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1. 发明公开

EP0243793A2 Hydraulic manifold for water cooling of multi-chip electric modules 失效
标题翻译： Hydraulischer ZusammenbaufürdieWasserkühlungvon elektrischen Mehrchip-Modulen。
公开(公告)号：EP0243793A2
公开(公告)日：1987-11-04
申请号：EP87105555.4
申请日：1987-04-14
申请人： International Business Machines Corporation
发明人： Flint, Ephraim Bemis , Grebe, Kurt Rudolph
IPC分类号： H01L23/473
CPC分类号： H01L23/4332 , H01L2924/0002 , H01L2924/00
摘要： A manifold (30) for conducting coolant to a set of heat exchangers (26) mounted on individual electric circuit chips (22) of a circuit module (20) is formed of a solid body containing fluid passages terminating in apertures, the manifold being provided with a set of hollow flexible appendages (44) connected to the apertures for conducting coolant to ports of the heat exchangers. The body (40) is formed of two sections, one section (54) having channels machined therein to serve as the fluid passages, and a second (56) section having the apertures. The second section also is bounded by sidewalls which define a cavity (60). The appendages are formed by a lost wax molding operation wherein the wax is stored in the cavity, and milled to form a mold for the appendages. A plastic material is deposited on the wax mold and on the second section of the body to form the set of appendages, the plastic material being of a type which can be deposited by the process of chemical vapor deposition, thereby to provide a conformal deposition which imparts a water-tight characteristic to the manifold.
摘要翻译：用于将冷却剂引导到安装在电路模块（20）的各个电路芯片（22）上的一组热交换器（26）的歧管（30）由固体体形成，该固体包含终止于孔中的流体通道，所述歧管设置具有连接到孔的一组中空柔性附件（44），用于将冷却剂引导到热交换器的端口。主体（40）由两部分形成，一个部分（54）具有加工在其中的通道用作流体通道，以及具有孔的第二部分（56）。第二部分也由限定空腔（60）的侧壁界定。附件是通过失蜡模制操作形成的，其中将蜡储存在空腔中，并研磨以形成用于附件的模具。将塑料材料沉积在蜡模上和主体的第二部分上以形成一组附件，该塑料材料是可以通过化学气相沉积工艺沉积的类型，从而提供一种共形沉积对歧管施加防水特性。

2. 发明公开

EP0243793A3 Hydraulic manifold for water cooling of multi-chip electric modules 失效
标题翻译：用于多芯片电模块水冷的液压控制
公开(公告)号：EP0243793A3
公开(公告)日：1988-01-07
申请号：EP87105555
申请日：1987-04-14
申请人： International Business Machines Corporation
发明人： Flint, Ephraim Bemis , Grebe, Kurt Rudolph
IPC分类号： H01L23/46
CPC分类号： H01L23/4332 , H01L2924/0002 , H01L2924/00
摘要： A manifold (30) for conducting coolant to a set of heat exchangers (26) mounted on individual electric circuit chips (22) of a circuit module (20) is formed of a solid body containing fluid passages terminating in apertures, the manifold being provided with a set of hollow flexible appendages (44) connected to the apertures for conducting coolant to ports of the heat exchangers. The body (40) is formed of two sections, one section (54) having channels machined therein to serve as the fluid passages, and a second (56) section having the apertures. The second section also is bounded by sidewalls which define a cavity (60). The appendages are formed by a lost wax molding operation wherein the wax is stored in the cavity, and milled to form a mold for the appendages. A plastic material is deposited on the wax mold and on the second section of the body to form the set of appendages, the plastic material being of a type which can be deposited by the process of chemical vapor deposition, thereby to provide a conformal deposition which imparts a water-tight characteristic to the manifold.

