McCreary, Jack Marlyn , Markovich, Voya Rista , Seraphim, Donald Phillip
IPC分类号： H01L23/29 , H01L21/60 , H01L21/58 , H01L23/556
CPC分类号： H01L24/81 , H01L21/563 , H01L23/145 , H01L23/295 , H01L2224/13111 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/0105 , H01L2924/01082 , H01L2924/01092 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , Y10T29/49144 , Y10T29/49146 , H01L2924/00
摘要： Solder interconnection whereby the gap created by solder connections between an organic substrate (2) and semiconductor device (1) is filled with a composition (7) obtained from curing a thermosetting preparation containing a thermosetting binder; and filler having a maximum particle size of 50 microns.

3. 发明公开

EP0622125A1 Fluid treatment apparatus 失效
标题翻译： Vorrichtung zur Behandlung vonGegenständenmitFlüssigkeiten。
公开(公告)号：EP0622125A1
公开(公告)日：1994-11-02
申请号：EP94105025.4
申请日：1994-03-30
申请人： International Business Machines Corporation
发明人： Bard, Steven Lindz , Bendz, Gerald Andrei , Canestaro, Michael James , Chapura, John Robert , Frankoski, Edward Jay , Horan, Michael Shawn , Jones, Jeffrey Donald , Kamperman, James Steven , Kjelgaard, John Robert, Jr. , McCreary, Jack Marlyn
IPC分类号： B05B15/04 , H05K3/00
CPC分类号： H05K3/0085 , B05B14/00 , Y02P70/36
摘要： A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article (11) and thereafter collected within the apparatus' common housing (13). The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injectors, each including at least two rows of fluid jet injectors (27) therein. The collected fluids are each returned to the respective impingement means (23, 41). Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occuring within the same housing chamber which serves to collect the first fluid.
摘要翻译：一种用于将第一和第二流体（例如蚀刻剂和水）施加到以预定速率穿过设备的制品（例如电路板）的流体处理装置和方法。第一流体冲击在物品（11）的表面上，然后收集在设备的公共壳体（13）内。第二流体冲击到制品的表面上并收集在同一壳体内，但在与收集的第一流体分开的位置处，以至少部分地防止其混合。用于实现流体冲击的优选方式包括单独的流体喷射器，每个液体喷射器在其中包括至少两排流体喷射喷射器（27）。所收集的流体各自返回到相应的冲击装置（23,41）。使用供应第二流体的泵来实现第二流体的补充，同时该装置还包括用于以与第二流体的供给速率相似的速率有效地去除第二流体的装置（例如排水管）。使用位于第一流体冲击装置相对（例如，在相对侧）上的合适的装置（例如，双辊），第一流体也保持在制品表面上方的确定水平。类似的第二流体的水平保持也是可能的。也定义了所收集的第二流体的级联，这发生在用于收集第一流体的相同壳体室内。

4. 发明公开

EP0446666A2 Solder interconnection structure on organic substrates and process for making 失效
标题翻译： Lötverbindungsstrukturauf organischen Substraten und Herstellungsverfahren。
公开(公告)号：EP0446666A2
公开(公告)日：1991-09-18
申请号：EP91102393.5
申请日：1991-02-20
申请人： International Business Machines Corporation
发明人： Hsiao, Richard , McCreary, Jack Marlyn , Markovich, Voya Rista , Seraphim, Donald Phillip
IPC分类号： H01L23/29 , H01L21/60 , H01L21/58 , H01L23/556
CPC分类号： H01L24/81 , H01L21/563 , H01L23/145 , H01L23/295 , H01L2224/13111 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/0105 , H01L2924/01082 , H01L2924/01092 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , Y10T29/49144 , Y10T29/49146 , H01L2924/00
摘要： Solder interconnection whereby the gap created by solder connections between an organic substrate (2) and semiconductor device (1) is filled with a composition (7) obtained from curing a thermosetting preparation containing a thermosetting binder; and filler having a maximum particle size of 50 microns.
摘要翻译：焊接互连，由有机基板（2）和半导体器件（1）之间的焊料连接产生的间隙填充有由固化含有热固性粘合剂的热固性制剂获得的组合物（7）和最大粒度为50微米的填料。

5. 发明授权

EP0622125B1 Fluid treatment apparatus 失效
标题翻译：装置治疗对象的液体的
公开(公告)号：EP0622125B1
公开(公告)日：1998-02-11
申请号：EP94105025.4
申请日：1994-03-30
申请人： International Business Machines Corporation
发明人： Bard, Steven Lindz , Bendz, Gerald Andrei , Canestaro, Michael James , Chapura, John Robert , Frankoski, Edward Jay , Horan, Michael Shawn , Jones, Jeffrey Donald , Kamperman, James Steven , Kjelgaard, John Robert, Jr. , McCreary, Jack Marlyn
IPC分类号： B05B15/04 , H05K3/00
CPC分类号： H05K3/0085 , B05B14/00 , Y02P70/36
摘要： A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article (11) and thereafter collected within the apparatus' common housing (13). The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injectors, each including at least two rows of fluid jet injectors (27) therein. The collected fluids are each returned to the respective impingement means (23, 41). Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occuring within the same housing chamber which serves to collect the first fluid.