3. 发明公开

EP0544076A3 Reworkable module and method of fabricating the module 失效
标题翻译：可重复使用的模块和制造该模块的方法
公开(公告)号：EP0544076A3
公开(公告)日：1994-03-23
申请号：EP92116514.8
申请日：1992-09-26
申请人： International Business Machines Corporation
发明人： Grebe, Kurt Rudolph , McCreary, Jack Marlyn , Suryanarayana, Darbha , Tong, Ho-Ming
IPC分类号： H01L21/58 , H01L21/60 , H05K3/30
CPC分类号： H01L24/81 , H01L21/563 , H01L23/3135 , H01L2224/73203 , H01L2224/81801 , H01L2224/8192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K3/284 , Y10T29/49144 , Y10T29/49146 , H01L2924/00
摘要： Disclosed is a reworkable circuit package (1) formed by controlled collapse chip connection ("C4") bonding of integrated circuit chips (21) to circuit cards and boards (11), and direct chip attachment ("DCA") where an encapsulant (61) is disposed under the chip (21). The encapsulant (61) offers protection of the C4 connections and a thermal expansion matched to that of the C4 joints. The disclosed circuit package (1) overcomes the problem of non-reworkability by the provision of a passivating layer (51) of Parylene which is reworkable, dry processable, uniformly depositable by vapor phase deposition. Thin films on facing surfaces are formed with the 3-5 micron film thickness corresponding to the C4 lift-off distance.
摘要翻译：公开了通过集成电路芯片（21）到电路卡和电路板（11）的受控塌陷芯片连接（“C4”）接合以及直接芯片附接（“DCA”）形成的可再加工电路封装（1），其中密封剂 61）设置在芯片（21）下方。密封剂（61）提供C4连接的保护和与C4连接相匹配的热膨胀。所公开的电路封装（1）通过提供可再加工，可干加工，可通过气相沉积均匀沉积的派瑞林钝化层（51）克服了不可再加工性的问题。面向表面上的薄膜形成有对应于C4剥离距离的3-5微米膜厚度。

4. 发明公开

EP0069189A2 Fluxless soldering process 失效
标题翻译： FlussmittellosesLötverfahren。
公开(公告)号：EP0069189A2
公开(公告)日：1983-01-12
申请号：EP82100714.3
申请日：1982-02-02
申请人： International Business Machines Corporation
发明人： Grebe, Kurt Rudolph , Harper, James McKell Edwin
IPC分类号： B23K17/00 , B23K1/20 , H01L21/60
CPC分类号： H01L24/81 , B23K1/005 , B23K1/206 , B23K17/00 , B23K2201/40 , C23G5/00 , H01L21/4864 , H01L2224/75 , H01L2224/75102 , H01L2224/7901 , H01L2224/81014 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15787 , H05K3/3489 , H01L2924/00
摘要： A method of fluxlessly joining members e.g. solder pads, having relatively low melting materials is described. The members to be joined are exposed in a non-oxydising atmosphere to ion beam radiation of sufficient intensity and for a time sufficiently long to cause cleaning of the low melting materials by removal of contaminating surface oxide layers. The members are then placed into juxtaposition with each other and are heated for a time sufficient to cause reflow of the low melting materials which upon cooling joins said members. The members may be heated conventionally or may be exposed again to an ion beam radiation to effect joining. In a second example, contacting members are cleaned and reflowed in a single step by exposure to an ion beam radiation, In the Figure an ion beam 28 impinges on solder pads 32 on a chip 30 and on matching solder pads 38 on a substrate 36. After cleaning the pads the chip 30 is flipped on to the substrate 36, (indicated by the arrow), and further heated, e.g. by further radiation, to effect joining by solder reflow.
摘要翻译：一种无阻力地连接构件的方法，例如描述了具有相对较低熔化材料的焊盘。要结合的构件在非氧化气氛中暴露于足够强度的离子束辐射，并且持续足够长的时间以通过去除污染表面氧化物层来清洁低熔点材料。然后将构件彼此并置放置，并且被加热足够的时间以引起在冷却结合所述构件时低熔点材料的回流。这些构件可以被常规加热，或者可以再次暴露于离子束辐射以进行接合。在第二个实例中，通过暴露于离子束辐射，接触构件被清洁并在一个步骤中回流。在图中，离子束28撞击芯片30上的焊盘32和衬底36上的匹配焊盘38.在清洁焊盘之后，芯片30被翻转到衬底36上（由箭头指示）和进一步加热，例如通过进一步的辐射，通过焊料回流实现接合。

5. 发明公开

EP0544076A2 Reworkable module and method of fabricating the module 失效
标题翻译： UmarbeitungsfähigerModul und Verfahren zu seiner Herstellung。
公开(公告)号：EP0544076A2
公开(公告)日：1993-06-02
申请号：EP92116514.8
申请日：1992-09-26
申请人： International Business Machines Corporation
发明人： Grebe, Kurt Rudolph , McCreary, Jack Marlyn , Suryanarayana, Darbha , Tong, Ho-Ming
IPC分类号： H01L21/58 , H01L21/60 , H05K3/30
CPC分类号： H01L24/81 , H01L21/563 , H01L23/3135 , H01L2224/73203 , H01L2224/81801 , H01L2224/8192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K3/284 , Y10T29/49144 , Y10T29/49146 , H01L2924/00
摘要： Disclosed is a reworkable circuit package (1) formed by controlled collapse chip connection ("C4") bonding of integrated circuit chips (21) to circuit cards and boards (11), and direct chip attachment ("DCA") where an encapsulant (61) is disposed under the chip (21). The encapsulant (61) offers protection of the C4 connections and a thermal expansion matched to that of the C4 joints. The disclosed circuit package (1) overcomes the problem of non-reworkability by the provision of a passivating layer (51) of Parylene which is reworkable, dry processable, uniformly depositable by vapor phase deposition. Thin films on facing surfaces are formed with the 3-5 micron film thickness corresponding to the C4 lift-off distance.
摘要翻译：公开了一种通过将集成电路芯片（21）与电路卡和电路板的控制崩溃芯片连接（“C4”）接合形成的可再加工电路封装（1），以及直接芯片附接（“DCA”），其中密封剂芯片。密封剂提供C4连接的保护和与C4接头相匹配的热膨胀。所公开的电路封装通过提供可再加工的，可干法处理的，通过气相沉积均匀沉积的Parylene钝化层来克服不可再加工性的问题。形成相对于C4剥离距离的3-5微米薄膜厚度的面对表面的薄膜。

6. 发明公开

EP0532898A2 Flex tape protective coating 失效
标题翻译： Schutzschichtfürein flexibles乐队。
公开(公告)号：EP0532898A2
公开(公告)日：1993-03-24
申请号：EP92113575.2
申请日：1992-08-10
申请人： International Business Machines Corporation
发明人： Feger, Claudius , Graham, Teresita Ordonez , Grebe, Kurt Rudolph , Lanzetta, Alphonso Philip , Liutkus, John Joseph , Matthew, Linda Carolyn , Palmer, Michael Jon , Tanner, Nelson Russell , Tong, Ho-Ming , Wilson, Charles Haile , Yeh, Helen Li
IPC分类号： H01L23/498 , H01L23/538
CPC分类号： H01L24/45 , H01L21/481 , H01L23/49572 , H01L23/49894 , H01L24/85 , H01L2224/056 , H01L2224/05644 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/351 , H05K3/0017 , H05K3/3452 , H05K3/363 , H05K2201/10681 , H05K2201/10977 , H05K2203/176 , Y10T29/49121 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/48 , H01L2924/0002 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A flexible tape such as TAB or FLEX tape (1) having conducting leads (5) extending in cantilevered fashion over an edge of a dielectric layer (3) preferably a flexible dielectric layer. A photosensitive dielectric coating (2) is disposed on the part of the leads which lie on the dielectric layer. The protective dielectric coating (7) is aligned to the edges of the dielectric layer by a self aligning technique. A liquid polymer is disposed on the dielectric layer. The protective dielectric layer prevents the formation of conductive dendrites bridging adjacent conductors. Without this protection dendrites form between adjacent conductors held at different potentials because of residual water on the dielectric layer which acts as an electrolyte resulting in metal being plated from one line onto another line which builds up as a dendrite which eventually shorts adjacent lines.
摘要翻译：诸如TAB或FLEX带的柔性带具有在电介质层的边缘上优选柔性介电层以悬臂方式延伸的导电引线。感光介电涂层设置在位于介电层上的引线部分上。保护电介质涂层通过自对准技术与电介质层的边缘对准。液体聚合物设置在电介质层上。保护介电层防止形成桥接相邻导体的导电枝晶。没有这种保护，相互导体之间的枝晶形状保持在不同的电位，因为电介质层上的残留水用作电解液，导致金属从一条线上电镀到另一条线上，而另一条线则最终形成相邻线的短路。