6. 发明授权

EP0546285B1 Electronic package assembly with protective encapsulant material 失效
标题翻译：电子组装与封装材料保护
公开(公告)号：EP0546285B1
公开(公告)日：1997-06-11
申请号：EP92117863.8
申请日：1992-10-19
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Bonitz, Barry Alan , Ellerson, James Vernon , Kapur, Kishen Narain , McCreary, Jack Marlyn , Memis, Irving , Vettel, Gerald Michael
IPC分类号： H05K3/28 , H01L21/00 , H05K13/00
CPC分类号： H05K3/284 , H01L2224/48247 , H01L2224/48472 , H05K3/3421 , H05K2201/10689 , H05K2201/10977 , Y02P70/613 , Y10T29/49144 , Y10T29/49146 , H01L2924/00

7. 发明公开

EP0544076A3 Reworkable module and method of fabricating the module 失效
标题翻译：可重复使用的模块和制造该模块的方法
公开(公告)号：EP0544076A3
公开(公告)日：1994-03-23
申请号：EP92116514.8
申请日：1992-09-26
申请人： International Business Machines Corporation
发明人： Grebe, Kurt Rudolph , McCreary, Jack Marlyn , Suryanarayana, Darbha , Tong, Ho-Ming
IPC分类号： H01L21/58 , H01L21/60 , H05K3/30
CPC分类号： H01L24/81 , H01L21/563 , H01L23/3135 , H01L2224/73203 , H01L2224/81801 , H01L2224/8192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K3/284 , Y10T29/49144 , Y10T29/49146 , H01L2924/00
摘要： Disclosed is a reworkable circuit package (1) formed by controlled collapse chip connection ("C4") bonding of integrated circuit chips (21) to circuit cards and boards (11), and direct chip attachment ("DCA") where an encapsulant (61) is disposed under the chip (21). The encapsulant (61) offers protection of the C4 connections and a thermal expansion matched to that of the C4 joints. The disclosed circuit package (1) overcomes the problem of non-reworkability by the provision of a passivating layer (51) of Parylene which is reworkable, dry processable, uniformly depositable by vapor phase deposition. Thin films on facing surfaces are formed with the 3-5 micron film thickness corresponding to the C4 lift-off distance.
摘要翻译：公开了通过集成电路芯片（21）到电路卡和电路板（11）的受控塌陷芯片连接（“C4”）接合以及直接芯片附接（“DCA”）形成的可再加工电路封装（1），其中密封剂 61）设置在芯片（21）下方。密封剂（61）提供C4连接的保护和与C4连接相匹配的热膨胀。所公开的电路封装（1）通过提供可再加工，可干加工，可通过气相沉积均匀沉积的派瑞林钝化层（51）克服了不可再加工性的问题。面向表面上的薄膜形成有对应于C4剥离距离的3-5微米膜厚度。

8. 发明公开

EP0546285A1 Electronic package assembly with protective encapsulant material 失效
标题翻译： Elektronische Baugruppe mitschützendemVerkapselungmaterial。
公开(公告)号：EP0546285A1
公开(公告)日：1993-06-16
申请号：EP92117863.8
申请日：1992-10-19
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Bonitz, Barry Alan , Ellerson, James Vernon , Kapur, Kishen Narain , McCreary, Jack Marlyn , Memis, Irving , Vettel, Gerald Michael
IPC分类号： H05K3/28 , H01L21/00 , H05K13/00
CPC分类号： H05K3/284 , H01L2224/48247 , H01L2224/48472 , H05K3/3421 , H05K2201/10689 , H05K2201/10977 , Y02P70/613 , Y10T29/49144 , Y10T29/49146 , H01L2924/00
摘要： An electronic package assembly (10) wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (11) (e.g., printed circuit board), the projecting conductive leads (21) of the package and the solder (53) which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with encapsulant material (61) (e.g., polymer resin) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder. The invention has particular useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.
摘要翻译：一种电子封装组件（10），其中薄型封装焊接到有机（例如环氧树脂）衬底（11）（例如印刷电路板）上，封装的突出导电引线（21）和焊料（53 ），其基本上覆盖基本上被密封剂材料（61）（例如，聚合物树脂）覆盖的这些引线（以及基板上的各个导体），以为焊料引线连接提供加强。在焊料回流和固化之后，密封剂材料围绕焊料和引线接头分配，以便基本上围绕焊料，并且引线的任何部分未被焊料覆盖。本发明对于在衬底表面上占据最小高度的薄的小外形封装（TSOP）结构特别有用。

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