7. 发明公开

EP0037852A1 Connection for superconductive circuitry 失效
标题翻译： Verbindungfüreinen supraleitenden Schaltkreis。
公开(公告)号：EP0037852A1
公开(公告)日：1981-10-21
申请号：EP80107224.0
申请日：1980-11-20
申请人： International Business Machines Corporation
发明人： Ames, Irving , Anacker, Wilhelm , Grebe, Kurt Rudolph , Kircher, Charles John
IPC分类号： H01L39/02 , H01L39/22
CPC分类号： H01L24/10 , H01L23/53285 , H01L24/13 , H01L39/02 , H01L2224/05644 , H01L2224/05664 , H01L2224/13 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01049 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12033 , Y10S148/089 , Y10S505/874 , H01L2924/00 , H01L2924/00014
摘要： Circuit connection for electrical circuitry, and particularly superconducting circuits including Josephson tunnelling devices, wherein solder lands can be used to make electrical connection to electric lines without interdiffusion between the lines and the solder.
To avoid the interdiffusion problem, a laterally extending metallic layer (18) is used as a diffusion barrier between the solder land (28) and the electrical line (M) which can be a superconducting line. The diffusion layer is comprised of refractory metal and has a first portion electrically contacting the solder land and a second, laterally displaced portion, electrically contacting the electrical line. An insulating layer (22) on the diffusion barrier layer separates the solder land and the electrical line. In a specific embodiment, the diffusion barrier is comprised of niobium, and the solder is a low melting point alloy, typically comprised of indium, bismuth, and tin.
摘要翻译：电路的电路连接，特别是包括约瑟夫森隧道装置的超导电路，其中焊盘可用于与电线电连接，而线与焊料之间没有相互扩散。为了避免相互扩散问题，横向延伸的金属层（18）用作焊锡焊盘（28）和可以是超导线路的电线（M）之间的扩散阻挡层。扩散层由难熔金属组成，并且具有与锡焊接区电接触的第一部分和与电线电接触的第二横向移位部分。扩散阻挡层上的绝缘层（22）分离焊接区和电线。在一个具体实施方案中，扩散阻挡层由铌组成，焊料是低熔点合金，通常由铟，铋和锡组成。

8. 发明公开

EP0532898A3 Flex tape protective coating 失效
标题翻译：柔性胶带保护涂料
公开(公告)号：EP0532898A3
公开(公告)日：1993-07-21
申请号：EP92113575.2
申请日：1992-08-10
申请人： International Business Machines Corporation
发明人： Feger, Claudius , Graham, Teresita Ordonez , Grebe, Kurt Rudolph , Lanzetta, Alphonso Philip , Liutkus, John Joseph , Matthew, Linda Carolyn , Palmer, Michael Jon , Tanner, Nelson Russell , Tong, Ho-Ming , Wilson, Charles Haile , Yeh, Helen Li
IPC分类号： H01L23/498 , H01L23/538
CPC分类号： H01L24/45 , H01L21/481 , H01L23/49572 , H01L23/49894 , H01L24/85 , H01L2224/056 , H01L2224/05644 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/351 , H05K3/0017 , H05K3/3452 , H05K3/363 , H05K2201/10681 , H05K2201/10977 , H05K2203/176 , Y10T29/49121 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/48 , H01L2924/0002 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A flexible tape such as TAB or FLEX tape (1) having conducting leads (5) extending in cantilevered fashion over an edge of a dielectric layer (3) preferably a flexible dielectric layer. A photosensitive dielectric coating (2) is disposed on the part of the leads which lie on the dielectric layer. The protective dielectric coating (7) is aligned to the edges of the dielectric layer by a self aligning technique. A liquid polymer is disposed on the dielectric layer. The protective dielectric layer prevents the formation of conductive dendrites bridging adjacent conductors. Without this protection dendrites form between adjacent conductors held at different potentials because of residual water on the dielectric layer which acts as an electrolyte resulting in metal being plated from one line onto another line which builds up as a dendrite which eventually shorts adjacent lines.
摘要翻译：诸如TAB或FLEX带的柔性带具有在电介质层的边缘上优选柔性介电层以悬臂方式延伸的导电引线。感光介电涂层设置在位于介电层上的引线部分上。保护电介质涂层通过自对准技术与电介质层的边缘对准。液体聚合物设置在电介质层上。保护介电层防止形成桥接相邻导体的导电枝晶。没有这种保护，相互导体之间的枝晶形状保持在不同的电位，因为电介质层上的残留水用作电解液，导致金属从一条线上电镀到另一条线上，而另一条线则最终形成相邻线的短路。

9. 发明授权

EP0243793B1 Hydraulic manifold for water cooling of multi-chip electric modules 失效
标题翻译：用于多芯片电气模块水冷的液压控制
公开(公告)号：EP0243793B1
公开(公告)日：1992-07-15
申请号：EP87105555.4
申请日：1987-04-14
申请人： International Business Machines Corporation
发明人： Flint, Ephraim Bemis , Grebe, Kurt Rudolph
IPC分类号： H01L23/473
CPC分类号： H01L23/4332 , H01L2924/0002 , H01L2924/00

10. 发明授权

EP0069189B1 Fluxless soldering process 失效
标题翻译：无焊接工艺
公开(公告)号：EP0069189B1
公开(公告)日：1985-08-21
申请号：EP82100714.3
申请日：1982-02-02
申请人： International Business Machines Corporation
发明人： Grebe, Kurt Rudolph , Harper, James McKell Edwin
IPC分类号： B23K17/00 , B23K1/20 , H01L21/60
CPC分类号： H01L24/81 , B23K1/005 , B23K1/206 , B23K17/00 , B23K2201/40 , C23G5/00 , H01L21/4864 , H01L2224/75 , H01L2224/75102 , H01L2224/7901 , H01L2224/81014 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15787 , H05K3/3489 , H01L2924/00
摘要： A method of fluxlessly joining members e.g. solder pads, having relatively low melting materials is described. The members to be joined are exposed in a non-oxydising atmosphere to ion beam radiation of sufficient intensify and for a time sufficiently long to cause cleaning of the low melting materials by removal of contaminating surface oxide layers. The members are then placed into juxtaposition with each other and are heated for a time sufficient to cause reflow of the low melting materials which upon cooling joins said members. The members may be heated conventionally or may be exposed again to an ion beam radiation to effect joining. In a second example, contacting members are cleaned and reflowed in a single step by exposure to an ion beam radiation. In the Figure an ion beam 28 impinges on solder pads 32 on a chip 30 and on matching solder pads 38 on a substrate 36. After cleaning the pads the chip 30 is flipped on to the substrate 36, (indicated by the arrow), and further heated, e.g. by further radiation, to effect joining by solder reflow.

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